JP7177324B2 - ウェハプローバ - Google Patents
ウェハプローバ Download PDFInfo
- Publication number
- JP7177324B2 JP7177324B2 JP2020532027A JP2020532027A JP7177324B2 JP 7177324 B2 JP7177324 B2 JP 7177324B2 JP 2020532027 A JP2020532027 A JP 2020532027A JP 2020532027 A JP2020532027 A JP 2020532027A JP 7177324 B2 JP7177324 B2 JP 7177324B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- columns
- upper plate
- chuck
- wafer prober
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0491—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets for testing integrated circuits on wafers, e.g. wafer-level test cartridge
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
Claims (8)
- ウェハを据え付けるチャック及び前記チャックを移動させたり回転させたりするウェハプロービングステージを有するウェハプローバにおいて、
前記ウェハプロービングステージは、
下プレートと、
前記下プレートの上部の表面に搭載された複数本の昇降柱と、
前記複数本の昇降柱の上端部に搭載される上プレートと、
前記複数本の昇降柱の中心の位置の変化なしに前記上プレートの勾配のみを変化させる力勾配保持モジュールと、
前記複数本の昇降柱のそれぞれに装着されて、各昇降柱に印加される荷重を感知する複数の荷重測定センサと、
を備え、
前記複数本の昇降柱のそれぞれは、前記上プレートと前記下プレートとの間を昇降するように構成され、
前記上プレートの高さ及び勾配は、前記昇降柱の高さに応じて調整され、
前記複数本の昇降柱は、互いにそれぞれ独立して駆動されるように構成され、
前記ウェハプローバは、
前記上プレートの下部面と前記昇降柱の上部面との間に配設された予圧調節モジュールをさらに備え、
前記荷重測定センサは、前記予圧調節モジュールの上部又は下部に搭載される、
ことを特徴とするウェハプローバ。 - 前記複数本の昇降柱は、前記下プレートの上部の表面の中心点を基準として均一に離間して配置されたことを特徴とする請求項1に記載のウェハプローバ。
- 前記力勾配保持モジュールは、線状移動ガイドからなり、
前記線状移動ガイドは、
前記上プレートの下部面に当接する前記昇降柱の上端部のそれぞれに装着された線状移動(LM)ガイドブロックと、
前記上プレートの下部面に装着されるが、前記昇降柱の各ブロックと結合された線状移動(LM)ガイドレールと、
を備え、
前記昇降柱のいずれか一本が上下方向に移動すると、前記線状移動(LM)ガイドブロックが前記線状移動(LM)ガイドレールに沿って水平方向に移動することになって、前記昇降柱の中心の位置の変化なしに前記上プレートの勾配のみが変化することを特徴とする請求項1に記載のウェハプローバ。 - 前記予圧調節モジュールは、
ブロック下端に装着された予圧調整ねじと、
前記荷重測定センサの上部に装着されるが、上部面が球状を呈する球面ソケットと、
下部面は前記球面ソケットの上部面に装着され、前記予圧調整ねじに結合されたロックナットと、
前記ロックナットと前記球面ソケットの外周面に結合された予圧用板ばねと、
を備えて、
前記予圧用板ばねにより前記ロックナットと前記球面ソケットが球接触予圧を与えることを特徴とする請求項1に記載のウェハプローバ。 - 前記ウェハプロービングステージの前記上プレートの上に前記チャックが配置されることを特徴とする請求項1に記載のウェハプローバ。
- 前記ウェハプロービングステージは、
前記下プレートを回転させるように構成された回転体モジュールをさらに備えることを特徴とする請求項1に記載のウェハプローバ。 - ウェハを据え付けるチャック及び前記チャックを移動させたり回転させたりするウェハプロービングステージを有するウェハプローバにおいて、
前記ウェハプロービングステージは、
下プレートと、
前記下プレートの上部の表面に搭載された3本の昇降柱と、
前記3本の昇降柱の上端部に搭載される上プレートと、
前記3本の昇降柱の中心の位置の変化なしに前記上プレートの勾配のみを変化させる力勾配保持モジュールと、
前記3本の昇降柱のそれぞれに装着されて、各昇降柱に印加される荷重を感知する複数の荷重測定センサと、
前記上プレートの下部面と前記昇降柱の上部面との間に配設された予圧調節モジュールと、
を備え、
前記3本の昇降柱のそれぞれは、前記上プレートと前記下プレートとの間を垂直方向に昇降するように構成され、
前記上プレートの高さ及び勾配は、前記昇降柱の高さに応じて調整され、
前記3本の昇降柱は、互いにそれぞれ独立して駆動されるように構成され、
前記荷重測定センサは、予圧調節モジュールの上部又は下部に搭載される、
ことを特徴とするウェハプローバ。 - 前記3本の昇降柱は、前記下プレートの上部の表面の中心点を基準として三角形状に均一に離間して配置されたことを特徴とする請求項7に記載のウェハプローバ。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20180007106 | 2018-01-19 | ||
KR10-2018-0007106 | 2018-01-19 | ||
KR10-2019-0005013 | 2019-01-15 | ||
PCT/KR2019/000573 WO2019143091A1 (ko) | 2018-01-19 | 2019-01-15 | 웨이퍼 프로버 |
KR1020190005013A KR102142881B1 (ko) | 2018-01-19 | 2019-01-15 | 웨이퍼 프로버 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021510454A JP2021510454A (ja) | 2021-04-22 |
JP7177324B2 true JP7177324B2 (ja) | 2022-11-24 |
Family
ID=67480556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020532027A Active JP7177324B2 (ja) | 2018-01-19 | 2019-01-15 | ウェハプローバ |
Country Status (5)
Country | Link |
---|---|
US (1) | US11262380B2 (ja) |
