JP2021505959A5 - - Google Patents

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JP2021505959A5
JP2021505959A5 JP2020531119A JP2020531119A JP2021505959A5 JP 2021505959 A5 JP2021505959 A5 JP 2021505959A5 JP 2020531119 A JP2020531119 A JP 2020531119A JP 2020531119 A JP2020531119 A JP 2020531119A JP 2021505959 A5 JP2021505959 A5 JP 2021505959A5
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Japan
Prior art keywords
layer
pattern
features
measurement system
overlay
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JP2020531119A
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English (en)
Japanese (ja)
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JP7118152B2 (ja
JP2021505959A (ja
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Priority claimed from US16/009,939 external-priority patent/US10474040B2/en
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JP2020531119A 2017-12-07 2018-12-06 デバイスに関連付けられたオーバーレイの計測のためのシステムおよび方法 Active JP7118152B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762595987P 2017-12-07 2017-12-07
US62/595,987 2017-12-07
US16/009,939 US10474040B2 (en) 2017-12-07 2018-06-15 Systems and methods for device-correlated overlay metrology
US16/009,939 2018-06-15
PCT/US2018/064145 WO2019113262A1 (en) 2017-12-07 2018-12-06 Systems and methods for device-correlated overlay metrology

Publications (3)

Publication Number Publication Date
JP2021505959A JP2021505959A (ja) 2021-02-18
JP2021505959A5 true JP2021505959A5 (https=) 2022-01-11
JP7118152B2 JP7118152B2 (ja) 2022-08-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020531119A Active JP7118152B2 (ja) 2017-12-07 2018-12-06 デバイスに関連付けられたオーバーレイの計測のためのシステムおよび方法

Country Status (8)

Country Link
US (1) US10474040B2 (https=)
EP (1) EP3721294B1 (https=)
JP (1) JP7118152B2 (https=)
KR (1) KR102435141B1 (https=)
CN (1) CN111433676B (https=)
SG (1) SG11202002413UA (https=)
TW (1) TWI781259B (https=)
WO (1) WO2019113262A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10964566B2 (en) * 2018-06-29 2021-03-30 Taiwan Semiconductor Manufacturing Go., Ltd. Machine learning on overlay virtual metrology
US11073768B2 (en) * 2019-06-26 2021-07-27 Kla Corporation Metrology target for scanning metrology
US11914290B2 (en) * 2019-07-24 2024-02-27 Kla Corporation Overlay measurement targets design
US11221561B2 (en) * 2020-01-14 2022-01-11 Kla Corporation System and method for wafer-by-wafer overlay feedforward and lot-to-lot feedback control
CN111458984A (zh) * 2020-03-13 2020-07-28 华中科技大学 一种套刻标记及测量配置的分步优化方法
CN115428139B (zh) * 2020-04-15 2024-04-12 科磊股份有限公司 可用于测量半导体装置偏移的具有装置级特征的偏移目标
US11300405B2 (en) * 2020-08-03 2022-04-12 Kla Corporation Grey-mode scanning scatterometry overlay metrology
US11556738B2 (en) * 2020-10-01 2023-01-17 Kla Corporation System and method for determining target feature focus in image-based overlay metrology
US11460783B2 (en) * 2021-01-07 2022-10-04 Kla Corporation System and method for focus control in extreme ultraviolet lithography systems using a focus-sensitive metrology target
US11703767B2 (en) 2021-06-28 2023-07-18 Kla Corporation Overlay mark design for electron beam overlay
US11862524B2 (en) 2021-06-28 2024-01-02 Kla Corporation Overlay mark design for electron beam overlay
US11720031B2 (en) 2021-06-28 2023-08-08 Kla Corporation Overlay design for electron beam and scatterometry overlay measurements
US12085385B2 (en) 2021-10-06 2024-09-10 Kla Corporation Design-assisted large field of view metrology
KR102755839B1 (ko) * 2021-10-21 2025-01-15 케이엘에이 코포레이션 개선된 오버레이 오차 계측을 위한 유도 변위
EP4202552B1 (en) 2021-12-24 2024-04-17 Imec VZW Method and structure for determining an overlay error
TWI809929B (zh) * 2022-04-08 2023-07-21 南亞科技股份有限公司 具有疊對標記的半導體元件結構
US12354970B2 (en) 2022-04-08 2025-07-08 Nanya Technology Corporation Semiconductor device structure with overlay mark
US12243832B2 (en) 2022-04-08 2025-03-04 Nanya Technology Corporation Method for manufacturing semiconductor device structure with overlay marks
US20240337952A1 (en) * 2023-04-04 2024-10-10 Kla Corporation System and method for determining overlay measurement of a scanning target
US20250297855A1 (en) * 2024-03-21 2025-09-25 Kla Corporation System and method for device-like overlay targets measurement

