JP5929386B2 - 成膜装置内の金属膜のドライクリーニング方法 - Google Patents
成膜装置内の金属膜のドライクリーニング方法 Download PDFInfo
- Publication number
- JP5929386B2 JP5929386B2 JP2012065523A JP2012065523A JP5929386B2 JP 5929386 B2 JP5929386 B2 JP 5929386B2 JP 2012065523 A JP2012065523 A JP 2012065523A JP 2012065523 A JP2012065523 A JP 2012065523A JP 5929386 B2 JP5929386 B2 JP 5929386B2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- metal film
- diketone
- film
- cleaning method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000002184 metal Substances 0.000 title claims description 55
- 229910052751 metal Inorganic materials 0.000 title claims description 55
- 238000000034 method Methods 0.000 title claims description 32
- 238000005108 dry cleaning Methods 0.000 title claims description 22
- 238000004140 cleaning Methods 0.000 claims description 36
- QAMFBRUWYYMMGJ-UHFFFAOYSA-N hexafluoroacetylacetone Chemical group FC(F)(F)C(=O)CC(=O)C(F)(F)F QAMFBRUWYYMMGJ-UHFFFAOYSA-N 0.000 claims description 8
- SHXHPUAKLCCLDV-UHFFFAOYSA-N 1,1,1-trifluoropentane-2,4-dione Chemical compound CC(=O)CC(=O)C(F)(F)F SHXHPUAKLCCLDV-UHFFFAOYSA-N 0.000 claims description 5
- 125000005594 diketone group Chemical group 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 239000007789 gas Substances 0.000 description 51
- 238000005530 etching Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- 238000010790 dilution Methods 0.000 description 6
- 239000012895 dilution Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910003321 CoFe Inorganic materials 0.000 description 1
- 229910019233 CoFeNi Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000010668 complexation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000777 cunife Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910000889 permalloy Inorganic materials 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4405—Cleaning of reactor or parts inside the reactor by using reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5873—Removal of material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/12—Gaseous compositions
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
- C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
- C23G5/02—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents
- C23G5/032—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents using organic solvents containing oxygen-containing compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
本試験において、導入するクリーニングガスの総流量は500sccmであり、希釈ガスはN2とし、サンプル7A、7B、7C、7D、7Eを240℃、275℃、300℃、325℃、370℃に加熱した。
本試験において、導入するクリーニングガスの総流量は500sccmであり、希釈ガスはN2とし、サンプル7A、7B、7C、7D、7Eを240℃、275℃、300℃、325℃、370℃に加熱した。
21:β−ジケトン供給系
22:NOx供給系
23:希釈ガス供給系
31、32、33、34:バルブ
41、42:ガス配管
5A、5B、5C、5D、5E: ヒーターステージ
61、62A、62B、62C、62D、62E:ヒーター
7A、7B、7C、7D、7E:サンプル
8 :真空ポンプ
Claims (5)
- 成膜装置に付着した金属膜をβ−ジケトンを用いて除去するドライクリーニング法において、β−ジケトンとNOを含むガスをクリーニングガスとして用いて、200℃〜400℃の温度範囲内である該金属膜と、該クリーニングガスを反応させることにより、該金属膜を除去することを特徴とする、ドライクリーニング方法。
- 成膜装置に付着した金属膜をβ−ジケトンを用いて除去するドライクリーニング法において、β−ジケトンとN 2 Oを、N 2 O/βジケトン体積比が0.02以上0.60以下で含むガスをクリーニングガスとして用いて、200℃〜400℃の温度範囲内である該金属膜と、該クリーニングガスを反応させることにより、該金属膜を除去することを特徴とする、ドライクリーニング方法。
- 前記β−ジケトンが、ヘキサフルオロアセチルアセトン又はトリフルオロアセチルアセトンであることを特徴とする、請求項1又は2に記載のドライクリーニング方法。
- 前記クリーニングガス中に、He、Ar、N2からなる群から選ばれる少なくとも1種類以上のガスが含有されていることを特徴とする請求項1から請求項3のいずれか1項に記載のドライクリーニング方法。
- 前記金属膜が、周期表の第6族から第11族までの少なくとも一種類以上の元素で構成されていることを特徴とする、請求項1から請求項4のいずれか1項に記載のドライクリーニング方法。
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012065523A JP5929386B2 (ja) | 2012-03-22 | 2012-03-22 | 成膜装置内の金属膜のドライクリーニング方法 |
