JP2021515822A - 高屈折組成物、高屈折フィルム及び高屈折フィルムの製造方法 - Google Patents
高屈折組成物、高屈折フィルム及び高屈折フィルムの製造方法 Download PDFInfo
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- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- VUFQYRAKSQTZEB-UHFFFAOYSA-N bicyclo[2.2.1]heptan-4-amine Chemical compound C1CC2CCC1(N)C2 VUFQYRAKSQTZEB-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical group C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- FPODCVUTIPDRTE-UHFFFAOYSA-N bis(prop-2-enyl) hexanedioate Chemical compound C=CCOC(=O)CCCCC(=O)OCC=C FPODCVUTIPDRTE-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- QQKBIYRSRXCROF-UHFFFAOYSA-N cyclohexane-1,4-dithiol Chemical compound SC1CCC(S)CC1 QQKBIYRSRXCROF-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229920001002 functional polymer Polymers 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- GGKYLQOMQDHYEW-UHFFFAOYSA-N germyloxygermane Chemical compound [GeH3]O[GeH3] GGKYLQOMQDHYEW-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- SRJOCJYGOFTFLH-UHFFFAOYSA-N isonipecotic acid Chemical compound OC(=O)C1CCNCC1 SRJOCJYGOFTFLH-UHFFFAOYSA-N 0.000 description 1
- 239000003446 ligand Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- BEPGHZIEOVULBU-UHFFFAOYSA-N n,n'-diethylpropane-1,3-diamine Chemical compound CCNCCCNCC BEPGHZIEOVULBU-UHFFFAOYSA-N 0.000 description 1
- 229940094933 n-dodecane Drugs 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
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- AUONHKJOIZSQGR-UHFFFAOYSA-N oxophosphane Chemical compound P=O AUONHKJOIZSQGR-UHFFFAOYSA-N 0.000 description 1
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- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000002294 plasma sputter deposition Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 125000000446 sulfanediyl group Chemical group *S* 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
- TUUBOHWZSQXCSW-UHFFFAOYSA-N vanillic acid Natural products COC1=CC(O)=CC(C(O)=O)=C1 TUUBOHWZSQXCSW-UHFFFAOYSA-N 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L85/00—Compositions of macromolecular compounds obtained by reactions forming a linkage in the main chain of the macromolecule containing atoms other than silicon, sulfur, nitrogen, oxygen and carbon; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F110/00—Homopolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
- C08F110/02—Ethene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
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- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
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- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
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- Macromonomer-Based Addition Polymer (AREA)
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- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
本出願は、2018年9月20日に提出された大韓民国特許出願第10−2018−0113001号及び2018年9月20日に提出された大韓民国特許出願第10−2018−0112998号に基づく優先権の利益を主張し、該当韓国特許出願の文献に開示されたすべての内容は本明細書の一部として組み込まれる。
