CN103563009B - 用于薄膜光伏电池和其它应用中的可焊聚合物厚膜导电性电极组合物 - Google Patents
用于薄膜光伏电池和其它应用中的可焊聚合物厚膜导电性电极组合物 Download PDFInfo
- Publication number
- CN103563009B CN103563009B CN201280024880.5A CN201280024880A CN103563009B CN 103563009 B CN103563009 B CN 103563009B CN 201280024880 A CN201280024880 A CN 201280024880A CN 103563009 B CN103563009 B CN 103563009B
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- Prior art keywords
- weight
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- thick film
- coating silver
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- 239000000203 mixture Substances 0.000 title claims abstract description 73
- 229920000642 polymer Polymers 0.000 title claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 claims abstract description 30
- 239000004332 silver Substances 0.000 claims abstract description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229920005989 resin Polymers 0.000 claims abstract description 27
- 239000011347 resin Substances 0.000 claims abstract description 27
- 239000011248 coating agent Substances 0.000 claims abstract description 26
- 238000000576 coating method Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical group OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 14
- 239000013034 phenoxy resin Substances 0.000 claims description 10
- 229920006287 phenoxy resin Polymers 0.000 claims description 10
- 239000005011 phenolic resin Substances 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 8
- 238000001035 drying Methods 0.000 claims description 7
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 4
- 239000011889 copper foil Substances 0.000 claims description 4
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 18
- 239000002904 solvent Substances 0.000 description 13
- 239000000758 substrate Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 229920002313 fluoropolymer Polymers 0.000 description 5
- 239000004811 fluoropolymer Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 229910021419 crystalline silicon Inorganic materials 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- RUJPNZNXGCHGID-UHFFFAOYSA-N (Z)-beta-Terpineol Natural products CC(=C)C1CCC(C)(O)CC1 RUJPNZNXGCHGID-UHFFFAOYSA-N 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- QJVXKWHHAMZTBY-GCPOEHJPSA-N syringin Chemical compound COC1=CC(\C=C\CO)=CC(OC)=C1O[C@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 QJVXKWHHAMZTBY-GCPOEHJPSA-N 0.000 description 2
- WUOACPNHFRMFPN-SECBINFHSA-N (S)-(-)-alpha-terpineol Chemical compound CC1=CC[C@@H](C(C)(C)O)CC1 WUOACPNHFRMFPN-SECBINFHSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- -1 alcohol ester Chemical class 0.000 description 1
- OVKDFILSBMEKLT-UHFFFAOYSA-N alpha-Terpineol Natural products CC(=C)C1(O)CCC(C)=CC1 OVKDFILSBMEKLT-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000320 mechanical mixture Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/150,648 | 2011-06-01 | ||
US13/150,648 US8704087B2 (en) | 2011-06-01 | 2011-06-01 | Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications |
PCT/US2012/040452 WO2012167075A1 (en) | 2011-06-01 | 2012-06-01 | Solderable polymer thick film conductive electrode composition for use in thin-film photovoltaic cells and other applications |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103563009A CN103563009A (zh) | 2014-02-05 |
CN103563009B true CN103563009B (zh) | 2016-03-30 |
Family
ID=46317501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280024880.5A Active CN103563009B (zh) | 2011-06-01 | 2012-06-01 | 用于薄膜光伏电池和其它应用中的可焊聚合物厚膜导电性电极组合物 |
Country Status (6)
Country | Link |
---|---|
US (2) | US8704087B2 (zh) |
EP (1) | EP2715741B1 (zh) |
JP (1) | JP5960804B2 (zh) |
CN (1) | CN103563009B (zh) |
TW (1) | TW201303897A (zh) |
WO (1) | WO2012167075A1 (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013090344A1 (en) * | 2011-12-13 | 2013-06-20 | Ferro Corporation | Electrically conductive polymeric compositons, contacts, assemblies, and methods |
KR101639411B1 (ko) * | 2012-12-31 | 2016-07-14 | 주식회사 아모그린텍 | 연성인쇄회로기판 |
EP2918371A1 (en) * | 2014-03-11 | 2015-09-16 | Heraeus Precious Metals North America Conshohocken LLC | Solderable conductive polymer thick film composition |
CN107482071A (zh) * | 2017-07-24 | 2017-12-15 | 协鑫集成科技股份有限公司 | 异质结太阳能电池及其制备方法 |
CN112041994B (zh) * | 2018-03-30 | 2022-06-21 | 深圳市首骋新材料科技有限公司 | 晶硅太阳能电池正面导电浆料及其制备方法和太阳能电池 |
CN109360673B (zh) * | 2018-10-24 | 2020-04-10 | 焦作市高森建电子科技有限公司 | 一种银包铜导电铜浆及其制备方法 |
CN111048233B (zh) * | 2019-12-16 | 2022-03-01 | 中国科学院电工研究所 | 一种异质结太阳电池用电极浆料及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86100162A (zh) * | 1984-07-18 | 1987-07-22 | 美国电材料公司 | 具有高附着强度的可焊接传导合成物 |
