JP2021141089A - コイル部品、回路基板及び電子機器 - Google Patents
コイル部品、回路基板及び電子機器 Download PDFInfo
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- 239000004020 conductor Substances 0.000 claims abstract description 54
- 239000000758 substrate Substances 0.000 claims description 99
- 230000002093 peripheral effect Effects 0.000 claims description 64
- 239000000696 magnetic material Substances 0.000 claims description 33
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- 230000006866 deterioration Effects 0.000 abstract description 8
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- 238000013210 evaluation model Methods 0.000 description 18
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
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- 238000000034 method Methods 0.000 description 12
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- 238000004088 simulation Methods 0.000 description 9
- 239000002131 composite material Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000005304 joining Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/245—Magnetic cores made from sheets, e.g. grain-oriented
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2847—Sheets; Strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/043—Printed circuit coils by thick film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Abstract
Description
10、110、210 磁性基体
21、22、121、122、221、222 外部電極
25、125、225 コイル導体
Ax コイル軸
E1、E2 エンドマージン
S1、S2 サイドマージン
Claims (11)
- 第1方向及び前記第1方向に直交する第2方向に延びており前記第1方向における第1寸法が前記第2方向における第2寸法よりも大きい第1面、前記第1面と対向する第2面、前記第1面の前記第1方向における端と前記第2面の前記第1方向における端とを接続する第3面、前記第3面に対向する第4面、前記第3面と前記第4面とを接続する第5面、及び前記第5面に対向する第6面を有し、磁性材料から成る基体と、
前記第1面及び前記第2面と交わるコイル軸の周りに延びる周回部を有するコイル導体と、
前記基体に設けられており、前記コイル導体の一端と電気的に接続された第1外部電極と、
前記基体に設けられており、前記コイル導体の他端と電気的に接続された第2外部電極と、
を備え、
前記周回部は、前記コイル軸の方向から見たときに、前記第3面と対向し前記第3面に向かって湾曲する第1部分、前記第4面と対向し前記第4面に向かって湾曲する第2部分、前記第1部分と前記第2部分とを接続し前記第5面と対向する第3部分、及び前記第1部分と前記第2部分とを接続し前記第6面と対向する第4部分を有し、
前記第1部分及び前記第2部分の曲率半径はいずれも前記第3部分及び前記第4部分の曲率半径よりも小さく、
前記コイル軸の方向から見たときに、前記第1部分と前記第3面との間の距離及び前記第2部分と前記第4面との距離はいずれも、前記第3部分と前記第5面との間の距離及び前記第4部分と前記第6面との距離よりも大きい、
コイル部品。 - 前記第1部分と前記第3面との間の距離及び前記第2部分と前記第4面との距離はいずれも、前記第3部分と前記第5面との間の距離及び前記第4部分と前記第6面との距離の1.5倍〜10倍の範囲にある、
請求項1に記載のコイル部品。 - 前記コイル軸の方向から見たときに、前記周回部の前記第1部分と前記第3面との間の距離は、前記周回部の前記第2部分と前記第4面との間の距離と実質的に等しい、
請求項1又は2に記載のコイル部品。 - 前記コイル軸の方向から見たときに、前記周回部の前記第3部分と前記第5面との間の距離は、前記周回部の前記第4部分と前記第6面との間の距離と実質的に等しい、
請求項1から3のいずれか1項に記載のコイル部品。 - 前記周回部は、均一な断面積を有する、請求項1から4のいずれか1項に記載のコイル部品。
- 前記第1外部電極は、前記コイル軸に沿って延びる第1引出部により前記周回部の一端と接続されている、
請求項1から5のいずれか1項に記載のコイル部品。 - 前記第2外部電極は、前記コイル軸に沿って延びる第2引出部fにより前記周回部の他端と接続されている、
請求項1から6のいずれか1項に記載のコイル部品。 - 前記コイル軸の方向から見た前記第1面の面積に対する前記コイル軸の方向から見た前記周回部の面積は、0.3以上である、
請求項1から7のいずれか1項に記載のコイル部品。 - 請求項1から8のいずれか1項に記載のコイル部品を備えるDC/DCコンバータ。
- 請求項1から8のいずれか1項に記載のコイル部品と、
前記外部電極にはんだにより接合されている実装基板と、
を備える回路基板。 - 請求項10に記載の回路基板を備える電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020034495A JP2021141089A (ja) | 2020-02-29 | 2020-02-29 | コイル部品、回路基板及び電子機器 |
