JP2021108329A - コイル部品、回路基板及び電子機器 - Google Patents
コイル部品、回路基板及び電子機器 Download PDFInfo
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- JP2021108329A JP2021108329A JP2019239031A JP2019239031A JP2021108329A JP 2021108329 A JP2021108329 A JP 2021108329A JP 2019239031 A JP2019239031 A JP 2019239031A JP 2019239031 A JP2019239031 A JP 2019239031A JP 2021108329 A JP2021108329 A JP 2021108329A
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- Prior art keywords
- conductor
- coil
- magnetic
- coil component
- substrate
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- 239000004020 conductor Substances 0.000 claims abstract description 410
- 239000000758 substrate Substances 0.000 claims description 121
- 230000002093 peripheral effect Effects 0.000 claims description 53
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 5
- 239000000696 magnetic material Substances 0.000 description 35
- 239000006249 magnetic particle Substances 0.000 description 27
- 230000004907 flux Effects 0.000 description 23
- 239000002184 metal Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 22
- 238000000465 moulding Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 7
- 239000000956 alloy Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 239000002131 composite material Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000007865 diluting Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910002796 Si–Al Inorganic materials 0.000 description 1
- 229910008458 Si—Cr Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/04—Arrangements of electric connections to coils, e.g. leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Dc-Dc Converters (AREA)
Abstract
Description
10、110、210 磁性基体
21、22、121、122、221、222 外部電極
25、125、225 コイル導体
25Aa1〜25Aa4、125Aa1〜125Aa4、225Aa1〜225Aa4 第1導体部
25Ab1〜25Ab3、125Ab1〜125Ab3、225Ab1〜225Ab3 第2導体部
Ax コイル軸
Claims (11)
- コイル軸に沿って延びる第1面と前記第1面に対向する第2面とを有する基体と、
前記基体に設けられた第1外部電極と、
前記基体に設けられた第2外部電極と、
前記第1外部電極及び前記第2外部電極と電気的に接続されており前記コイル軸の周りに延びるコイル導体と、
を備え、
前記コイル導体は、複数の第1導体部と前記第1導体部より少ない数の第2導体部とが交互に接続された周回部を有し、
前記第1導体部と前記第1面との距離は、前記第2導体部と前記第2面との距離よりも大きい、
コイル部品。 - 前記基体は、前記コイル軸に沿って延び前記第1面と前記第2面とを接続する第3面を有し、
前記コイル軸の方向から視て、前記第1面の寸法は前記第3面の寸法よりも大きく、前記コイル導体の前記第1面と平行な方向における寸法は、前記コイル導体の前記第3面に平行な方向における寸法よりも大きい、
請求項1に記載のコイル部品。 - 前記周回部は、5つの前記第1導体部及び4つの前記第2導体部を有する、
請求項1又は2に記載のコイル部品。 - 前記周回部は、4つの前記第1導体部及び3つの前記第2導体部を有する、
請求項1又は2に記載のコイル部品。 - 前記周回部は、3つの前記第1導体部及び2つの前記第2導体部を有する、
請求項1又は2に記載のコイル部品。 - 前記周回部は、2つの前記第1導体部及び1つの前記第2導体部を有する、
請求項1又は2に記載のコイル部品。 - 前記第2導体部と前記第2面との距離D2に対する前記複数の第1導体部と前記第1面との距離D1の比D1/D2は、1.2〜5.0の間の範囲にある、
請求項3〜6のいずれか1項に記載のコイル部品。 - 前記コイル導体は、前記第1導体部よりも1つだけ少ない数の前記第2導体部を有する、
請求項1〜7のいずれか1項に記載のコイル部品。 - 請求項1〜8のいずれか1項に記載のコイル部品を備えるDC/DCコンバータ。
- 請求項1〜8のいずれか1項に記載のコイル部品と、
前記外部電極にはんだにより接合されている前記実装基板と、
を備える回路基板。 - 請求項10に記載の回路基板を備える電子機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019239031A JP2021108329A (ja) | 2019-12-27 | 2019-12-27 | コイル部品、回路基板及び電子機器 |
US17/131,258 US20210202159A1 (en) | 2019-12-27 | 2020-12-22 | Coil component, circuit board, and electronic device |
