JP2021513644A - 電力インタフェース - Google Patents
電力インタフェース Download PDFInfo
- Publication number
- JP2021513644A JP2021513644A JP2020541510A JP2020541510A JP2021513644A JP 2021513644 A JP2021513644 A JP 2021513644A JP 2020541510 A JP2020541510 A JP 2020541510A JP 2020541510 A JP2020541510 A JP 2020541510A JP 2021513644 A JP2021513644 A JP 2021513644A
- Authority
- JP
- Japan
- Prior art keywords
- elastic member
- connection terminal
- power interface
- flexible sheet
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Optics & Photonics (AREA)
- Measuring Leads Or Probes (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Control Of Eletrric Generators (AREA)
- Insulated Conductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (12)
- 支持部材と、
前記支持部材に固定されて、上下方向に弾性力を与えるための弾性部材と、
前記弾性部材の上に配置される第1の接続端子と、
前記第1の接続端子と電気的に接続される第2の接続端子と、
前記弾性部材の歪み範囲を制限するように、一方の側は前記弾性部材に固定され、他方の側は前記支持部材に固定される可撓性シートと、
を備え、
前記可撓性シートは、前記弾性部材及び支持部材にそれぞれ固定される領域を除く残りの領域において前記弾性部材及び支持部材と接触されないように配置される電力インタフェース。 - 前記第1の接続端子は、前記弾性部材の歪みにつれて移動自在となるように前記弾性部材の上に配置される請求項1に記載の電力インタフェース。
- 前記弾性部材は、前記支持部材上において直立するように長さ及び幅が決定される請求項1に記載の電力インタフェース。
- 前記可撓性シートは、前記第1の接続端子の移動につれて歪まされる請求項1に記載の電力インタフェース。
- 前記第1の接続端子及び第2の接続端子は、前記可撓性シートの上に所定の接触面積を有するパッド状に形成される請求項1に記載の電力インタフェース。
- 前記支持部材は、
前記可撓性シートの固定される位置が、前記弾性部材の固定される位置よりも上部となるように形成される段付き部を備える請求項1に記載の電力インタフェース。 - 前記可撓性シートは、
前記弾性部材の上端の外側において下向きに折り曲げられて形成される請求項1に記載の電力インタフェース。 - 前記弾性部材、第1の接続端子及び第2の接続端子はそれぞれ複数配備され、
前記複数の第1の接続端子は、前記複数の弾性部材の上にそれぞれ配置され、
前記複数の第2の接続端子は、前記複数の第1の接続端子とそれぞれ電気的に接続される請求項1に記載の電力インタフェース。 - 前記可撓性シートは、
前記複数の第1の接続端子の間においてそれぞれ少なくとも一部の領域が切り欠かれて形成される切欠部を備える請求項8に記載の電力インタフェース。 - 前記複数の第1の接続端子の移動範囲を制限するように前記複数の第1の接続端子同士をそれぞれ連結する可撓性連結シートをさらに備える請求項9に記載の電力インタフェース。
- 前記可撓性連結シートは、
前記複数の第1の接続端子同士間の長さよりも長く形成される請求項10に記載の電力インタフェース。 - 前記支持部材に固定されて、前記複数の第2の接続端子にそれぞれ試験電流を印加するためのプリント回路基板をさらに備える請求項8に記載の電力インタフェース。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0016201 | 2018-02-09 | ||
KR1020180016201A KR102447833B1 (ko) | 2018-02-09 | 2018-02-09 | 전력 인터페이스 |
PCT/KR2019/001548 WO2019156490A1 (ko) | 2018-02-09 | 2019-02-07 | 전력 인터페이스 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2021513644A true JP2021513644A (ja) | 2021-05-27 |
JPWO2019156490A5 JPWO2019156490A5 (ja) | 2022-01-17 |
JP7236444B2 JP7236444B2 (ja) | 2023-03-09 |
Family
ID=67549506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020541510A Active JP7236444B2 (ja) | 2018-02-09 | 2019-02-07 | 電力インタフェース |
Country Status (6)
Country | Link |
---|---|
US (1) | US11293943B2 (ja) |
JP (1) | JP7236444B2 (ja) |
KR (1) | KR102447833B1 (ja) |
CN (1) | CN111684289B (ja) |
TW (1) | TWI825070B (ja) |
WO (1) | WO2019156490A1 (ja) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4649339A (en) * | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
JPH0743384A (ja) * | 1993-07-30 | 1995-02-14 | Nippon Avionics Co Ltd | プローブ |
JPH09329625A (ja) * | 1996-06-12 | 1997-12-22 | Nec Corp | 基板検査装置 |
JPH1019991A (ja) * | 1996-07-09 | 1998-01-23 | Yokowo Co Ltd | 回路基板検査装置のテストヘッド |
JP2011106980A (ja) * | 2009-11-18 | 2011-06-02 | Advantest Corp | プローブカード |
