JP2021510454A - ウェハプローバ - Google Patents
ウェハプローバ Download PDFInfo
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- JP2021510454A JP2021510454A JP2020532027A JP2020532027A JP2021510454A JP 2021510454 A JP2021510454 A JP 2021510454A JP 2020532027 A JP2020532027 A JP 2020532027A JP 2020532027 A JP2020532027 A JP 2020532027A JP 2021510454 A JP2021510454 A JP 2021510454A
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- 230000003028 elevating effect Effects 0.000 claims abstract description 100
- 230000036316 preload Effects 0.000 claims description 32
- 238000005259 measurement Methods 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000000523 sample Substances 0.000 description 22
- 230000007246 mechanism Effects 0.000 description 16
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000001174 ascending effect Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (15)
- ウェハを据え付けるチャック及び前記チャックを移動させたり回転させたりするウェハプロービングステージを有するウェハプローバにおいて、
前記ウェハプロービングステージは、
下プレートと、
前記下プレートの上部の表面に搭載された複数本の昇降柱と、
前記複数本の昇降柱の上端部に搭載される上プレートと、
を備え、
前記複数本の昇降柱のそれぞれは、上プレートと下プレートとの間を昇降するように構成され、
前記上プレートの高さ及び勾配は、前記昇降柱の高さに応じて調整されることを特徴とするウェハプローバ。 - 前記複数本の昇降柱は、互いにそれぞれ独立して駆動されるように構成されたことを特徴とする請求項1に記載のウェハプローバ。
- 前記複数本の昇降柱は、前記下プレートの上部の表面の中心点を基準として均一に離間して配置されたことを特徴とする請求項1に記載のウェハプローバ。
- 前記ウェハプロービングステージは、複数本の昇降柱の中心の位置の変化なしに上プレートの勾配のみを変化させる力勾配保持モジュールをさらに備えることを特徴とする請求項1に記載のウェハプローバ。
- 前記力勾配保持モジュールは、線状移動ガイドからなり、
前記線状移動ガイドは、
上プレートの下部面に当接する前記昇降柱の上端部のそれぞれに装着された線状移動(LM)ガイドブロックと、
前記上プレートの下部面に装着されるが、前記昇降柱の各ブロックと結合された線状移動(LM)ガイドレールと、
を備え、
前記昇降柱のいずれか一本が上下方向に移動すると、線状移動(LM)ガイドブロックが線状移動(LM)ガイドレールに沿って水平方向に移動することになって、昇降柱の中心の位置の変化なしに上プレートの勾配のみが変化することを特徴とする請求項4に記載のウェハプローバ。 - 前記ウェハプロービングステージは、
前記複数本の昇降柱のそれぞれに装着されて、各昇降柱に印加される荷重を感知する複数の荷重測定センサをさらに備えることを特徴とする請求項1に記載のウェハプローバ。 - 前記ウェハプローバは、
上プレートの下部面と昇降柱の上部面との間に配設された予圧調節モジュールをさらに備え、
前記荷重測定センサは、予圧調節モジュールの上部又は下部に搭載されることを特徴とする請求項6に記載のウェハプローバ。 - 前記予圧調節モジュールは、
ブロック下端に装着された予圧調整ねじと、
前記荷重測定センサの上部に装着されるが、上部面が球状を呈する球面ソケットと、
下部面は前記球面ソケットの上部面に装着され、前記予圧調整ねじに結合されたロックナットと、
前記ロックナットと前記球面ソケットの外周面に結合された予圧用板ばねと、
を備えて、
予圧用板ばねによりロックナットと球面ソケットが球接触予圧を与えることを特徴とする請求項7に記載のウェハプローバ。 - 前記ウェハプロービングステージの前記上プレートの上に前記チャックが配置されることを特徴とする請求項1に記載のウェハプローバ。
- 前記ウェハプロービングステージは、
前記下プレートを回転させるように構成された回転体モジュールをさらに備えることを特徴とする請求項1に記載のウェハプローバ。 - ウェハを据え付けるチャック及び前記チャックを移動させたり回転させたりするウェハプロービングステージを有するウェハプローバにおいて、
前記ウェハプロービングステージは、
下プレートと、
前記下プレートの上部の表面に搭載された3本の昇降柱と、
前記3本の昇降柱の上端部に搭載される上プレートと、
を備え、
前記3本の昇降柱のそれぞれは、上プレートと下プレートとの間を垂直方向に昇降するように構成され、
前記上プレートの高さ及び勾配は、前記昇降柱の高さに応じて調整されることを特徴とするウェハプローバ。 - 前記3本の昇降柱は、互いにそれぞれ独立して駆動されるように構成されたことを特徴とする請求項11に記載のウェハプローバ。
- 前記3本の昇降柱は、前記下プレートの上部の表面の中心点を基準として三角形状に均一に離間して配置されたことを特徴とする請求項11に記載のウェハプローバ。
- 前記ウェハプロービングステージは、3本の昇降柱の中心の位置の変化なしに上プレートの勾配のみを変化させる力勾配保持モジュールをさらに備えることを特徴とする請求項11に記載のウェハプローバ。
- 前記ウェハプロービングステージは、
前記3本の昇降柱のそれぞれに装着されて、各昇降柱に印加される荷重を感知する複数の荷重測定センサと、
