CN112133660A - 利用可选择的表面粘附转移元件的转移基底 - Google Patents

利用可选择的表面粘附转移元件的转移基底 Download PDF

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Publication number
CN112133660A
CN112133660A CN202010576700.0A CN202010576700A CN112133660A CN 112133660 A CN112133660 A CN 112133660A CN 202010576700 A CN202010576700 A CN 202010576700A CN 112133660 A CN112133660 A CN 112133660A
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Prior art keywords
transfer
subset
substrate
elements
objects
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Pending
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CN202010576700.0A
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English (en)
Chinese (zh)
Inventor
王蕴达
S·雷乔杜利
J·卢
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Palo Alto Research Center Inc
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Palo Alto Research Center Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3218—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H10P72/3412—Batch transfer of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7428—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7432—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)
CN202010576700.0A 2019-06-24 2020-06-22 利用可选择的表面粘附转移元件的转移基底 Pending CN112133660A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16/449,844 US10964582B2 (en) 2019-06-24 2019-06-24 Transfer substrate utilizing selectable surface adhesion transfer elements
US16/449844 2019-06-24

Publications (1)

Publication Number Publication Date
CN112133660A true CN112133660A (zh) 2020-12-25

Family

ID=71119920

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010576700.0A Pending CN112133660A (zh) 2019-06-24 2020-06-22 利用可选择的表面粘附转移元件的转移基底

Country Status (6)

Country Link
US (1) US10964582B2 (https=)
EP (1) EP3758075B1 (https=)
JP (1) JP7441726B2 (https=)
KR (1) KR102670593B1 (https=)
CN (1) CN112133660A (https=)
TW (1) TWI821564B (https=)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN112864046A (zh) * 2019-11-12 2021-05-28 帕洛阿尔托研究中心公司 基于刚度变化可选择地保持和释放对象的转移元件

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US12464822B2 (en) * 2016-11-25 2025-11-04 Vuereal Inc. Integration of microdevices into system substrate
TWI872235B (zh) * 2020-03-30 2025-02-11 加拿大商弗瑞爾公司 微裝置轉移中之偏移對齊及修復
KR102547027B1 (ko) * 2021-01-13 2023-06-23 (주)에이치아이티에스 다이 본딩 방법
KR102454699B1 (ko) * 2021-02-22 2022-10-17 주식회사 코윈디에스티 형상기억 소재를 이용한 마이크로 led 전사 장치 및 그 전사 방법
KR102575887B1 (ko) * 2021-05-11 2023-09-08 정라파엘 본딩 방법
KR102313696B1 (ko) 2021-05-13 2021-10-15 김순이 통기성이 향상되고 제조가 용이한 쓰레기 봉투
JP2022190832A (ja) * 2021-06-15 2022-12-27 株式会社ジャパンディスプレイ 押圧治具および移載装置
WO2023177347A1 (en) * 2022-03-15 2023-09-21 Capcon Holdings (Beijing) Limited A system and method for placement of at least one conductor pin
KR102517935B1 (ko) * 2022-04-15 2023-04-03 홍성민 투명패널이 광학적으로 수평 정렬을 유지하여 개재된 pcb를 밀착시킴으로써 양면 노광이 가능한 pcb 노광장치
US20240036363A1 (en) * 2022-07-28 2024-02-01 Palo Alto Research Center Incorporated Optically activated object mass transfer apparatus
US20240036364A1 (en) * 2022-07-28 2024-02-01 Palo Alto Research Center Incorporated Optically activated object mass transfer system
WO2024157426A1 (ja) * 2023-01-26 2024-08-02 信越エンジニアリング株式会社 移送方法