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW588414B (en) 2000-06-08 2004-05-21 Toshiba Corp Alignment method, overlap inspecting method and mask
JP5180419B2 (ja) 2000-08-30 2013-04-10 ケーエルエー−テンカー・コーポレーション 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US6432591B1 (en) * 2000-08-30 2002-08-13 Micron Technology, Inc. Overlay target design method with pitch determination to minimize impact of lens aberrations
US6486954B1 (en) * 2000-09-01 2002-11-26 Kla-Tencor Technologies Corporation Overlay alignment measurement mark
US20030002043A1 (en) 2001-04-10 2003-01-02 Kla-Tencor Corporation Periodic patterns and technique to control misalignment
US6949462B1 (en) * 2002-04-04 2005-09-27 Nanometrics Incorporated Measuring an alignment target with multiple polarization states
SG120958A1 (en) * 2002-11-01 2006-04-26 Asml Netherlands Bv Inspection method and device manufacturing method
WO2004090980A2 (en) * 2003-04-08 2004-10-21 Aoti Operating Company, Inc. Overlay metrology mark
DE10345466A1 (de) 2003-09-30 2005-04-28 Infineon Technologies Ag Verfahren zur Erfassung von Plazierungsfehlern von Schaltungsmustern bei der Übertragung mittels einer Maske in Schichten eines Substrats eines Halbleiterwafers
US7308368B2 (en) * 2004-09-15 2007-12-11 Asml Netherlands B.V. Method and apparatus for vibration detection, method and apparatus for vibration analysis, lithographic apparatus, device manufacturing method, and computer program
WO2007040855A1 (en) 2005-09-30 2007-04-12 Advanced Micro Devices, Inc. Structure and method for simultaneously determining an overlay accuracy and pattern placement error
DE102005046973B4 (de) * 2005-09-30 2014-01-30 Globalfoundries Inc. Struktur und Verfahren zum gleichzeitigen Bestimmen einer Überlagerungsgenauigkeit und eines Musteranordnungsfehlers
US8181327B2 (en) 2008-02-08 2012-05-22 Zephyros, Inc Mechanical method for improving bond joint strength
US8214317B2 (en) 2009-08-17 2012-07-03 Pratt & Whitney Rocketdyne, Inc. Failure detection system risk reduction assessment
US9052709B2 (en) 2010-07-30 2015-06-09 Kla-Tencor Corporation Method and system for providing process tool correctables
WO2012138758A1 (en) 2011-04-06 2012-10-11 Kla-Tencor Corporation Method and system for providing a quality metric for improved process control
US9097978B2 (en) 2012-02-03 2015-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus to characterize photolithography lens quality
US9188876B2 (en) * 2012-02-07 2015-11-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method of determining overlay error and control system for dynamic control of reticle position
US8860941B2 (en) * 2012-04-27 2014-10-14 Taiwan Semiconductor Manufacturing Co., Ltd. Tool induced shift reduction determination for overlay metrology
US9201312B2 (en) 2013-04-16 2015-12-01 Kla-Tencor Corporation Method for correcting position measurements for optical errors and method for determining mask writer errors
US9214317B2 (en) 2013-06-04 2015-12-15 Kla-Tencor Corporation System and method of SEM overlay metrology
TWI544288B (zh) * 2014-04-14 2016-08-01 台灣積體電路製造股份有限公司 疊對度量方法
WO2016124393A1 (en) * 2015-02-04 2016-08-11 Asml Netherlands B.V. Metrology method and apparatus, computer program and lithographic system
CN106325001B (zh) * 2015-07-10 2019-01-22 中芯国际集成电路制造(上海)有限公司 套刻精度补偿方法及装置
EP3171396A1 (en) * 2015-11-18 2017-05-24 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO Method of determining an overlay error, manufacturing method and system for manufacturing of a multilayer semiconductor device, and semiconductor device manufactured thereby
KR102357632B1 (ko) 2016-06-27 2022-01-28 케이엘에이 코포레이션 패턴 배치 및 패턴의 크기의 측정을 위한 장치 및 방법 그리고 이들의 컴퓨터 프로그램

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