JP2011133330A (ja) * | 2009-12-24 | 2011-07-07 | Ngk Insulators Ltd | 接続装置 |
Family Cites Families (24)
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JPH0782033B2 (ja) * | 1993-04-30 | 1995-09-06 | フレッシュクエストコーポレーション | プローブカード |
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JP3967835B2 (ja) | 1998-11-09 | 2007-08-29 | 株式会社日本マイクロニクス | 電気的接続装置 |
US7137830B2 (en) * | 2002-03-18 | 2006-11-21 | Nanonexus, Inc. | Miniaturized contact spring |
KR100546361B1 (ko) | 2003-08-08 | 2006-01-26 | 삼성전자주식회사 | 반도체 소자 검사장치의 포고 핀 및 그 운용방법 |
US7091729B2 (en) | 2004-07-09 | 2006-08-15 | Micro Probe | Cantilever probe with dual plane fixture and probe apparatus therewith |
TWI252925B (en) * | 2004-07-05 | 2006-04-11 | Yulim Hitech Inc | Probe card for testing a semiconductor device |
US7459795B2 (en) * | 2004-08-19 | 2008-12-02 | Formfactor, Inc. | Method to build a wirebond probe card in a many at a time fashion |
JP5123489B2 (ja) | 2006-04-07 | 2013-01-23 | 株式会社日本マイクロニクス | 電気的接続装置 |
JP4842049B2 (ja) | 2006-08-22 | 2011-12-21 | 株式会社日本マイクロニクス | プローブ組立体 |
MY152599A (en) * | 2007-02-14 | 2014-10-31 | Eles Semiconductor Equipment S P A | Test of electronic devices at package level using test boards without sockets |
JP5251819B2 (ja) * | 2009-10-09 | 2013-07-31 | 住友電装株式会社 | 雌端子金具 |
KR101162175B1 (ko) | 2011-05-06 | 2012-07-04 | 에이케이이노텍주식회사 | 반도체 테스트 소켓 |
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KR20160124347A (ko) * | 2015-04-17 | 2016-10-27 | 주식회사 이노글로벌 | 고주파 디바이스 테스트용 양방향 도전성 소켓, 고주파 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법 |
KR101721945B1 (ko) * | 2015-09-22 | 2017-04-04 | 주식회사 이노글로벌 | 반도체 테스트 소켓 및 그 제조방법 |
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-
2018
- 2018-02-09 KR KR1020180016201A patent/KR102447833B1/ko active IP Right Grant
-
2019
- 2019-02-01 TW TW108104313A patent/TWI825070B/zh active
- 2019-02-07 US US16/964,196 patent/US11293943B2/en active Active
- 2019-02-07 CN CN201980012021.6A patent/CN111684289B/zh active Active
- 2019-02-07 WO PCT/KR2019/001548 patent/WO2019156490A1/ko active Application Filing
- 2019-02-07 JP JP2020541510A patent/JP7236444B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4649339A (en) * | 1984-04-25 | 1987-03-10 | Honeywell Inc. | Integrated circuit interface |
JPH0743384A (ja) * | 1993-07-30 | 1995-02-14 | Nippon Avionics Co Ltd | プローブ |
JPH09329625A (ja) * | 1996-06-12 | 1997-12-22 | Nec Corp | 基板検査装置 |
JPH1019991A (ja) * | 1996-07-09 | 1998-01-23 | Yokowo Co Ltd | 回路基板検査装置のテストヘッド |
JP2011106980A (ja) * | 2009-11-18 | 2011-06-02 | Advantest Corp | プローブカード |
JP2011133330A (ja) * | 2009-12-24 | 2011-07-07 | Ngk Insulators Ltd | 接続装置 |
Also Published As
Publication number | Publication date |
---|---|
US11293943B2 (en) | 2022-04-05 |
JP7236444B2 (ja) | 2023-03-09 |
CN111684289B (zh) | 2023-03-31 |
TW201935779A (zh) | 2019-09-01 |
CN111684289A (zh) | 2020-09-18 |
WO2019156490A1 (ko) | 2019-08-15 |
US20210033641A1 (en) | 2021-02-04 |
TWI825070B (zh) | 2023-12-11 |
KR20190096582A (ko) | 2019-08-20 |
KR102447833B1 (ko) | 2022-09-27 |
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