US14/386,575 US20150047680A1 (en) | 2012-03-22 | 2013-02-20 | Method for Dry-Cleaning Metal Film in Film-Formation Apparatus |
KR1020167024772A KR20160110545A (ko) | 2012-03-22 | 2013-02-20 | 성막 장치 내의 금속막의 드라이클리닝 방법 |
PCT/JP2013/054177 WO2013140926A1 (ja) | 2012-03-22 | 2013-02-20 | 成膜装置内の金属膜のドライクリーニング方法 |
KR1020147026218A KR20140124858A (ko) | 2012-03-22 | 2013-02-20 | 성막 장치 내의 금속막의 드라이클리닝 방법 |
CN201380015350.9A CN104220632B (zh) | 2012-03-22 | 2013-02-20 | 成膜装置内的金属膜的干洗方法 |
KR1020177016719A KR20170072961A (ko) | 2012-03-22 | 2013-02-20 | 성막 장치 내의 금속막의 드라이클리닝 방법 |
EP13764235.1A EP2829629B1 (en) | 2012-03-22 | 2013-02-20 | Method for dry-cleaning metal film in film-formation apparatus |
TW102109528A TWI509064B (zh) | 2012-03-22 | 2013-03-18 | A dry cleaning method for a metal film in a film forming apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012065523A JP5929386B2 (ja) | 2012-03-22 | 2012-03-22 | 成膜装置内の金属膜のドライクリーニング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013194307A JP2013194307A (ja) | 2013-09-30 |
JP5929386B2 true JP5929386B2 (ja) | 2016-06-08 |
Family
ID=49222391
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012065523A Active JP5929386B2 (ja) | 2012-03-22 | 2012-03-22 | 成膜装置内の金属膜のドライクリーニング方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20150047680A1 (ja) |
EP (1) | EP2829629B1 (ja) |
JP (1) | JP5929386B2 (ja) |
KR (3) | KR20170072961A (ja) |
CN (1) | CN104220632B (ja) |
TW (1) | TWI509064B (ja) |
WO (1) | WO2013140926A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6777851B2 (ja) * | 2015-09-15 | 2020-10-28 | セントラル硝子株式会社 | ドライエッチング方法、半導体素子の製造方法及びチャンバークリーニング方法 |
JP2019054014A (ja) * | 2016-02-02 | 2019-04-04 | セントラル硝子株式会社 | エッチング方法及びエッチング装置 |
WO2018020822A1 (ja) * | 2016-07-26 | 2018-02-01 | セントラル硝子株式会社 | エッチング方法及びエッチング装置 |
WO2018026509A1 (en) | 2016-08-05 | 2018-02-08 | Applied Materials, Inc. | Aluminum fluoride mitigation by plasma treatment |
KR102308032B1 (ko) * | 2017-01-04 | 2021-10-05 | 샌트랄 글래스 컴퍼니 리미티드 | 드라이 에칭 방법 및 에칭 장치 |
US11335573B2 (en) | 2017-01-04 | 2022-05-17 | Cental Glass Company, Limited | Dry etching method and β-diketone-filled container |
JPWO2020179449A1 (ja) | 2019-03-01 | 2020-09-10 | ||
JP6854844B2 (ja) * | 2019-05-08 | 2021-04-07 | 東京エレクトロン株式会社 | エッチング方法及びエッチング装置 |
CN114026674A (zh) * | 2019-06-24 | 2022-02-08 | 朗姆研究公司 | 衬底表面的蒸气清洁 |
JPWO2021079624A1 (ja) | 2019-10-23 | 2021-04-29 | ||
CN117157735A (zh) * | 2021-04-28 | 2023-12-01 | 中央硝子株式会社 | 表面处理方法、干式蚀刻方法、清洁方法、半导体装置的制造方法及蚀刻装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01170471A (ja) | 1987-12-25 | 1989-07-05 | Terumo Corp | 中空糸膜型血液処理器及び製造方法 |
US5094701A (en) | 1990-03-30 | 1992-03-10 | Air Products And Chemicals, Inc. | Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same |
JP4049423B2 (ja) * | 1997-11-06 | 2008-02-20 | キヤノンアネルバ株式会社 | 成膜処理装置内の付着金属膜のクリーニング方法 |
US5993679A (en) * | 1997-11-06 | 1999-11-30 | Anelva Corporation | Method of cleaning metallic films built up within thin film deposition apparatus |
US6159859A (en) * | 1998-06-09 | 2000-12-12 | Air Products And Chemicals, Inc. | Gas phase removal of SiO2 /metals from silicon |
US6284052B2 (en) * | 1998-08-19 | 2001-09-04 | Sharp Laboratories Of America, Inc. | In-situ method of cleaning a metal-organic chemical vapor deposition chamber |
JP2001176807A (ja) | 1999-12-20 | 2001-06-29 | Hitachi Ltd | 半導体装置の製造装置、製造方法およびクリーニング方法 |
JP2001284330A (ja) * | 2000-03-31 | 2001-10-12 | Hitachi Ltd | 半導体装置の製造方法、及び製造装置 |
