JP2021077877A5 - - Google Patents
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- JP2021077877A5 JP2021077877A5 JP2020179891A JP2020179891A JP2021077877A5 JP 2021077877 A5 JP2021077877 A5 JP 2021077877A5 JP 2020179891 A JP2020179891 A JP 2020179891A JP 2020179891 A JP2020179891 A JP 2020179891A JP 2021077877 A5 JP2021077877 A5 JP 2021077877A5
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- objects
- substrate
- transfer elements
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 29
- 238000010438 heat treatment Methods 0.000 claims 10
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- -1 polydimethylsiloxane Polymers 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 4
- 230000014759 maintenance of location Effects 0.000 claims 3
- 229910002601 GaN Inorganic materials 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 2
- 229910004541 SiN Inorganic materials 0.000 claims 2
- 229910052681 coesite Inorganic materials 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 229910052906 cristobalite Inorganic materials 0.000 claims 2
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 229920001721 polyimide Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 230000002441 reversible effect Effects 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- 235000012239 silicon dioxide Nutrition 0.000 claims 2
- 229910052682 stishovite Inorganic materials 0.000 claims 2
- 239000010409 thin film Substances 0.000 claims 2
- 229910052905 tridymite Inorganic materials 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000004205 dimethyl polysiloxane Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 229920002635 polyurethane Polymers 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 230000007704 transition Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/681,215 US11302561B2 (en) | 2019-11-12 | 2019-11-12 | Transfer elements that selectably hold and release objects based on changes in stiffness |
| US16/681,215 | 2019-11-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021077877A JP2021077877A (ja) | 2021-05-20 |
| JP2021077877A5 true JP2021077877A5 (https=) | 2023-11-07 |
| JP7519267B2 JP7519267B2 (ja) | 2024-07-19 |
Family
ID=73039945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020179891A Active JP7519267B2 (ja) | 2019-11-12 | 2020-10-27 | 剛性の変化に基づいて物体を選択的に保持及び解放する移送要素 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11302561B2 (https=) |
| EP (1) | EP3823011B1 (https=) |
| JP (1) | JP7519267B2 (https=) |
| KR (1) | KR102647518B1 (https=) |
| CN (1) | CN112864046B (https=) |
| TW (1) | TWI845786B (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114141716A (zh) * | 2021-11-24 | 2022-03-04 | Tcl华星光电技术有限公司 | 显示面板的制备方法、显示面板及电子设备 |
| US20240170442A1 (en) * | 2022-11-18 | 2024-05-23 | Asmpt Singapore Pte. Ltd. | Hybrid bonding of a thin semiconductor die |
| CN117096085A (zh) * | 2023-01-17 | 2023-11-21 | 天马新型显示技术研究院(厦门)有限公司 | 转运基板及转运方法、显示面板 |
| KR20240123681A (ko) | 2023-02-07 | 2024-08-14 | 포항공과대학교 산학협력단 | 형상기억폴리머를 포함하는 마이크로 스탬프를 이용한 마이크로 잉크를 전사하는 방법 |
| KR20240139185A (ko) * | 2023-03-13 | 2024-09-23 | 한국기계연구원 | 고속 전사공정용 전사필름 및 이를 이용한 전사방법 |
| KR102788937B1 (ko) | 2023-11-07 | 2025-03-31 | 포항공과대학교 산학협력단 | 형상기억고분자 나노 팁 기반의 마이크로 잉크의 전사 방법 |
| KR102919872B1 (ko) | 2024-01-11 | 2026-01-28 | 포항공과대학교 산학협력단 | 빛을 이용한 전사 장치 및 이를 이용한 전사 방법 |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001088454A (ja) | 1999-09-27 | 2001-04-03 | Kuramoto Sangyo:Kk | 熱転写表示体および転写像形成方法 |
| US20040154733A1 (en) * | 2001-02-08 | 2004-08-12 | Thomas Morf | Chip transfer method and apparatus |
| JP2003332184A (ja) | 2002-05-13 | 2003-11-21 | Sony Corp | 素子の転写方法 |
| US7195733B2 (en) * | 2004-04-27 | 2007-03-27 | The Board Of Trustees Of The University Of Illinois | Composite patterning devices for soft lithography |
| US7959261B2 (en) * | 2007-05-08 | 2011-06-14 | Lexmark International, Inc. | Micro-fluid ejection devices having reduced input/output addressable heaters |
| US8198369B2 (en) * | 2008-08-05 | 2012-06-12 | GM Global Technology Operations LLC | Shape memory polymers with surface having dangling adhesive polymeric chains and methods of making and using the same |
| CN101656233B (zh) * | 2008-08-22 | 2012-10-24 | 群康科技(深圳)有限公司 | 薄膜晶体管基板的制造方法 |
| JP2010129700A (ja) * | 2008-11-26 | 2010-06-10 | Nitto Denko Corp | ダイシング・ダイボンドフィルム及び半導体装置の製造方法 |
| WO2011123285A1 (en) | 2010-03-29 | 2011-10-06 | Semprius, Inc. | Selective transfer of active components |
