JP5960804B2 - 薄膜光電池およびその他の用途に使用するためのはんだ付け可能なポリマー厚膜導電性電極組成物 - Google Patents
薄膜光電池およびその他の用途に使用するためのはんだ付け可能なポリマー厚膜導電性電極組成物 Download PDFInfo
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- 239000000203 mixture Substances 0.000 title claims description 71
- 239000010408 film Substances 0.000 title claims description 32
- 229920000642 polymer Polymers 0.000 title claims description 23
- 239000010409 thin film Substances 0.000 title claims description 20
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 30
- 229910052709 silver Inorganic materials 0.000 claims description 30
- 239000004332 silver Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 239000010949 copper Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000000843 powder Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 11
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000003960 organic solvent Substances 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 7
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 5
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 239000002904 solvent Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000005476 soldering Methods 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- 229920003002 synthetic resin Polymers 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- -1 glycol ethers Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 239000007779 soft material Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Conductive Materials (AREA)
- Photovoltaic Devices (AREA)
- Paints Or Removers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
(a)導電性銀被覆粉末と、
(b)2つの異なった樹脂と有機溶剤とを含む有機媒体と
を含むはんだ付け可能なポリマー厚膜導電性組成物に関し、導電性銀被覆銅粉末の重量の、2つの異なった樹脂の全重量に対する比が5:1〜45:1である。
当該厚膜組成物中の導電性粉末は銀被覆銅導電性粉末である。
粉末は典型的に、機械混合によって有機媒体、すなわち有機ビヒクルと混合されて、印刷のための適した稠度およびレオロジーを有する「ペースト」と呼ばれるペースト状組成物を形成する。有機媒体は、2つの異なった樹脂および有機溶剤からなる。
ポリマー厚膜導電性組成物または「ペースト」は典型的に、ガスおよび湿気に対して不透過性であるスパッタされたポリエステルなどの基材上に堆積される。基材は軟質材料のシートであってもよい。軟質材料はポリエステル、例えばポリエチレンテレフタレートなどの不透過性プラスチック、もしくはプラスチックシートとその上に堆積された任意選択的である金属または誘電体層との組み合わせから構成された複合材料であってもよい。一実施形態において、基材は薄膜光電地の形態、すなわち、金属化された例えばステンレス鋼、ポリエステル、その次に、半導体層、例えばCIGS、その次に、薄いCdS層、その次に、スパッタされた酸化インジウムスズを有する堆積された層の形態であってもよい。はんだ付け可能なポリマー厚膜導電性組成物を薄膜光電地の前面のITO上に堆積する。
PTF銀被覆銅電極ペーストを調製するために、銀被覆銅フレーク0204(Ferro Corp.(Columbus,OH)から得られた)を、ポリヒドロキシエーテル樹脂、すなわち、フェノキシ樹脂(Phenoxy Associates,Incから入手可能)およびフェノール樹脂(Georgia Pacificから入手可能)から構成される有機媒体と混合した。樹脂の分子量は約20,000であった。銀被覆銅を添加する前に、溶剤を用いて樹脂を完全に溶解した。溶剤はカルビトールアセテート(Eastman Chemicalから入手可能)であった。
Claims (9)
- (a)銀被覆銅導電性粉末と、
(b)2つの異なった樹脂と有機溶剤とを含む有機媒体と
を含むはんだ付け可能なポリマー厚膜導電性組成物であって、前記銀被覆銅導電性粉末の重量の、前記2つの異なった樹脂の全重量に対する比が5:1〜45:1であり、
前記2つの異なった樹脂がフェノキシ樹脂およびフェノール樹脂である、はんだ付け可能なポリマー厚膜導電性組成物。 - 前記銀被覆銅導電性粉末が銀被覆銅フレークである、請求項1に記載のはんだ付け可能なポリマー厚膜導電性組成物。
- 前記有機溶剤がジエチレングリコールエチルエーテルアセテートおよびブチルカルビトールからなる群から選択される1つまたは複数の成分を含む、請求項2に記載のはんだ付け可能なポリマー厚膜導電性組成物。
- 前記組成物の全重量に基づいて、前記銀被覆銅導電性粉末が前記はんだ付け可能なポリマー厚膜導電性組成物の60〜93重量パーセントであり、前記2つの樹脂の全重量が0.3〜6重量パーセントであり、前記有機媒体が7〜40重量パーセントである、請求項1に記載のはんだ付け可能なポリマー厚膜導電性組成物。
- 導電性格子を薄膜光電池上に形成する方法であって、
(a)
(i)銀被覆銅導電性粉末と、
(ii)2つの異なった樹脂と有機溶剤とを含む有機媒体と
を含むはんだ付け可能なポリマー厚膜導電性組成物であって、前記銀被覆銅導電性粉末の重量の、前記2つの異なった樹脂の全重量に対する比が5:1〜45:1であるはんだ付け可能なポリマー厚膜導電性組成物を、前記薄膜光電池の前面に適用する工程と、
(b)前記組成物を乾燥させる工程と
を含み、
前記2つの異なった樹脂がフェノキシ樹脂およびフェノール樹脂である方法。 - 前記銀被覆銅導電性粉末が銀被覆銅フレークであり、前記有機溶剤がジエチレングリコールエチルエーテルアセテートおよびブチルカルビトールからなる群から選択される1つまたは複数の成分を含む、請求項5に記載の方法。
- 前記組成物の全重量に基づいて、前記銀被覆銅導電性粉末が前記はんだ付け可能なポリマー厚膜導電性組成物の60〜93重量パーセントであり、前記2つの樹脂の全重量が0.3〜6重量パーセントであり、前記有機媒体が7〜40重量パーセントである、請求項6に記載の方法。
- 前記薄膜光電池の前記前面が酸化インジウムスズでスパッタされる、請求項6に記載の方法。
- 請求項1〜4のいずれか一項に記載の乾燥された組成物を含む導電性格子線および/または母線を含む薄膜光電池。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/150,648 US8704087B2 (en) | 2011-06-01 | 2011-06-01 | Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications |
US13/150,648 | 2011-06-01 | ||
PCT/US2012/040452 WO2012167075A1 (en) | 2011-06-01 | 2012-06-01 | Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications |
Publications (2)
Publication Number | Publication Date |
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JP2014524100A JP2014524100A (ja) | 2014-09-18 |
JP5960804B2 true JP5960804B2 (ja) | 2016-08-02 |
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JP2014513743A Active JP5960804B2 (ja) | 2011-06-01 | 2012-06-01 | 薄膜光電池およびその他の用途に使用するためのはんだ付け可能なポリマー厚膜導電性電極組成物 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8704087B2 (ja) |
EP (1) | EP2715741B1 (ja) |
JP (1) | JP5960804B2 (ja) |
CN (1) | CN103563009B (ja) |
TW (1) | TW201303897A (ja) |
WO (1) | WO2012167075A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013090344A1 (en) * | 2011-12-13 | 2013-06-20 | Ferro Corporation | Electrically conductive polymeric compositons, contacts, assemblies, and methods |
CN104885576B (zh) * | 2012-12-31 | 2017-12-05 | 阿莫绿色技术有限公司 | 柔性印刷电路基板及其制造方法 |
EP2918371A1 (en) * | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
CN107482071A (zh) * | 2017-07-24 | 2017-12-15 | 协鑫集成科技股份有限公司 | 异质结太阳能电池及其制备方法 |
CN112041994B (zh) * | 2018-03-30 | 2022-06-21 | 深圳市首骋新材料科技有限公司 | 晶硅太阳能电池正面导电浆料及其制备方法和太阳能电池 |
CN109360673B (zh) * | 2018-10-24 | 2020-04-10 | 焦作市高森建电子科技有限公司 | 一种银包铜导电铜浆及其制备方法 |
CN111048233B (zh) * | 2019-12-16 | 2022-03-01 | 中国科学院电工研究所 | 一种异质结太阳电池用电极浆料及其制备方法 |
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JP2002212492A (ja) * | 2001-01-15 | 2002-07-31 | Toshiba Chem Corp | 導電性塗料 |
JP4389148B2 (ja) * | 2002-05-17 | 2009-12-24 | 日立化成工業株式会社 | 導電ペースト |
DE112004001768B4 (de) | 2003-09-26 | 2019-11-21 | Hitachi Chemical Co., Ltd. | Gemischtes leitendes Pulver und dessen Verwendung |
WO2009052141A1 (en) * | 2007-10-18 | 2009-04-23 | E. I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
ES2382527T3 (es) * | 2008-07-22 | 2012-06-11 | E. I. Du Pont De Nemours And Company | Composición de electrodo de plata de película gruesa de polímero para uso en células fotovoltaicas de película fina |
US20110180137A1 (en) * | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
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2011
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CN103563009B (zh) | 2016-03-30 |
US8704087B2 (en) | 2014-04-22 |
WO2012167075A1 (en) | 2012-12-06 |
JP2014524100A (ja) | 2014-09-18 |
US20140216546A1 (en) | 2014-08-07 |
US9024179B2 (en) | 2015-05-05 |
TW201303897A (zh) | 2013-01-16 |
EP2715741B1 (en) | 2015-07-22 |
CN103563009A (zh) | 2014-02-05 |
US20120305065A1 (en) | 2012-12-06 |
EP2715741A1 (en) | 2014-04-09 |
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