CN202110210045.1A CN113327748A (zh) | 2020-02-29 | 2021-02-25 | 线圈部件、电路基板和电子设备 |
US17/186,994 US11551856B2 (en) | 2020-02-29 | 2021-02-26 | Coil component, circuit board, and electronic device |
US18/079,287 US11862387B2 (en) | 2020-02-29 | 2022-12-12 | Coil component, circuit board, and electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020034495A JP2021141089A (ja) | 2020-02-29 | 2020-02-29 | コイル部品、回路基板及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021141089A true JP2021141089A (ja) | 2021-09-16 |
Family
ID=77414400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020034495A Pending JP2021141089A (ja) | 2020-02-29 | 2020-02-29 | コイル部品、回路基板及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11551856B2 (ja) |
JP (1) | JP2021141089A (ja) |
CN (1) | CN113327748A (ja) |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3688429B2 (ja) * | 1997-04-25 | 2005-08-31 | 株式会社東芝 | 電子部品実装用基板および電子部品実装基板 |
JP2001344716A (ja) * | 2000-06-02 | 2001-12-14 | Sony Corp | 磁気抵抗効果型ヘッドの製造方法 |
JP4215495B2 (ja) * | 2002-01-10 | 2009-01-28 | 三洋電機株式会社 | 配線構造およびその製造方法ならびに配線構造を備えた半導体装置と配線基板 |
US7060364B2 (en) * | 2002-12-26 | 2006-06-13 | Mitsui Mining & Smelting Co., Ltd. | Film carrier tape for mounting electronic devices thereon |
CN103827991B (zh) * | 2011-09-07 | 2017-09-26 | Tdk株式会社 | 层叠型线圈部件 |
JP5974283B2 (ja) | 2012-07-06 | 2016-08-23 | パナソニックIpマネジメント株式会社 | インダクタの製造方法 |
KR20150033385A (ko) * | 2013-09-24 | 2015-04-01 | 삼성전기주식회사 | 적층형 인덕터 |
JP6502627B2 (ja) * | 2014-07-29 | 2019-04-17 | 太陽誘電株式会社 | コイル部品及び電子機器 |
JP6561745B2 (ja) * | 2015-10-02 | 2019-08-21 | 株式会社村田製作所 | インダクタ部品、パッケージ部品およびスィッチングレギュレータ |
JP6508126B2 (ja) * | 2016-05-26 | 2019-05-08 | 株式会社村田製作所 | コイル部品 |
JP6520875B2 (ja) * | 2016-09-12 | 2019-05-29 | 株式会社村田製作所 | インダクタ部品およびインダクタ部品内蔵基板 |
JP6822129B2 (ja) | 2016-12-21 | 2021-01-27 | 株式会社村田製作所 | 表面実装インダクタ |
JP6962284B2 (ja) * | 2018-07-17 | 2021-11-05 | 株式会社村田製作所 | インダクタ部品 |
JP7238318B2 (ja) * | 2018-10-09 | 2023-03-14 | 株式会社デンソー | 回転電機 |
JP7205365B2 (ja) * | 2019-04-19 | 2023-01-17 | 株式会社村田製作所 | コイル部品 |
JP7028219B2 (ja) * | 2019-04-19 | 2022-03-02 | 株式会社村田製作所 | コイル部品及びコイル部品の製造方法 |
US11676754B2 (en) * | 2019-04-19 | 2023-06-13 | Murata Manufacturing Co., Ltd. | Coil component |
-
2020
- 2020-02-29 JP JP2020034495A patent/JP2021141089A/ja active Pending
-
2021
- 2021-02-25 CN CN202110210045.1A patent/CN113327748A/zh active Pending
- 2021-02-26 US US17/186,994 patent/US11551856B2/en active Active
-
2022
- 2022-12-12 US US18/079,287 patent/US11862387B2/en active Active
Also Published As
Publication number | Publication date |
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US20210272744A1 (en) | 2021-09-02 |
US11551856B2 (en) | 2023-01-10 |
US20230106053A1 (en) | 2023-04-06 |
CN113327748A (zh) | 2021-08-31 |
US11862387B2 (en) | 2024-01-02 |
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