本出願は、高屈折組成物、高屈折フィルム、高屈折フィルムの製造方法に関する。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)(sigma−aldrich社製)と128mmolのマグネシウム(Mg)金属(sigma−aldrich社製)を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolの臭化ビニル(vinylbromide)(sigma−aldrich社製)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolの臭化ビニル(vinylbromide)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィー(column chromatography)を用いて酸化された生成物を除去した後、下記化学式Aの高屈折ポリマー(A)を得た。高屈折ポリマー(A)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(A)100重量部に対して光開始剤(Igarcure 184、Sigma−aldrich社製)を5重量部で添加して高屈折組成物(1)を製造した。
前記高屈折組成物(1)を石英基板(quartz plate)に塗布した後、バー(bar)コーティングした。次に、コーティングされた基板を100℃のホットプレート(hot plate)で1時間の間乾燥させた。その後、高屈折組成物にUV硬化機(H−bulb)を用いて約200nm〜350nm波長の紫外線を約2,000mJ/cm2の強度で照射して光硬化させることで高屈折フィルムを製造した。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)と128mmolのマグネシウム(Mg)金属を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolの臭化ビニル(vinylbromide)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolのブロモベンゼン(sigma−aldrich社製)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィーを用いて酸化された生成物を除去した後、下記化学式Bの高屈折ポリマー(B)を得た。高屈折ポリマー(B)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(B)100重量部に対して光開始剤(Igarcure 184、Sigma−aldrich社製)を5重量部で添加して高屈折組成物(2)を製造した。
高屈折組成物(1)を高屈折組成物(2)に変更したこと以外は、実施例1と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)と128mmolのマグネシウム(Mg)金属を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolの臭化ビニル(vinylbromide)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolのブロモブタン(bromobutane)(sigma−aldrich社製)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィーを用いて酸化された生成物を除去した後、下記化学式Cの高屈折ポリマー(C)を得た。高屈折ポリマー(C)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(C)100重量部に対して光開始剤(Igarcure 184、Sigma−aldrich社製)を5重量部で添加して高屈折組成物(3)を製造した。
高屈折組成物(1)を高屈折組成物(3)に変更したこと以外は、実施例1と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
実施例1で製造された高屈折ポリマー(A)2.4gとTMPTA(Trimethylolpropane triacrylate、sigma−aldrich社製)0.6gをトルエン3gにとかし(それぞれ40wt%と10wt%)、前記高屈折ポリマー(A)100重量部に対して光開始剤(Igarcure 184、Sigma−aldrich社製)を5重量部で添加して高屈折組成物(4)を製造した。
高屈折組成物(1)を高屈折組成物(4)に変更したこと以外は、実施例1と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
実施例1で製造された高屈折ポリマー(A)2.4gとジビニルベンゼン(divinylbenzen)(sigma−aldrich社製)0.6gをトルエン3gにとかし(それぞれ40wt%と10wt%)、前記高屈折ポリマー(A)100重量部に対して光開始剤(Igarcure 184、Sigma−aldrich社製)を5重量部で添加して高屈折組成物(5)を製造した。
高屈折組成物(1)を高屈折組成物(5)に変更したこと以外は、実施例1と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)(sigma−aldrich社製)と128mmolのマグネシウム(Mg)金属(sigma−aldrich社製)を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolのエピブロモヒドリン(epibromohydrin)(sigma−aldrich社製)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolのエピブロモヒドリン(epibromohydrin)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィー(column chromatography)を用いて酸化された生成物を除去した後、下記化学式Dの高屈折ポリマー(D)を得た。高屈折ポリマー(D)の収得は、1H−NMRで確認した。高屈折ポリマー(D)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(D)100重量部に対して熱開始剤としてイミダゾール系硬化剤(C11ZA、四国化成社製)を5重量部で添加して高屈折組成物(6)を製造した。
