JP2021002651A5 - - Google Patents
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- Publication number
- JP2021002651A5 JP2021002651A5 JP2020092788A JP2020092788A JP2021002651A5 JP 2021002651 A5 JP2021002651 A5 JP 2021002651A5 JP 2020092788 A JP2020092788 A JP 2020092788A JP 2020092788 A JP2020092788 A JP 2020092788A JP 2021002651 A5 JP2021002651 A5 JP 2021002651A5
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- subset
- substrate
- elements
- surface adhesion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 34
- 239000000853 adhesive Substances 0.000 claims 13
- 230000001070 adhesive effect Effects 0.000 claims 13
- 238000000034 method Methods 0.000 claims 7
- 238000010438 heat treatment Methods 0.000 claims 3
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 claims 2
- 238000004026 adhesive bonding Methods 0.000 claims 2
- 230000002441 reversible effect Effects 0.000 claims 2
- 238000001816 cooling Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/449,844 US10964582B2 (en) | 2019-06-24 | 2019-06-24 | Transfer substrate utilizing selectable surface adhesion transfer elements |
| US16/449,844 | 2019-06-24 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021002651A JP2021002651A (ja) | 2021-01-07 |
| JP2021002651A5 true JP2021002651A5 (https=) | 2023-05-30 |
| JP7441726B2 JP7441726B2 (ja) | 2024-03-01 |
Family
ID=71119920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020092788A Active JP7441726B2 (ja) | 2019-06-24 | 2020-05-28 | 選択可能な表面接着力転写素子を利用した転写基板 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10964582B2 (https=) |
| EP (1) | EP3758075B1 (https=) |
| JP (1) | JP7441726B2 (https=) |
| KR (1) | KR102670593B1 (https=) |
| CN (1) | CN112133660A (https=) |
| TW (1) | TWI821564B (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12464822B2 (en) * | 2016-11-25 | 2025-11-04 | Vuereal Inc. | Integration of microdevices into system substrate |
| US11302561B2 (en) * | 2019-11-12 | 2022-04-12 | Palo Alto Research Center Incorporated | Transfer elements that selectably hold and release objects based on changes in stiffness |
| TWI872235B (zh) * | 2020-03-30 | 2025-02-11 | 加拿大商弗瑞爾公司 | 微裝置轉移中之偏移對齊及修復 |
| KR102547027B1 (ko) * | 2021-01-13 | 2023-06-23 | (주)에이치아이티에스 | 다이 본딩 방법 |
| KR102454699B1 (ko) * | 2021-02-22 | 2022-10-17 | 주식회사 코윈디에스티 | 형상기억 소재를 이용한 마이크로 led 전사 장치 및 그 전사 방법 |
| KR102575887B1 (ko) * | 2021-05-11 | 2023-09-08 | 정라파엘 | 본딩 방법 |
| KR102313696B1 (ko) | 2021-05-13 | 2021-10-15 | 김순이 | 통기성이 향상되고 제조가 용이한 쓰레기 봉투 |
| JP2022190832A (ja) * | 2021-06-15 | 2022-12-27 | 株式会社ジャパンディスプレイ | 押圧治具および移載装置 |
| WO2023177347A1 (en) * | 2022-03-15 | 2023-09-21 | Capcon Holdings (Beijing) Limited | A system and method for placement of at least one conductor pin |
| KR102517935B1 (ko) * | 2022-04-15 | 2023-04-03 | 홍성민 | 투명패널이 광학적으로 수평 정렬을 유지하여 개재된 pcb를 밀착시킴으로써 양면 노광이 가능한 pcb 노광장치 |
| US20240036363A1 (en) * | 2022-07-28 | 2024-02-01 | Palo Alto Research Center Incorporated | Optically activated object mass transfer apparatus |
| US20240036364A1 (en) * | 2022-07-28 | 2024-02-01 | Palo Alto Research Center Incorporated | Optically activated object mass transfer system |
| WO2024157426A1 (ja) * | 2023-01-26 | 2024-08-02 | 信越エンジニアリング株式会社 | 移送方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5888650A (en) * | 1996-06-03 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Temperature-responsive adhesive article |
| WO2002084631A1 (en) | 2001-04-11 | 2002-10-24 | Sony Corporation | Element transfer method, element arrangmenet method using the same, and image display apparatus production method |
| JP2002343944A (ja) | 2001-05-14 | 2002-11-29 | Sony Corp | 電子部品の転写方法及び素子の配列方法、画像表示装置の製造方法 |
| US20040235267A1 (en) * | 2003-05-23 | 2004-11-25 | James Sheats | Lamination and delamination technique for thin film processing |
| DE102006044718A1 (de) * | 2006-09-20 | 2008-04-03 | Tesa Ag | Klebemasse |
| WO2011123285A1 (en) | 2010-03-29 | 2011-10-06 | Semprius, Inc. | Selective transfer of active components |
| KR100998087B1 (ko) | 2010-04-01 | 2010-12-03 | 한국기계연구원 | 능동 탈부착 척 |
| US9821529B2 (en) * | 2011-07-19 | 2017-11-21 | 3M Innovative Properties Company | Debondable adhesive article and methods of making and using the same |
| US9412727B2 (en) | 2011-09-20 | 2016-08-09 | Semprius, Inc. | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion |
| US8518204B2 (en) * | 2011-11-18 | 2013-08-27 | LuxVue Technology Corporation | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer |
| US9773750B2 (en) | 2012-02-09 | 2017-09-26 | Apple Inc. | Method of transferring and bonding an array of micro devices |
| DE102012112965A1 (de) * | 2012-12-21 | 2014-06-26 | Leibniz-Institut Für Neue Materialien Gemeinnützige Gesellschaft Mit Beschränkter Haftung | Gegenstand mit schaltbarer Adhäsion |
| EP3257072B1 (en) * | 2015-09-09 | 2019-03-06 | Goertek Inc | Repairing method and manufacturing method of micro-led device |
| US20170215280A1 (en) | 2016-01-21 | 2017-07-27 | Vuereal Inc. | Selective transfer of micro devices |
| GB2554040B (en) * | 2016-05-11 | 2023-01-25 | Flexenable Ltd | Carrier release |
| EP3469424A4 (en) * | 2016-06-10 | 2020-01-15 | Applied Materials, Inc. | MASKLESS PARALLEL ASSEMBLY TRANSMISSION OF MICRO COMPONENTS |
| TWI694605B (zh) | 2017-08-07 | 2020-05-21 | 財團法人工業技術研究院 | 元件擴距轉移方法及實施此轉移方法的設備 |
| CN107863316B (zh) | 2017-11-06 | 2020-07-28 | 上海天马微电子有限公司 | Micro LED转运装置、转运方法及其制作方法 |
-
2019
- 2019-06-24 US US16/449,844 patent/US10964582B2/en active Active
-
2020
- 2020-05-25 TW TW109117315A patent/TWI821564B/zh active
- 2020-05-28 JP JP2020092788A patent/JP7441726B2/ja active Active
- 2020-06-09 KR KR1020200069698A patent/KR102670593B1/ko active Active
- 2020-06-18 EP EP20180961.3A patent/EP3758075B1/en active Active
- 2020-06-22 CN CN202010576700.0A patent/CN112133660A/zh active Pending
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