JP (1) | JP7177324B2 (ja) |
KR (1) | KR102142881B1 (ja) |
CN (1) | CN111566798B (ja) |
TW (1) | TWI692059B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111128847B (zh) * | 2019-12-24 | 2023-03-21 | 北京北方华创微电子装备有限公司 | 承载装置及半导体加工设备 |
CN114136422A (zh) * | 2020-09-03 | 2022-03-04 | 长鑫存储技术有限公司 | 称重装置 |
CN112802784A (zh) * | 2021-02-01 | 2021-05-14 | 中环领先半导体材料有限公司 | 一种硅片去边机新型暂存台 |
CN114871876B (zh) * | 2021-12-13 | 2023-06-23 | 华海清科股份有限公司 | 一种晶圆磨削监测方法及监测系统 |
KR102678236B1 (ko) * | 2022-06-08 | 2024-06-25 | 주식회사 파인솔루션 | 기판 처리장치의 오토 레벨링 장치 |
CN114927461B (zh) * | 2022-07-01 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 晶圆承载装置和半导体工艺设备 |
KR102678243B1 (ko) * | 2022-07-04 | 2024-06-25 | 주식회사 파인솔루션 | 틸팅 구조를 포함한 기판 처리장치의 오토 레벨링 장치 |
KR102476987B1 (ko) * | 2022-08-26 | 2022-12-13 | (주)에스에스피 | 평탄도 자동 보상이 가능한 볼 스크류 구동 웨이퍼 스테이지 장치 |
KR102522721B1 (ko) * | 2023-01-16 | 2023-04-17 | (주)네오스테크놀로지스 | 커브드 lm 오토 레벨링 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000260852A (ja) | 1999-03-11 | 2000-09-22 | Tokyo Electron Ltd | 検査ステージ及び検査装置 |
JP2004291156A (ja) | 2003-03-27 | 2004-10-21 | Sumitomo Heavy Ind Ltd | クランプ装置及びそれを備えたチルト機能付き鉛直方向駆動位置決め装置 |
US20050127898A1 (en) | 2002-08-07 | 2005-06-16 | Haruhiko Yoshioka | Stage driving apparatus and probe method |
JP2007035669A (ja) | 2005-07-22 | 2007-02-08 | Nikon Corp | ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法 |
JP2008128357A (ja) | 2006-11-21 | 2008-06-05 | Hiihaisuto Seiko Kk | 多自由度球面軸受 |
JP2012051054A (ja) | 2010-08-31 | 2012-03-15 | Hiihaisuto Seiko Kk | 位置決めテーブル |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH054855Y2 (ja) * | 1988-11-10 | 1993-02-08 | ||
JPH05144892A (ja) * | 1991-10-22 | 1993-06-11 | Seiko Epson Corp | ウエハプローバ |
TW399279B (en) * | 1997-05-08 | 2000-07-21 | Tokyo Electron Limtied | Prober and probe method |
JP2000249185A (ja) | 1999-02-26 | 2000-09-12 | Fujita Corp | アクティブ型除振装置 |
JP4659328B2 (ja) * | 2002-10-21 | 2011-03-30 | 東京エレクトロン株式会社 | 被検査体を温度制御するプローブ装置 |
US7417714B2 (en) * | 2004-11-02 | 2008-08-26 | Nikon Corporation | Stage assembly with measurement system initialization, vibration compensation, low transmissibility, and lightweight fine stage |
US7607647B2 (en) * | 2007-03-20 | 2009-10-27 | Kla-Tencor Technologies Corporation | Stabilizing a substrate using a vacuum preload air bearing chuck |
KR101089593B1 (ko) | 2009-06-09 | 2011-12-05 | 주식회사 쎄믹스 | 척의 기구적 강성을 보완한 웨이퍼 프로버 스테이션 및 그 제어방법 |
DE202010003817U1 (de) * | 2010-03-18 | 2010-07-29 | Cascade Microtech Dresden Gmbh | Prober für On-Water-Messungen unter EMI-Abschirmung |
JP5529605B2 (ja) | 2010-03-26 | 2014-06-25 | 東京エレクトロン株式会社 | ウエハチャックの傾き補正方法及びプローブ装置 |
KR101150672B1 (ko) * | 2010-06-21 | 2012-05-25 | 세크론 주식회사 | 솔더 전사 장치 및 이를 이용한 솔더 전사 방법 |
KR101242633B1 (ko) | 2011-07-19 | 2013-03-20 | 주식회사 쎄믹스 | 향상된 기구적 강성을 갖는 수평수직 이동기구 |
JP6436090B2 (ja) * | 2013-10-30 | 2018-12-12 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
JP6789048B2 (ja) * | 2016-09-23 | 2020-11-25 | 株式会社Screenホールディングス | 基板処理装置 |
KR101794602B1 (ko) | 2017-01-26 | 2017-11-07 | 주식회사 쎄믹스 | 헥사포드 구조를 이용한 척 이송 장치 |
-
2019