上プレートの下部面と昇降柱の上部面との間に配設された予圧調節モジュールと、をさらに備え、
前記荷重測定センサは、予圧調節モジュールの上部又は下部に搭載されることを特徴とする請求項11に記載のウェハプローバ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0007106 | 2018-01-19 | ||
KR20180007106 | 2018-01-19 | ||
KR1020190005013A KR102142881B1 (ko) | 2018-01-19 | 2019-01-15 | 웨이퍼 프로버 |
PCT/KR2019/000573 WO2019143091A1 (ko) | 2018-01-19 | 2019-01-15 | 웨이퍼 프로버 |
KR10-2019-0005013 | 2019-01-15 |
Publications (2)
Publication Number | Publication Date |
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JP2021510454A true JP2021510454A (ja) | 2021-04-22 |
JP7177324B2 JP7177324B2 (ja) | 2022-11-24 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020532027A Active JP7177324B2 (ja) | 2018-01-19 | 2019-01-15 | ウェハプローバ |
Country Status (5)
Country | Link |
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US (1) | US11262380B2 (ja) |
JP (1) | JP7177324B2 (ja) |
KR (1) | KR102142881B1 (ja) |
CN (1) | CN111566798B (ja) |
TW (1) | TWI692059B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102522721B1 (ko) * | 2023-01-16 | 2023-04-17 | (주)네오스테크놀로지스 | 커브드 lm 오토 레벨링 장치 |
Families Citing this family (6)
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CN111128847B (zh) * | 2019-12-24 | 2023-03-21 | 北京北方华创微电子装备有限公司 | 承载装置及半导体加工设备 |
CN114136422A (zh) * | 2020-09-03 | 2022-03-04 | 长鑫存储技术有限公司 | 称重装置 |
CN112802784A (zh) * | 2021-02-01 | 2021-05-14 | 中环领先半导体材料有限公司 | 一种硅片去边机新型暂存台 |
CN114871876B (zh) * | 2021-12-13 | 2023-06-23 | 华海清科股份有限公司 | 一种晶圆磨削监测方法及监测系统 |
CN114927461B (zh) * | 2022-07-01 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 晶圆承载装置和半导体工艺设备 |
KR102476987B1 (ko) * | 2022-08-26 | 2022-12-13 | (주)에스에스피 | 평탄도 자동 보상이 가능한 볼 스크류 구동 웨이퍼 스테이지 장치 |
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-
2019
- 2019-01-15 KR KR1020190005013A patent/KR102142881B1/ko active IP Right Grant
- 2019-01-15 JP JP2020532027A patent/JP7177324B2/ja active Active
- 2019-01-15 CN CN201980006239.0A patent/CN111566798B/zh active Active
- 2019-01-15 US US16/960,635 patent/US11262380B2/en active Active
- 2019-01-17 TW TW108101789A patent/TWI692059B/zh active
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JPH0268879U (ja) * | 1988-11-10 | 1990-05-24 | ||
JPH05144892A (ja) * | 1991-10-22 | 1993-06-11 | Seiko Epson Corp | ウエハプローバ |
JP2000260852A (ja) * | 1999-03-11 | 2000-09-22 | Tokyo Electron Ltd | 検査ステージ及び検査装置 |
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KR102142881B1 (ko) | 2020-08-10 |
JP7177324B2 (ja) | 2022-11-24 |
US20200348335A1 (en) | 2020-11-05 |
US11262380B2 (en) | 2022-03-01 |
TW201937648A (zh) | 2019-09-16 |
CN111566798B (zh) | 2023-10-27 |
CN111566798A (zh) | 2020-08-21 |
TWI692059B (zh) | 2020-04-21 |
KR20190088888A (ko) | 2019-07-29 |
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