US5089313A (en) * | 1986-12-10 | 1992-02-18 | Marley Mouldings Inc. | Process for coating metal and plastic to impart wood-like appearances |
US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
US6228288B1 (en) * | 2000-04-27 | 2001-05-08 | Cts Corporation | Electrically conductive compositions and films for position sensors |
CN1745437A (zh) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | 导电浆料 |
CN102056973A (zh) * | 2008-07-22 | 2011-05-11 | E.I.内穆尔杜邦公司 | 用于薄膜光伏电池的聚合物厚膜银电极组合物 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4595606A (en) | 1984-07-18 | 1986-06-17 | Rohm And Haas Company | Solderable conductive compositions having high adhesive strength |
US5049313A (en) | 1989-09-05 | 1991-09-17 | Advanced Products Inc. | Thermoset polymer thick film compositions and their use as electrical circuitry |
US5089173A (en) | 1990-05-02 | 1992-02-18 | Advanced Products Inc. | Highly conductive polymer thick film compositions |
US5283007A (en) * | 1992-04-28 | 1994-02-01 | E. I. Du Pont De Nemours And Company | Conductive polymer compositions |
US5242623A (en) * | 1991-08-13 | 1993-09-07 | E. I. Du Pont De Nemours And Company | Screen-printable thick film paste composition |
DE69305942T2 (de) * | 1992-09-15 | 1997-03-13 | Du Pont | Zusammensetzung für einen Polymer-Dickschichtwiderstand |
JP3431338B2 (ja) * | 1994-11-22 | 2003-07-28 | 松下電器産業株式会社 | 半田付着構造体及びこれに用いる導電性組成物 |
JP3222361B2 (ja) * | 1995-08-15 | 2001-10-29 | キヤノン株式会社 | 太陽電池モジュールの製造方法及び太陽電池モジュール |
JP2001093330A (ja) * | 1999-09-24 | 2001-04-06 | Hitachi Chem Co Ltd | スルーホール導体形成用導電ペースト及びその製造法並びにスルーホール導体形成用導電ペーストを用いた両面プリント配線板 |
JP2001345469A (ja) * | 2000-06-01 | 2001-12-14 | Canon Inc | 光起電力素子および光起電力素子の製造方法 |
JP2002212492A (ja) * | 2001-01-15 | 2002-07-31 | Toshiba Chem Corp | 導電性塗料 |
KR100719993B1 (ko) | 2003-09-26 | 2007-05-21 | 히다치 가세고교 가부시끼가이샤 | 혼합 도전 분말 및 그의 이용 |
WO2009052141A1 (en) * | 2007-10-18 | 2009-04-23 | E. I. Du Pont De Nemours And Company | Conductive compositions and processes for use in the manufacture of semiconductor devices |
US20110180137A1 (en) * | 2010-01-25 | 2011-07-28 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
-
2011
- 2011-06-01 US US13/150,648 patent/US8704087B2/en active Active
-
2012
- 2012-05-28 TW TW101118930A patent/TW201303897A/zh unknown
- 2012-06-01 JP JP2014513743A patent/JP5960804B2/ja active Active
- 2012-06-01 EP EP12727970.1A patent/EP2715741B1/en active Active
- 2012-06-01 WO PCT/US2012/040452 patent/WO2012167075A1/en active Application Filing
- 2012-06-01 CN CN201280024880.5A patent/CN103563009B/zh active Active
-
2014
- 2014-04-09 US US14/248,918 patent/US9024179B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN86100162A (zh) * | 1984-07-18 | 1987-07-22 | 美国电材料公司 | 具有高附着强度的可焊接传导合成物 |
US5089313A (en) * | 1986-12-10 | 1992-02-18 | Marley Mouldings Inc. | Process for coating metal and plastic to impart wood-like appearances |
US5855820A (en) * | 1997-11-13 | 1999-01-05 | E. I. Du Pont De Nemours And Company | Water based thick film conductive compositions |
US6228288B1 (en) * | 2000-04-27 | 2001-05-08 | Cts Corporation | Electrically conductive compositions and films for position sensors |
CN1745437A (zh) * | 2002-05-17 | 2006-03-08 | 日立化成工业株式会社 | 导电浆料 |
CN102056973A (zh) * | 2008-07-22 | 2011-05-11 | E.I.内穆尔杜邦公司 | 用于薄膜光伏电池的聚合物厚膜银电极组合物 |
Also Published As
Publication number | Publication date |
---|---|
CN103563009A (zh) | 2014-02-05 |
TW201303897A (zh) | 2013-01-16 |
JP2014524100A (ja) | 2014-09-18 |
EP2715741B1 (en) | 2015-07-22 |
US20140216546A1 (en) | 2014-08-07 |
WO2012167075A1 (en) | 2012-12-06 |
US20120305065A1 (en) | 2012-12-06 |
EP2715741A1 (en) | 2014-04-09 |
US8704087B2 (en) | 2014-04-22 |
JP5960804B2 (ja) | 2016-08-02 |
US9024179B2 (en) | 2015-05-05 |
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TR01 | Transfer of patent right |
Effective date of registration: 20201218 Address after: Delaware, USA Patentee after: DuPont Electronics Address before: Delaware, USA Patentee before: E.I. Nemours DuPont |
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Effective date of registration: 20210425 Address after: Delaware, USA Patentee after: Sun paster Co.,Ltd. Address before: Delaware, USA Patentee before: DuPont Electronics |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20140205 Assignee: Jiangsu SOTE Electronic Material Co.,Ltd. Assignor: Sun paster Co.,Ltd. Contract record no.: X2021990000521 Denomination of invention: Solderable polymer thick film conductive electrode compositions for thin film photovoltaic cells and other applications Granted publication date: 20160330 License type: Common License Record date: 20210826 |