- 2019-01-15 JP JP2020532027A patent/JP7177324B2/ja active Active
- 2019-01-15 KR KR1020190005013A patent/KR102142881B1/ko active IP Right Grant
- 2019-01-15 US US16/960,635 patent/US11262380B2/en active Active
- 2019-01-15 CN CN201980006239.0A patent/CN111566798B/zh active Active
- 2019-01-17 TW TW108101789A patent/TWI692059B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000260852A (ja) | 1999-03-11 | 2000-09-22 | Tokyo Electron Ltd | 検査ステージ及び検査装置 |
US20050127898A1 (en) | 2002-08-07 | 2005-06-16 | Haruhiko Yoshioka | Stage driving apparatus and probe method |
JP2004291156A (ja) | 2003-03-27 | 2004-10-21 | Sumitomo Heavy Ind Ltd | クランプ装置及びそれを備えたチルト機能付き鉛直方向駆動位置決め装置 |
JP2007035669A (ja) | 2005-07-22 | 2007-02-08 | Nikon Corp | ウェハ搬送装置、ウェハ積層体搬送装置及び積層型半導体装置製造方法 |
JP2008128357A (ja) | 2006-11-21 | 2008-06-05 | Hiihaisuto Seiko Kk | 多自由度球面軸受 |
JP2012051054A (ja) | 2010-08-31 | 2012-03-15 | Hiihaisuto Seiko Kk | 位置決めテーブル |
Also Published As
Publication number | Publication date |
---|---|
KR20190088888A (ko) | 2019-07-29 |
TWI692059B (zh) | 2020-04-21 |
CN111566798A (zh) | 2020-08-21 |
US11262380B2 (en) | 2022-03-01 |
CN111566798B (zh) | 2023-10-27 |
TW201937648A (zh) | 2019-09-16 |
US20200348335A1 (en) | 2020-11-05 |
JP2021510454A (ja) | 2021-04-22 |
KR102142881B1 (ko) | 2020-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP7177324B2 (ja) | ウェハプローバ | |
US5861759A (en) | Automatic probe card planarization system | |
KR101258101B1 (ko) | 프로브 카드 | |
JP3715160B2 (ja) | プロービング装置及び半導体素子の製造方法 | |
US6677771B2 (en) | Probe contact system having planarity adjustment mechanism | |
KR102402669B1 (ko) | 접속 구조체 및 접속 구조체 모듈, 및 이를 이용하는 프로브 카드 어셈블리 및 웨이퍼 테스트 장치 | |
KR102122459B1 (ko) | 웨이퍼 테스트 장치 | |
TW200941610A (en) | Inspection apparatus | |
JP2004071909A (ja) | 載置台の駆動装置及びプローブ装置 | |
JP4836684B2 (ja) | 検査ステージ及び検査装置 | |
US20080030212A1 (en) | Active probe contact array management | |
WO2019143091A1 (ko) | 웨이퍼 프로버 | |
JP2016085203A (ja) | 電子部品ハンドリング装置及び電子部品試験装置 | |
JPH0936188A (ja) | プローブ装置に用いられるプローブカードデバイス | |
JP4246010B2 (ja) | 検査装置 | |
KR101794602B1 (ko) | 헥사포드 구조를 이용한 척 이송 장치 | |
JP4878918B2 (ja) | プローバ及びプロービング方法 | |
JP3902747B2 (ja) | プローブ装置 | |
JP6854419B2 (ja) | プローバ | |
JP2002184823A (ja) | プローブ装置 | |
JP2019102591A (ja) | プローバ及びプローブ検査方法 | |
JP7045631B2 (ja) | プローバ及びプローブ検査方法 | |
KR101228099B1 (ko) | 척에 대한 평탄도 외부조정장치 및 이를 구비하는 프로버 | |
JP2022084772A (ja) | プローバ | |
JP5086872B2 (ja) | 電子部品測定装置の測子の接触機構及びそれを用いた電子部品測定装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20200702 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210318 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20210811 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20210907 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20211206 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220510 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220810 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20221004 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20221019 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7177324 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |