JP2021088687A - 難燃性導電性ペースト及び該難燃性導電性ペーストの製造方法 - Google Patents
難燃性導電性ペースト及び該難燃性導電性ペーストの製造方法 Download PDFInfo
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- JP2021088687A JP2021088687A JP2019221056A JP2019221056A JP2021088687A JP 2021088687 A JP2021088687 A JP 2021088687A JP 2019221056 A JP2019221056 A JP 2019221056A JP 2019221056 A JP2019221056 A JP 2019221056A JP 2021088687 A JP2021088687 A JP 2021088687A
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- 239000003063 flame retardant Substances 0.000 title claims abstract description 69
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- 238000004519 manufacturing process Methods 0.000 title claims description 3
- -1 phosphate compound Chemical class 0.000 claims abstract description 36
- 239000002245 particle Substances 0.000 claims abstract description 35
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- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
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- 239000002270 dispersing agent Substances 0.000 description 2
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- 125000002270 phosphoric acid ester group Chemical group 0.000 description 2
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- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- DAFHKNAQFPVRKR-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylpropanoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)C DAFHKNAQFPVRKR-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
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- 239000005642 Oleic acid Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920001214 Polysorbate 60 Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000005215 alkyl ethers Chemical class 0.000 description 1
- 125000005037 alkyl phenyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229940117955 isoamyl acetate Drugs 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000137 polyphosphoric acid Polymers 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Conductive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
これらの界面活性剤は、単独でまたは2種類以上を適宜組み合わせて使用することもできる。
1.5未満、又は、2.5を超えると均一な膜厚の塗膜が形成できない虞があるからである。
また、市販の導電性ペーストに所望の濃度になるようにリン酸エステル化合物を添加し、3〜5分混錬して作製してもよい。
フッ素コーティングした基材に実施例及び比較例の各導電性ペーストを約170μmの厚みで塗布し、オーブンにて150℃で30分乾燥させた。
なお、時間はライターを離した時点から測定開始した値である。
乾燥塗膜の比抵抗は、ガラス基板上に4mm幅×40mm長さ×20μm厚さの塗膜を形成した後、4端子法で抵抗計ミリオームハイテスタ3540−02(日置電機株式会社製)にて測定し、抵抗値(Ω)から前記[式3]にて、体積固有抵抗(比抵抗/Ω・cm)を算出した。
各導電性ペーストの25℃における粘度(dPa・s)をビスコテスターVT−04(リオン株式会社製)にて測定した。
各導電性ペーストの25℃における1rpm及び10rpmの粘度(dPa・s)をコーンプレート型粘度計HBDV−IIIスピンドルCPE−42(ブルックフィールド社製)にて測定した後、前記[式2]にてチクソ値を算出した。
比抵抗を測定した後のガラス基板上の乾燥塗膜の上にセロハンテープ(セキスイ株式会社製)を張り付けた後に剥がし、剥がしたセロハンテープに乾燥塗膜が付着せず、全く剥離が観察されなかったものを〇、乾燥塗膜の一部がセロハンテープに付着し、剥離が観察されたものを△、乾燥塗膜の全部がセロハンテープに付着して、完全に剥離したものを×として評価した。
なお、表1はCR−733S、表2はCR−504L、表3はCR−741の各難燃剤を使用した。
したがって、本発明は産業上の利用可能性の高い発明である。
Claims (5)
- フレーク状銀粒子と樹脂と難燃剤と有機溶剤を含有する難燃性導電性ペーストであって、前記フレーク状銀粒子と前記樹脂と前記難燃剤からなる固形分が40〜90重量%であり、前記固形分における前記フレーク状銀粒子の含有量が80〜95重量%であり、前記樹脂対前記難燃剤の重量比が91:9〜40:60であり、前記難燃剤がリン酸エステル化合物である難燃性導電性ペースト。
- 前記リン酸エステル化合物が縮合リン酸エステル化合物である請求項1記載の難燃性導電性ペースト。
- 前記難燃性導電性ペーストのチクソ値が1.5〜2.5である請求項1又は2記載の難燃性導電性ペースト。
- 前記難燃性導電性ペーストの比抵抗が2.5×10−4Ω・cm以下である請求項1乃至3いずれか記載の難燃性導電性ペースト。
- 銀粒子と樹脂と難燃剤と有機溶剤とを混錬して製造する請求項1乃至4いずれか記載の難燃性導電性ペーストの製造方法。
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JP2019221056A JP7337677B2 (ja) | 2019-12-06 | 2019-12-06 | 難燃性導電性ペースト及び該難燃性導電性ペーストの製造方法 |
CN202080053202.6A CN114207742A (zh) | 2019-12-06 | 2020-08-05 | 阻燃性导电性膏及该阻燃性导电性膏的制备方法 |
PCT/JP2020/029975 WO2021111675A1 (ja) | 2019-12-06 | 2020-08-05 | 難燃性導電性ペースト及び該難燃性導電性ペーストの製造方法 |
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JP2019221056A JP7337677B2 (ja) | 2019-12-06 | 2019-12-06 | 難燃性導電性ペースト及び該難燃性導電性ペーストの製造方法 |
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JP2021088687A true JP2021088687A (ja) | 2021-06-10 |
JP7337677B2 JP7337677B2 (ja) | 2023-09-04 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001502375A (ja) * | 1996-10-22 | 2001-02-20 | シルバーライン リミテッド | 金属顔料成分 |
JP2004221005A (ja) * | 2003-01-17 | 2004-08-05 | Toyobo Co Ltd | 導電性ペースト |
JP2017162776A (ja) * | 2016-03-11 | 2017-09-14 | 福田金属箔粉工業株式会社 | 導電性ペースト |
CN108003771A (zh) * | 2017-12-19 | 2018-05-08 | 杭州湘隽阻燃科技有限公司 | 一种无卤阻燃电磁屏蔽材料及其制备方法与应用 |
CN108117727A (zh) * | 2017-12-19 | 2018-06-05 | 罗洪梅 | 一种高刚高韧耐热低翘曲导电pc/pct合金及其制备方法 |
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2019
- 2019-12-06 JP JP2019221056A patent/JP7337677B2/ja active Active
-
2020
- 2020-08-05 WO PCT/JP2020/029975 patent/WO2021111675A1/ja active Application Filing
- 2020-08-05 CN CN202080053202.6A patent/CN114207742A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001502375A (ja) * | 1996-10-22 | 2001-02-20 | シルバーライン リミテッド | 金属顔料成分 |
JP2004221005A (ja) * | 2003-01-17 | 2004-08-05 | Toyobo Co Ltd | 導電性ペースト |
JP2017162776A (ja) * | 2016-03-11 | 2017-09-14 | 福田金属箔粉工業株式会社 | 導電性ペースト |
CN108003771A (zh) * | 2017-12-19 | 2018-05-08 | 杭州湘隽阻燃科技有限公司 | 一种无卤阻燃电磁屏蔽材料及其制备方法与应用 |
CN108117727A (zh) * | 2017-12-19 | 2018-06-05 | 罗洪梅 | 一种高刚高韧耐热低翘曲导电pc/pct合金及其制备方法 |
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CN114207742A (zh) | 2022-03-18 |
WO2021111675A1 (ja) | 2021-06-10 |
JP7337677B2 (ja) | 2023-09-04 |
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