JP2021521634A5 - - Google Patents

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Publication number
JP2021521634A5
JP2021521634A5 JP2020555026A JP2020555026A JP2021521634A5 JP 2021521634 A5 JP2021521634 A5 JP 2021521634A5 JP 2020555026 A JP2020555026 A JP 2020555026A JP 2020555026 A JP2020555026 A JP 2020555026A JP 2021521634 A5 JP2021521634 A5 JP 2021521634A5
Authority
JP
Japan
Prior art keywords
light
emitting device
insulating material
backplane
dimensional array
Prior art date
Application number
JP2020555026A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2019199547A5 (https=
JP2021521634A (ja
JP7212061B2 (ja
Filing date
Publication date
Priority claimed from US15/949,514 external-priority patent/US10707190B2/en
Application filed filed Critical
Publication of JP2021521634A publication Critical patent/JP2021521634A/ja
Publication of JPWO2019199547A5 publication Critical patent/JPWO2019199547A5/ja
Publication of JP2021521634A5 publication Critical patent/JP2021521634A5/ja
Application granted granted Critical
Publication of JP7212061B2 publication Critical patent/JP7212061B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2020555026A 2018-04-10 2019-04-03 平坦な接合面を有するｌｅｄバックプレーンおよびその製造方法 Active JP7212061B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/949,514 2018-04-10
US15/949,514 US10707190B2 (en) 2018-04-10 2018-04-10 LED backplane having planar bonding surfaces and method of making thereof
PCT/US2019/025622 WO2019199547A1 (en) 2018-04-10 2019-04-03 Led backplane having planar bonding surfaces and method of making thereof

Publications (4)

Publication Number Publication Date
JP2021521634A JP2021521634A (ja) 2021-08-26
JPWO2019199547A5 JPWO2019199547A5 (https=) 2022-03-02
JP2021521634A5 true JP2021521634A5 (https=) 2022-03-02
JP7212061B2 JP7212061B2 (ja) 2023-01-24

Family

ID=68096113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020555026A Active JP7212061B2 (ja) 2018-04-10 2019-04-03 平坦な接合面を有するｌｅｄバックプレーンおよびその製造方法

Country Status (6)

Country Link
US (1) US10707190B2 (https=)
EP (1) EP3776655A4 (https=)
JP (1) JP7212061B2 (https=)
KR (1) KR102480160B1 (https=)
TW (1) TWI797305B (https=)
WO (1) WO2019199547A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI647835B (zh) * 2017-07-05 2019-01-11 英屬開曼群島商錼創科技股份有限公司 顯示面板
US11011669B2 (en) * 2019-10-14 2021-05-18 Shaoher Pan Integrated active-matrix light emitting pixel arrays based devices
JP7585109B2 (ja) * 2021-03-17 2024-11-18 株式会社ジャパンディスプレイ 表示装置及びその製造方法
TWI905744B (zh) * 2022-03-17 2025-11-21 晶元光電股份有限公司 半導體裝置的製造方法及半導體晶圓結構
TWI844832B (zh) * 2022-03-17 2024-06-11 晶元光電股份有限公司 半導體元件及半導體組件
TWI902449B (zh) * 2024-09-13 2025-10-21 晶呈科技股份有限公司 垂直覆晶式發光元件及垂直覆晶式發光元件製作方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3690340B2 (ja) 2001-03-06 2005-08-31 ソニー株式会社 半導体発光素子及びその製造方法
KR20110039313A (ko) * 2008-07-07 2011-04-15 글로 에이비 나노구조 ｌｅｄ
GB0819450D0 (en) 2008-10-23 2008-12-03 Cambridge Display Tech Ltd Oled driver chiplet integration
JP2011054805A (ja) * 2009-09-02 2011-03-17 Toshiba Corp 半導体装置、及び半導体装置の製造方法
US8241932B1 (en) * 2011-03-17 2012-08-14 Tsmc Solid State Lighting Ltd. Methods of fabricating light emitting diode packages
CN104335367A (zh) 2012-05-21 2015-02-04 株式会社Del 具有板上芯片封装型的封装基板的发光装置及其制造方法
JP5935557B2 (ja) * 2012-07-09 2016-06-15 ソニー株式会社 実装基板および光学装置
TWI505002B (zh) * 2013-02-05 2015-10-21 隆達電子股份有限公司 發光二極體顯示面板
US20160035924A1 (en) 2014-01-23 2016-02-04 Nthdegree Technologies Worldwide Inc. Configurable backplane interconnecting led tiles
US10910350B2 (en) 2014-05-24 2021-02-02 Hiphoton Co., Ltd. Structure of a semiconductor array
CN113035851B (zh) * 2014-06-18 2022-03-29 艾克斯展示公司技术有限公司 微组装led显示器
WO2016022824A1 (en) 2014-08-08 2016-02-11 Glo Ab Pixilated display device based upon nanowire leds and method for making the same
WO2016049507A1 (en) 2014-09-26 2016-03-31 Glo Ab Monolithic image chip for near-to-eye display
US10177123B2 (en) * 2014-12-19 2019-01-08 Glo Ab Light emitting diode array on a backplane and method of making thereof
EP3387882B1 (en) 2015-12-07 2021-05-12 Glo Ab Laser lift-off on isolated iii-nitride light islands for inter-substrate led transfer
DE102016103324A1 (de) * 2016-02-25 2017-08-31 Osram Opto Semiconductors Gmbh Videowand-Modul und Verfahren zum Herstellen eines Videowand-Moduls
US10153257B2 (en) * 2016-03-03 2018-12-11 X-Celeprint Limited Micro-printed display
WO2017175051A1 (en) 2016-04-04 2017-10-12 Glo Ab Through backplane laser irradiation for die transfer
KR102480220B1 (ko) * 2016-04-08 2022-12-26 삼성전자주식회사 발광 다이오드 모듈 및 이를 구비한 디스플레이 패널
WO2017180693A1 (en) 2016-04-15 2017-10-19 Glo Ab Method of forming an array of a multi-device unit cell
WO2017202331A1 (en) 2016-05-25 2017-11-30 Chen-Fu Chu Methods of filling organic or inorganic liquid in assembly module
US10177195B2 (en) 2016-09-30 2019-01-08 Intel Corporation Micro-LED displays
EP3559996B1 (en) * 2016-12-22 2021-03-24 Lumileds LLC Light emitting diodes with sensor segment for operational feedback

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