JP2021140144A5 - - Google Patents
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- JP2021140144A5 JP2021140144A5 JP2021015246A JP2021015246A JP2021140144A5 JP 2021140144 A5 JP2021140144 A5 JP 2021140144A5 JP 2021015246 A JP2021015246 A JP 2021015246A JP 2021015246 A JP2021015246 A JP 2021015246A JP 2021140144 A5 JP2021140144 A5 JP 2021140144A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- led chips
- micro led
- coupon
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims 57
- 238000000034 method Methods 0.000 claims 22
- 239000012790 adhesive layer Substances 0.000 claims 12
- 230000002950 deficient Effects 0.000 claims 6
- 238000000407 epitaxy Methods 0.000 claims 6
- 239000000853 adhesive Substances 0.000 claims 3
- 230000001070 adhesive effect Effects 0.000 claims 3
- 238000005401 electroluminescence Methods 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 238000005259 measurement Methods 0.000 claims 2
- 238000005424 photoluminescence Methods 0.000 claims 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- -1 polydimethylsiloxane Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 238000011179 visual inspection Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/805,911 US11348905B2 (en) | 2020-03-02 | 2020-03-02 | Method and system for assembly of micro-LEDs onto a substrate |
| US16/805,911 | 2020-03-02 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021140144A JP2021140144A (ja) | 2021-09-16 |
| JP2021140144A5 true JP2021140144A5 (https=) | 2024-02-13 |
| JP7514777B2 JP7514777B2 (ja) | 2024-07-11 |
Family
ID=74668620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021015246A Active JP7514777B2 (ja) | 2020-03-02 | 2021-02-02 | マイクロｌｅｄを基板に組み付けるための方法及びシステム |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11348905B2 (https=) |
| EP (1) | EP3876270B1 (https=) |
| JP (1) | JP7514777B2 (https=) |
| KR (1) | KR102804109B1 (https=) |
| CN (1) | CN113345878B (https=) |
| TW (1) | TWI858227B (https=) |
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| US11842989B2 (en) * | 2020-03-10 | 2023-12-12 | Meta Platforms Technologies, Llc | Integrating control circuits with light emissive circuits with dissimilar wafer sizes |
| TWI872235B (zh) * | 2020-03-30 | 2025-02-11 | 加拿大商弗瑞爾公司 | 微裝置轉移中之偏移對齊及修復 |
| US11677060B2 (en) * | 2020-04-13 | 2023-06-13 | Electronics and Teleocmmunications Research Institute | Method for transferring and bonding of devices |
| TW202310323A (zh) * | 2021-04-27 | 2023-03-01 | 日商昭和電工材料股份有限公司 | Led轉移構件及led裝置的製造方法 |
| US12263576B2 (en) | 2021-08-19 | 2025-04-01 | Hyundai Mobis Co., Ltd. | Robot system for automated assembly of modular component |
| CN115771214A (zh) * | 2021-09-09 | 2023-03-10 | 日月光半导体制造股份有限公司 | 用于形成多个分离组件的模具及装置 |
| KR20240070671A (ko) * | 2021-09-30 | 2024-05-21 | 보드 오브 리전츠, 더 유니버시티 오브 텍사스 시스템 | 픽앤플레이스 조립 툴 및 프로세스 |
| TWI807544B (zh) * | 2021-12-17 | 2023-07-01 | 友達光電股份有限公司 | 顯示面板及其製造方法 |
| KR102700929B1 (ko) * | 2021-12-21 | 2024-08-30 | 한국광기술원 | Led 측정장치 |
| CN114709163A (zh) * | 2022-03-30 | 2022-07-05 | 北京石油化工学院 | 液气双态Mini/Micro LED芯片巨量转移用晶膜及制作方法 |
| CN115101439B (zh) * | 2022-05-27 | 2025-05-02 | 黄招凤 | 物料传送系统及方法 |
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| CN117976569A (zh) * | 2022-10-25 | 2024-05-03 | 群创光电股份有限公司 | 电子装置及其制作方法 |
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| KR20260041820A (ko) * | 2023-07-18 | 2026-03-27 | 뷰리얼 인크. | 디스플레이 백플레인 상에 집적된 led를 갖는 칩렛 |
| TWI872659B (zh) * | 2023-08-23 | 2025-02-11 | 雷傑科技股份有限公司 | 晶粒填補方法 |
| CN121773762A (zh) * | 2023-09-11 | 2026-03-31 | 东京毅力科创株式会社 | 接合装置、接合系统、接合方法、换载装置以及换载方法 |
| TWI879346B (zh) * | 2023-12-26 | 2025-04-01 | 前源科技股份有限公司 | 電子元件的接合方法與巨量轉移電子元件的方法 |
| TWI890245B (zh) * | 2023-12-27 | 2025-07-11 | 錼創顯示科技股份有限公司 | 元件加工設備 |
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-
2020
- 2020-03-02 US US16/805,911 patent/US11348905B2/en active Active
-
2021
- 2021-01-29 TW TW110103438A patent/TWI858227B/zh active
- 2021-02-01 CN CN202110136931.4A patent/CN113345878B/zh active Active
- 2021-02-02 JP JP2021015246A patent/JP7514777B2/ja active Active
- 2021-02-09 KR KR1020210017940A patent/KR102804109B1/ko active Active
- 2021-02-17 EP EP21157734.1A patent/EP3876270B1/en active Active
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