前記高屈折組成物(6)を石英基板(quartz plate)に塗布した後、バー(bar)コーティングした。次に、コーティングされた高屈折組成物に約180℃の温度で約30分間熱を印加して熱硬化させることで高屈折フィルムを製造した。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)と128mmolのマグネシウム(Mg)金属を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolのエピブロモヒドリン(epibromohydrin)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolのブロモベンゼン(bromobenzene)(sigma−aldrich社製)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィーを用いて酸化された生成物を除去した後、下記化学式Eの高屈折ポリマー(E)を得た。高屈折ポリマー(E)の収得は、1H−NMRで確認した。高屈折ポリマー(E)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(E)100重量部に対して熱開始剤としてイミダゾール系硬化剤(C11ZA、四国化成社製)を5重量部で添加して高屈折組成物(7)を製造した。
高屈折組成物(6)を高屈折組成物(7)に変更したこと以外は、実施例6と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
40ml THF(Tetrahydrofuran)に、16mmolの4塩化ゲルマニウム(germanium tetrachloride)と128mmolのマグネシウム(Mg)金属を入れた後、アルゴン(Ar)下で90分間反応させた。次に、16mmolのエピブロモヒドリン(epibromohydrin)を10℃でゆっくり滴下した。約60分間反応させた後、16mmolのブロモブタン(bromobutane)(sigma−aldrich社製)を滴下した後、50℃で2時間の間反応させた。室温で一日間混合物を混ぜた後にメタノールを入れた。カラムクロマトグラフィーを用いて酸化された生成物を除去した後、下記化学式Fの高屈折ポリマー(F)を得た。高屈折ポリマー(F)の収得は、1H−NMRで確認した。高屈折ポリマー(F)3gをトルエン3gにとかし(50wt%濃度)、前記高屈折ポリマー(F)100重量部に対して熱開始剤としてイミダゾール系硬化剤(C11ZA、四国化成社製)を5重量部で添加して高屈折組成物(8)を製造した。
高屈折組成物(6)を高屈折組成物(8)に変更したこと以外は、実施例6と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
Polycarbonate(sigma−aldrich社製)3gをトルエン3gにとかし(50wt%)、ジオキサン(dioxane)にとかして高屈折組成物(9)を製造した。
高屈折組成物(1)を高屈折組成物(9)に変更したこと以外は、実施例1と同一の方法で高屈折フィルムを製造した。
高屈折組成物の製造
70ml THF(Tetrahydrofuran)にbis(dimethylphenyl)digermoxane3.75g(0.01mol)(cimit社製)を入れてフラスコ内を窒素置換した。その後、反応生成物をトルエンで抽出して無水硫酸マグネシウムで乾燥した。次に、トルエンを除去した後、真空乾燥してdimethyl poly(Ge−O−Ge)を得た。dimethyl poly(Ge−O−Ge)3gをトルエン3gにとかして(50wt%)高屈折組成物(10)を製造した。
高屈折組成物(10)を石英基板(quartz plate)に塗布した後、バー(bar)コーティングした。次に、コーティングされた基板を100℃のホットプレート(hot plate)で1時間の間乾燥させて高屈折フィルムを製造した。
実施例1〜実施例8及び比較例1、比較例2で製造されたフィルムに対して、厚さ及び屈折率を測定し、その結果を下記表1に記載した。具体的に、厚さは、ellipsometry measurement(Elli−SE、エリプソテクノロジー社製)を用いて楕円計測方法で測定し、屈折率は、屈折率測定装置(SPA−3DR、SAIRON Tech.社製)を用いて632nm波長に対する屈折率を測定した。
Claims (15)
- 主鎖(main chain)としてゲルマニウム(Ge)元素を含む重合単位と
側鎖(side chain)として光反応性基又は熱反応性基を少なくとも2個以上含むポリマーを
含む、
高屈折組成物。 - 前記ポリマーの主鎖は、前記ゲルマニウム(Ge)元素をGe−Ge結合の形態で含む、
請求項1に記載の高屈折組成物。 - 前記光反応性基は、ビニル基、(メタ)アクリル基、(メタ)アクリロイルオキシ基、(メタ)アクリルアミド基、ビニルオキシ基又はマレイミド基を含む、
請求項1から3のいずれか1項に記載の高屈折組成物。 - 前記熱反応性基は、エポキシ基、オキセタン基、アルケニル基、ケイ素原子に結合された水素原子、イソシアネート基、ヒドロキシ基、フタロニトリル基又はカルボキシル基を含む、
請求項1から4のいずれか1項に記載の高屈折組成物。 - 前記高屈折組成物は、光硬化性モノマー又は熱硬化性モノマーをさらに含む、
請求項1から5のいずれか1項に記載の高屈折組成物。 - 前記光硬化性モノマーは、光硬化性基を少なくとも2個以上有する多官能性化合物であり、
前記熱硬化性モノマーは、熱硬化性基を少なくとも2個以上有する多官能性化合物である、
請求項6に記載の高屈折組成物。 - 前記光硬化性モノマー又は熱硬化性モノマーは、前記ポリマー100重量部に対して10〜50重量部で含まれる、
請求項6または7に記載の高屈折組成物。 - 光重合開始剤又は熱重合開始剤をさらに含む、
請求項1から8のいずれか1項に記載の高屈折組成物。 - 主鎖(main chain)としてゲルマニウム(Ge)元素を含む重合単位と
側鎖(side chain)として光反応性基又は熱反応性基を少なくとも2個以上含む
ポリマーを含む
高屈折組成物を硬化された状態で含む、
高屈折フィルム。 - 前記ポリマーの少なくとも2個以上の光反応性基は、互いに反応して結合された状態で存在するか、
少なくとも2個以上の熱反応性基は、互いに反応して結合された状態で存在する、
請求項10に記載の高屈折フィルム。 - 前記高屈折フィルムの632nm波長に対する屈折率が1.8以上である、
請求項10または11に記載の高屈折フィルム。 - 主鎖(main chain)としてゲルマニウム(Ge)元素を含む重合単位と側鎖(side chain)として光反応性基又は熱反応性基を少なくとも2個以上含むポリマーを含む高屈折組成物を基板上にコーティングするステップ及び
前記コーティングされた組成物に光を照射するか又は熱を印加するステップ
を含む、
高屈折フィルムの製造方法。 - 前記光の照射は、紫外線を500mJ/cm2〜5000mJ/cm2の強度で照射することで行われる、
請求項13に記載の高屈折フィルムの製造方法。 - 前記熱の印加は、30℃〜260℃の温度範囲で10分〜24時間の間行われる、
請求項13または14に記載の高屈折フィルムの製造方法。
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