| KR100998087B1 (ko) | 2010-04-01 | 2010-12-03 | 한국기계연구원 | 능동 탈부착 척 |
| WO2013010113A1 (en) | 2011-07-14 | 2013-01-17 | The Board Of Trustees Of The University Of Illinois | Non-contact transfer printing |
| US9412727B2 (en) | 2011-09-20 | 2016-08-09 | Semprius, Inc. | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion |
| DE102012112965A1 (de) | 2012-12-21 | 2014-06-26 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gesellschaft Mit Beschränkter Haftung | Gegenstand mit schaltbarer Adhäsion |
| US10046353B2 (en) | 2014-06-06 | 2018-08-14 | The Board Of Trustees Of The University Of Illinois | Microscale stamp with reversible adhesion for transfer printing |
| CN117198903A (zh) * | 2014-07-20 | 2023-12-08 | 艾克斯展示公司技术有限公司 | 用于微转贴印刷的设备及方法 |
| US9698134B2 (en) | 2014-11-27 | 2017-07-04 | Sct Technology, Ltd. | Method for manufacturing a light emitted diode display |
| US20160175238A1 (en) * | 2014-12-19 | 2016-06-23 | L'oreal | Hair cosmetic composition containing a polyurethane latex polymer and a silicone-organic polymer compound |
| CN113410146A (zh) * | 2015-01-23 | 2021-09-17 | 维耶尔公司 | 到受体衬底的选择性微型器件转移 |
| CN107852794B (zh) | 2015-07-23 | 2020-03-10 | 首尔半导体株式会社 | 显示装置及其制造方法 |
| GB2541970B (en) | 2015-09-02 | 2020-08-19 | Facebook Tech Llc | Display manufacture |
| WO2017037475A1 (en) * | 2015-09-02 | 2017-03-09 | Oculus Vr, Llc | Assembly of semiconductor devices |
| US10252083B2 (en) * | 2015-09-23 | 2019-04-09 | Varian Medical Systems Inc. | Systems, methods, and devices for high-energy irradiation |
| TW202524641A (zh) * | 2016-01-15 | 2025-06-16 | 荷蘭商庫力克及索發荷蘭公司 | 放置超小或超薄之離散組件 |
| US20170215280A1 (en) | 2016-01-21 | 2017-07-27 | Vuereal Inc. | Selective transfer of micro devices |
| EP3469424A4 (en) | 2016-06-10 | 2020-01-15 | Applied Materials, Inc. | MASKLESS PARALLEL ASSEMBLY TRANSMISSION OF MICRO COMPONENTS |
| US10533080B2 (en) | 2016-07-26 | 2020-01-14 | The Board Of Trustees Of The University Of Illinois | Transfer printing using shape memory polymers |
| JP2020513681A (ja) | 2016-11-11 | 2020-05-14 | キューエムエイティ・インコーポレーテッド | 層転写によるマイクロ発光ダイオード（ｌｅｄ）製造 |
| US10978530B2 (en) | 2016-11-25 | 2021-04-13 | Vuereal Inc. | Integration of microdevices into system substrate |
| US10403537B2 (en) | 2017-03-10 | 2019-09-03 | Facebook Technologies, Llc | Inorganic light emitting diode (ILED) assembly via direct bonding |
| TWI681472B (zh) * | 2017-04-10 | 2020-01-01 | 英屬開曼群島商錼創科技股份有限公司 | 傳輸微小元件的方法 |
| TWI661533B (zh) | 2017-06-07 | 2019-06-01 | Asti Global Inc., Taiwan | 晶片安裝系統以及晶片安裝方法 |
| TWI735645B (zh) * | 2017-09-06 | 2021-08-11 | 優顯科技股份有限公司 | 用於批量移轉微半導體結構之方法、及其具微半導體結構之目標基板 |
| TWI653694B (zh) | 2017-09-13 | 2019-03-11 | 英屬開曼群島商錼創科技股份有限公司 | 微型發光元件陣列製造方法、轉移載板以及微型發光元件陣列 |
| EP3483922B1 (en) * | 2017-11-08 | 2022-05-25 | Facebook Technologies, LLC | Vacuum pick-up head for semiconductor chips |
| US10615063B2 (en) | 2017-11-08 | 2020-04-07 | Facebook Technologies, Llc | Vacuum pick-up head for semiconductor chips |
| US11538785B2 (en) | 2017-12-19 | 2022-12-27 | Ultra Display Technology Corp. | Method of using optoelectronic semiconductor stamp to manufacture optoelectronic semiconductor device |
| CN111615749B (zh) | 2018-01-24 | 2024-11-19 | 苹果公司 | 发光结构 |
| CN108400108B (zh) * | 2018-03-23 | 2021-03-09 | 京东方科技集团股份有限公司 | 一种微器件转印装置及微器件转印系统 |
| US10985046B2 (en) | 2018-06-22 | 2021-04-20 | Veeco Instruments Inc. | Micro-LED transfer methods using light-based debonding |
| KR20200005237A (ko) * | 2018-07-06 | 2020-01-15 | (주)포인트엔지니어링 | 마이크로 led 전사 헤드 및 이를 이용한 마이크로 led 전사 시스템 |
| CN109661122B (zh) * | 2018-11-09 | 2020-01-21 | 华中科技大学 | 一种适用于微型发光二极管的选择性巨量转移方法 |
| US10964582B2 (en) * | 2019-06-24 | 2021-03-30 | Palo Alto Research Center Incorporated | Transfer substrate utilizing selectable surface adhesion transfer elements |
| US11508780B2 (en) | 2020-01-14 | 2022-11-22 | Samsung Electronics Co., Ltd. | Method of manufacturing display apparatus, display apparatus, and structure for manufacturing display apparatus |
-
2019
- 2019-11-12 US US16/681,215 patent/US11302561B2/en active Active
-
2020
- 2020-10-27 JP JP2020179891A patent/JP7519267B2/ja active Active
- 2020-10-27 CN CN202011167810.8A patent/CN112864046B/zh active Active
- 2020-10-28 TW TW109137391A patent/TWI845786B/zh active
- 2020-10-29 EP EP20204793.2A patent/EP3823011B1/en active Active
- 2020-10-30 KR KR1020200143236A patent/KR102647518B1/ko active Active
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