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US5888650A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US20040235267A1 (en) * 2003-05-23 2004-11-25 James Sheats Lamination and delamination technique for thin film processing
US20130130440A1 (en) * 2011-11-18 2013-05-23 Hsin-Hua Hu Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
US20140150962A1 (en) * 2011-07-19 2014-06-05 3M Innovative Properties Company Debondable Adhesive Article and Methods of Making and Using the Same
CN105518888A (zh) * 2015-09-09 2016-04-20 歌尔声学股份有限公司 微发光二极管的修复方法、制造方法、装置及电子设备
US20170215280A1 (en) * 2016-01-21 2017-07-27 Vuereal Inc. Selective transfer of micro devices
US20170358623A1 (en) * 2016-06-10 2017-12-14 Manivannan Thothadri Maskless parallel pick-and-place transfer of micro-devices
CN107863316A (zh) * 2017-11-06 2018-03-30 上海天马微电子有限公司 Micro LED转运装置、转运方法及其制作方法

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WO2002084631A1 (en) 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
JP2002343944A (ja) 2001-05-14 2002-11-29 Sony Corp 電子部品の転写方法及び素子の配列方法、画像表示装置の製造方法
DE102006044718A1 (de) * 2006-09-20 2008-04-03 Tesa Ag Klebemasse
WO2011123285A1 (en) 2010-03-29 2011-10-06 Semprius, Inc. Selective transfer of active components
KR100998087B1 (ko) 2010-04-01 2010-12-03 한국기계연구원 능동 탈부착 척
US9412727B2 (en) 2011-09-20 2016-08-09 Semprius, Inc. Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion
US9773750B2 (en) 2012-02-09 2017-09-26 Apple Inc. Method of transferring and bonding an array of micro devices
DE102012112965A1 (de) * 2012-12-21 2014-06-26 Leibniz-Institut Für Neue Materialien Gemeinnützige Gesellschaft Mit Beschränkter Haftung Gegenstand mit schaltbarer Adhäsion
GB2554040B (en) * 2016-05-11 2023-01-25 Flexenable Ltd Carrier release
TWI694605B (zh) 2017-08-07 2020-05-21 財團法人工業技術研究院 元件擴距轉移方法及實施此轉移方法的設備

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5888650A (en) * 1996-06-03 1999-03-30 Minnesota Mining And Manufacturing Company Temperature-responsive adhesive article
US20040235267A1 (en) * 2003-05-23 2004-11-25 James Sheats Lamination and delamination technique for thin film processing
US20140150962A1 (en) * 2011-07-19 2014-06-05 3M Innovative Properties Company Debondable Adhesive Article and Methods of Making and Using the Same
US20130130440A1 (en) * 2011-11-18 2013-05-23 Hsin-Hua Hu Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer
CN105518888A (zh) * 2015-09-09 2016-04-20 歌尔声学股份有限公司 微发光二极管的修复方法、制造方法、装置及电子设备
US20170215280A1 (en) * 2016-01-21 2017-07-27 Vuereal Inc. Selective transfer of micro devices
US20170358623A1 (en) * 2016-06-10 2017-12-14 Manivannan Thothadri Maskless parallel pick-and-place transfer of micro-devices
CN107863316A (zh) * 2017-11-06 2018-03-30 上海天马微电子有限公司 Micro LED转运装置、转运方法及其制作方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112864046A (zh) * 2019-11-12 2021-05-28 帕洛阿尔托研究中心公司 基于刚度变化可选择地保持和释放对象的转移元件
CN112864046B (zh) * 2019-11-12 2024-01-12 帕洛阿尔托研究中心公司 基于刚度变化可选择地保持和释放对象的转移元件

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Publication number Publication date
EP3758075B1 (en) 2024-03-06
US10964582B2 (en) 2021-03-30
EP3758075A1 (en) 2020-12-30
TWI821564B (zh) 2023-11-11
JP2021002651A (ja) 2021-01-07
JP7441726B2 (ja) 2024-03-01
US20200402831A1 (en) 2020-12-24
KR102670593B1 (ko) 2024-05-31
KR20210000269A (ko) 2021-01-04
TW202117888A (zh) 2021-05-01

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