JP2021518673A5 - - Google Patents
Info
- Publication number
- JP2021518673A5 JP2021518673A5 JP2020550762A JP2020550762A JP2021518673A5 JP 2021518673 A5 JP2021518673 A5 JP 2021518673A5 JP 2020550762 A JP2020550762 A JP 2020550762A JP 2020550762 A JP2020550762 A JP 2020550762A JP 2021518673 A5 JP2021518673 A5 JP 2021518673A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- measurement module
- chamber
- substrate processing
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862645685P | 2018-03-20 | 2018-03-20 | |
| US62/645,685 | 2018-03-20 | ||
| PCT/US2019/022617 WO2019182916A1 (en) | 2018-03-20 | 2019-03-15 | Substrate processing tool with integrated metrology and method of using |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021518673A JP2021518673A (ja) | 2021-08-02 |
| JP2021518673A5 true JP2021518673A5 (https=) | 2022-03-16 |
| JP7295359B2 JP7295359B2 (ja) | 2023-06-21 |
Family
ID=67984323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020550762A Active JP7295359B2 (ja) | 2018-03-20 | 2019-03-15 | 統合的な計測を伴う基板処理ツール並びに使用方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US11264254B2 (https=) |
| JP (1) | JP7295359B2 (https=) |
| KR (1) | KR102655137B1 (https=) |
| CN (1) | CN112074939A (https=) |
| TW (1) | TWI848942B (https=) |
| WO (1) | WO2019182916A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3540767A1 (en) * | 2018-03-16 | 2019-09-18 | ASML Netherlands B.V. | Inspection system, lithographic apparatus, and inspection method |
| US11319449B2 (en) * | 2019-12-20 | 2022-05-03 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Area selective deposition of metal containing films |
| US20210202244A1 (en) * | 2019-12-30 | 2021-07-01 | Tokyo Electron Limited | High-throughput multi-stage manufacturing platform and method for processing a plurality of substrates |
| JP7353200B2 (ja) * | 2020-02-06 | 2023-09-29 | 東京エレクトロン株式会社 | 成膜方法 |
| US20240030037A1 (en) * | 2020-09-01 | 2024-01-25 | Adeka Corporation | Etching method |
| US12237158B2 (en) | 2020-11-24 | 2025-02-25 | Applied Materials, Inc. | Etch feedback for control of upstream process |
| JP2022091523A (ja) * | 2020-12-09 | 2022-06-21 | 東京エレクトロン株式会社 | 成膜方法 |
| US11996307B2 (en) * | 2020-12-23 | 2024-05-28 | Applied Materials, Inc. | Semiconductor processing tool platform configuration with reduced footprint |
| US11709477B2 (en) | 2021-01-06 | 2023-07-25 | Applied Materials, Inc. | Autonomous substrate processing system |
| JP7617769B2 (ja) * | 2021-02-25 | 2025-01-20 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理方法および基板処理装置 |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3965343B2 (ja) | 1994-08-19 | 2007-08-29 | 東京エレクトロン株式会社 | 処理装置 |
| US6203582B1 (en) | 1996-07-15 | 2001-03-20 | Semitool, Inc. | Modular semiconductor workpiece processing tool |
| US6605549B2 (en) * | 2001-09-29 | 2003-08-12 | Intel Corporation | Method for improving nucleation and adhesion of CVD and ALD films deposited onto low-dielectric-constant dielectrics |
| US6911400B2 (en) * | 2002-11-05 | 2005-06-28 | International Business Machines Corporation | Nonlithographic method to produce self-aligned mask, articles produced by same and compositions for same |
| US20040126482A1 (en) | 2002-12-31 | 2004-07-01 | Chih-I Wu | Method and structure for selective surface passivation |
| US20070264106A1 (en) * | 2003-11-10 | 2007-11-15 | Van Der Meulen Peter | Robotic components for semiconductor manufacturing |
| US20070196011A1 (en) * | 2004-11-22 | 2007-08-23 | Cox Damon K | Integrated vacuum metrology for cluster tool |
| US20070134821A1 (en) * | 2004-11-22 | 2007-06-14 | Randhir Thakur | Cluster tool for advanced front-end processing |
| US7601272B2 (en) * | 2005-01-08 | 2009-10-13 | Applied Materials, Inc. | Method and apparatus for integrating metrology with etch processing |
| JP2007088401A (ja) | 2005-08-25 | 2007-04-05 | Tokyo Electron Ltd | 基板処理装置，基板処理方法，プログラム，プログラムを記録した記録媒体 |
| US7566900B2 (en) * | 2005-08-31 | 2009-07-28 | Applied Materials, Inc. | Integrated metrology tools for monitoring and controlling large area substrate processing chambers |
| JP2009543355A (ja) * | 2006-07-03 | 2009-12-03 | アプライド マテリアルズ インコーポレイテッド | 進歩型フロントエンド処理のためのクラスターツール |
| US20080276867A1 (en) * | 2007-05-09 | 2008-11-13 | Jason Schaller | Transfer chamber with vacuum extension for shutter disks |
| JP2009064726A (ja) * | 2007-09-07 | 2009-03-26 | Tokyo Electron Ltd | 基板検査装置及び基板検査方法並びに記憶媒体 |
| KR20100106608A (ko) | 2008-01-31 | 2010-10-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 폐쇄 회로 ｍｏｃｖｄ 증착 제어 |
| JP2010169667A (ja) | 2008-12-26 | 2010-08-05 | Tokyo Electron Ltd | 金属膜の膜厚測定方法及び基板処理方法及び装置 |
| US7919335B2 (en) | 2009-04-20 | 2011-04-05 | Taiwan Semiconductor Manufacturing Co., Ltd. | Formation of shallow trench isolation using chemical vapor etch |
| US9324594B2 (en) | 2010-12-22 | 2016-04-26 | Brooks Automation, Inc. | Workpiece handling modules |
| US8954184B2 (en) | 2011-01-19 | 2015-02-10 | Tokyo Electron Limited | Tool performance by linking spectroscopic information with tool operational parameters and material measurement information |
| US20130129922A1 (en) * | 2011-11-21 | 2013-05-23 | Qualcomm Mems Technologies, Inc. | Batch processing for electromechanical systems and equipment for same |
| JP6594304B2 (ja) * | 2013-10-18 | 2019-10-23 | ブルックス オートメーション インコーポレイテッド | 処理装置 |
| CN105917019A (zh) | 2014-02-04 | 2016-08-31 | 应用材料公司 | 用于有机材料的蒸发源、具有用于有机材料的蒸发源的设备、具有带有用于有机材料的蒸发源的蒸发沉积设备的系统以及用于操作用于有机材料的蒸发源的方法 |
| US9419107B2 (en) | 2014-06-19 | 2016-08-16 | Applied Materials, Inc. | Method for fabricating vertically stacked nanowires for semiconductor applications |
| US10428421B2 (en) | 2015-08-03 | 2019-10-01 | Asm Ip Holding B.V. | Selective deposition on metal or metallic surfaces relative to dielectric surfaces |
| US10020204B2 (en) | 2016-03-10 | 2018-07-10 | Applied Materials, Inc. | Bottom processing |
| WO2017161236A1 (en) | 2016-03-17 | 2017-09-21 | Applied Materials, Inc. | Methods for gapfill in high aspect ratio structures |
| KR102463922B1 (ko) | 2016-03-21 | 2022-11-08 | 에스케이하이닉스 주식회사 | 미세 패턴 형성 방법 |
| US11081342B2 (en) * | 2016-05-05 | 2021-08-03 | Asm Ip Holding B.V. | Selective deposition using hydrophobic precursors |
| US10358715B2 (en) * | 2016-06-03 | 2019-07-23 | Applied Materials, Inc. | Integrated cluster tool for selective area deposition |
| US10068764B2 (en) * | 2016-09-13 | 2018-09-04 | Tokyo Electron Limited | Selective metal oxide deposition using a self-assembled monolayer surface pretreatment |
-
2019
- 2019-03-15 WO PCT/US2019/022617 patent/WO2019182916A1/en not_active Ceased
- 2019-03-15 KR KR1020207029987A patent/KR102655137B1/ko active Active
- 2019-03-15 US US16/355,579 patent/US11264254B2/en active Active
- 2019-03-15 JP JP2020550762A patent/JP7295359B2/ja active Active
- 2019-03-15 CN CN201980029771.4A patent/CN112074939A/zh active Pending
- 2019-03-19 TW TW108109231A patent/TWI848942B/zh active
-
2022
- 2022-02-28 US US17/682,202 patent/US11769677B2/en active Active
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