CN202011563215.6A CN113053612A (zh) | 2019-12-27 | 2020-12-25 | 线圈部件、电路板和电子设备 |
US18/341,348 US20230335331A1 (en) | 2019-12-27 | 2023-06-26 | Method for manufacturing coil component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019239031A JP2021108329A (ja) | 2019-12-27 | 2019-12-27 | コイル部品、回路基板及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2021108329A true JP2021108329A (ja) | 2021-07-29 |
Family
ID=76508194
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019239031A Pending JP2021108329A (ja) | 2019-12-27 | 2019-12-27 | コイル部品、回路基板及び電子機器 |
Country Status (3)
Country | Link |
---|---|
US (2) | US20210202159A1 (ja) |
JP (1) | JP2021108329A (ja) |
CN (1) | CN113053612A (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008053754A (ja) * | 2007-11-08 | 2008-03-06 | Tdk Corp | コイル部品 |
JP2008091433A (ja) * | 2006-09-29 | 2008-04-17 | Tdk Corp | 積層型電子部品及びその製造方法 |
JP2015079931A (ja) * | 2013-10-14 | 2015-04-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型電子部品 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4610226B2 (ja) * | 2004-04-28 | 2011-01-12 | Tdk株式会社 | コイル部品 |
CN2726077Y (zh) * | 2004-07-02 | 2005-09-14 | 郑长茂 | 电感器 |
JP5084459B2 (ja) * | 2007-11-15 | 2012-11-28 | 太陽誘電株式会社 | インダクタ及びその製造方法 |
US20130300529A1 (en) * | 2012-04-24 | 2013-11-14 | Cyntec Co., Ltd. | Coil structure and electromagnetic component using the same |
JP6312997B2 (ja) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | コイル基板及びその製造方法、インダクタ |
KR101792364B1 (ko) * | 2015-12-18 | 2017-11-01 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
KR101830329B1 (ko) * | 2016-07-19 | 2018-02-21 | 주식회사 모다이노칩 | 파워 인덕터 |
JP6400803B2 (ja) * | 2016-10-28 | 2018-10-03 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | コイル部品 |
JP2018182209A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社村田製作所 | コイル部品 |
KR101994755B1 (ko) * | 2017-09-22 | 2019-09-24 | 삼성전기주식회사 | 전자부품 |
JP7246143B2 (ja) * | 2018-06-21 | 2023-03-27 | 太陽誘電株式会社 | 金属磁性粒子を含む磁性基体及び当該磁性基体を含む電子部品 |
JP2020077794A (ja) * | 2018-11-08 | 2020-05-21 | 株式会社村田製作所 | 表面実装インダクタ |
JP2020141041A (ja) * | 2019-02-28 | 2020-09-03 | Tdk株式会社 | コイル部品 |
KR102224308B1 (ko) * | 2019-11-07 | 2021-03-08 | 삼성전기주식회사 | 코일 부품 |
-
2019
- 2019-12-27 JP JP2019239031A patent/JP2021108329A/ja active Pending
-
2020
- 2020-12-22 US US17/131,258 patent/US20210202159A1/en active Pending
- 2020-12-25 CN CN202011563215.6A patent/CN113053612A/zh active Pending
-
2023
- 2023-06-26 US US18/341,348 patent/US20230335331A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008091433A (ja) * | 2006-09-29 | 2008-04-17 | Tdk Corp | 積層型電子部品及びその製造方法 |
JP2008053754A (ja) * | 2007-11-08 | 2008-03-06 | Tdk Corp | コイル部品 |
JP2015079931A (ja) * | 2013-10-14 | 2015-04-23 | サムソン エレクトロ−メカニックス カンパニーリミテッド. | 積層型電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US20210202159A1 (en) | 2021-07-01 |
US20230335331A1 (en) | 2023-10-19 |
CN113053612A (zh) | 2021-06-29 |
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