US6534413B1 (en) * | 2000-10-27 | 2003-03-18 | Air Products And Chemicals, Inc. | Method to remove metal and silicon oxide during gas-phase sacrificial oxide etch |
KR100799377B1 (ko) * | 2002-07-05 | 2008-01-30 | 동경 엘렉트론 주식회사 | 기판 처리 장치의 클리닝 방법 및 기판 처리 장치 |
US7485611B2 (en) * | 2002-10-31 | 2009-02-03 | Advanced Technology Materials, Inc. | Supercritical fluid-based cleaning compositions and methods |
JP4234135B2 (ja) * | 2003-02-13 | 2009-03-04 | 東京エレクトロン株式会社 | 基板処理装置のクリーニング方法 |
US20060196525A1 (en) * | 2005-03-03 | 2006-09-07 | Vrtis Raymond N | Method for removing a residue from a chamber |
JP2007270231A (ja) * | 2006-03-31 | 2007-10-18 | Tokyo Electron Ltd | 高圧処理装置用チャンバークリーニング方法、高圧処理装置及び記憶媒体 |
JP2009043973A (ja) * | 2007-08-09 | 2009-02-26 | Tokyo Electron Ltd | 半導体装置の製造方法、半導体基板の処理装置及び記憶媒体 |
TW201213594A (en) * | 2010-08-16 | 2012-04-01 | Air Liquide | Etching of oxide materials |
JP2012186190A (ja) * | 2011-03-03 | 2012-09-27 | Central Glass Co Ltd | ドライクリーニング方法 |
-
2012
- 2012-03-22 JP JP2012065523A patent/JP5929386B2/ja active Active
-
2013
- 2013-02-20 CN CN201380015350.9A patent/CN104220632B/zh active Active
- 2013-02-20 KR KR1020177016719A patent/KR20170072961A/ko not_active Application Discontinuation
- 2013-02-20 WO PCT/JP2013/054177 patent/WO2013140926A1/ja active Application Filing
- 2013-02-20 KR KR1020147026218A patent/KR20140124858A/ko active Application Filing
- 2013-02-20 EP EP13764235.1A patent/EP2829629B1/en not_active Not-in-force
- 2013-02-20 US US14/386,575 patent/US20150047680A1/en not_active Abandoned
- 2013-02-20 KR KR1020167024772A patent/KR20160110545A/ko active Application Filing
- 2013-03-18 TW TW102109528A patent/TWI509064B/zh active
Also Published As
Publication number | Publication date |
---|---|
EP2829629B1 (en) | 2017-05-03 |
KR20160110545A (ko) | 2016-09-21 |
TW201343907A (zh) | 2013-11-01 |
EP2829629A4 (en) | 2015-09-09 |
CN104220632A (zh) | 2014-12-17 |
TWI509064B (zh) | 2015-11-21 |
KR20170072961A (ko) | 2017-06-27 |
CN104220632B (zh) | 2016-09-28 |
WO2013140926A1 (ja) | 2013-09-26 |
JP2013194307A (ja) | 2013-09-30 |
US20150047680A1 (en) | 2015-02-19 |
EP2829629A1 (en) | 2015-01-28 |
KR20140124858A (ko) | 2014-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5929386B2 (ja) | 成膜装置内の金属膜のドライクリーニング方法 | |
TWI575599B (zh) | 乾式蝕刻方法、乾式蝕刻裝置、金屬膜及具備其之設備 | |
JP6974721B2 (ja) | ドライエッチング方法及び半導体デバイスの製造方法 | |
JP6997372B2 (ja) | ドライエッチング方法及びエッチング装置 | |
US10113235B2 (en) | Source gas supply unit, film forming apparatus and source gas supply method | |
JP5707144B2 (ja) | 基板処理装置のドライクリーニング方法及び金属膜の除去方法 | |
TWI612573B (zh) | 乾蝕刻方法、半導體元件之製造方法以及腔室清潔方法 | |
EP3933892A1 (en) | Dry etching method, method for manufacturing semiconductor device, and etching device | |
JP2012186190A (ja) | ドライクリーニング方法 | |
Chen et al. | The Challenges and Opportunities in Plasma Etching of Functionally Enhanced Complex Material Systems | |
WO2021079624A1 (ja) | ドライエッチング方法、半導体デバイスの製造方法及びエッチング装置 | |
KR20240038985A (ko) | 에칭 방법 및 반도체 소자의 제조 방법 | |
JPH0533117A (ja) | ステンレス鋼部材の表面処理方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20141224 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160209 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160224 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160405 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160418 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5929386 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |