JP2021077859A5 - - Google Patents
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- Publication number
- JP2021077859A5 JP2021077859A5 JP2020134511A JP2020134511A JP2021077859A5 JP 2021077859 A5 JP2021077859 A5 JP 2021077859A5 JP 2020134511 A JP2020134511 A JP 2020134511A JP 2020134511 A JP2020134511 A JP 2020134511A JP 2021077859 A5 JP2021077859 A5 JP 2021077859A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- location
- feature
- plasma etching
- reflectance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims 38
- 239000000758 substrate Substances 0.000 claims 24
- 238000001020 plasma etching Methods 0.000 claims 9
- 238000005286 illumination Methods 0.000 claims 7
- 238000001514 detection method Methods 0.000 claims 3
- 239000000463 material Substances 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 2
- 238000003909 pattern recognition Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1916079.5 | 2019-11-05 | ||
| GBGB1916079.5A GB201916079D0 (en) | 2019-11-05 | 2019-11-05 | Apparatus and method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021077859A JP2021077859A (ja) | 2021-05-20 |
| JP2021077859A5 true JP2021077859A5 (enExample) | 2023-07-04 |
| JP7328944B2 JP7328944B2 (ja) | 2023-08-17 |
Family
ID=68807187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020134511A Active JP7328944B2 (ja) | 2019-11-05 | 2020-08-07 | リフレクトメトリ終了点イメージング装置及び方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11710670B2 (enExample) |
| EP (1) | EP3819927B1 (enExample) |
| JP (1) | JP7328944B2 (enExample) |
| KR (1) | KR20210054447A (enExample) |
| CN (1) | CN112786423B (enExample) |
| GB (1) | GB201916079D0 (enExample) |
| TW (1) | TWI887272B (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022144774A1 (en) * | 2020-12-31 | 2022-07-07 | 3M Innovative Properties Company | Metallic nanohole arrays on nanowells with controlled depth and methods of making the same |
| US11908716B2 (en) | 2021-05-14 | 2024-02-20 | Applied Materials, Inc. | Image-based in-situ process monitoring |
| JP7645139B2 (ja) * | 2021-06-22 | 2025-03-13 | 東京エレクトロン株式会社 | 検査方法及び検査システム |
| KR102740869B1 (ko) | 2021-12-30 | 2024-12-09 | 세메스 주식회사 | 포토 마스크 보정 장치 및 방법 |
| US12046522B2 (en) * | 2022-02-18 | 2024-07-23 | Applied Materials, Inc. | Endpoint detection in low open area and/or high aspect ratio etch applications |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59147433A (ja) * | 1983-02-14 | 1984-08-23 | Hitachi Ltd | エツチング装置 |
| JPH066797B2 (ja) * | 1985-03-11 | 1994-01-26 | 株式会社日立製作所 | エツチングの終点検出方法 |
| JP2595083B2 (ja) * | 1988-06-08 | 1997-03-26 | 株式会社日立製作所 | 配線形成方法及びその装置 |
| JPH03283615A (ja) * | 1990-03-30 | 1991-12-13 | Hitachi Electron Eng Co Ltd | エッチング・モニタ方式 |
| US5450205A (en) | 1993-05-28 | 1995-09-12 | Massachusetts Institute Of Technology | Apparatus and method for real-time measurement of thin film layer thickness and changes thereof |
| JP4444428B2 (ja) | 2000-01-28 | 2010-03-31 | 東京エレクトロン株式会社 | エッチング深さの検出方法並びにエッチングモニター装置及びエッチング装置 |
| DE602004017983D1 (de) | 2003-05-09 | 2009-01-08 | Unaxis Usa Inc | Endpunkt-Erkennung in einem zeitlich gemultiplexten Verfahren unter Verwendung eines Hüllkurvenalgorithmus |
| US20050020073A1 (en) | 2003-07-22 | 2005-01-27 | Lam Research Corporation | Method and system for electronic spatial filtering of spectral reflectometer optical signals |
| JP4371999B2 (ja) | 2004-12-28 | 2009-11-25 | パナソニック株式会社 | ドライエッチング方法及びドライエッチング装置 |
| JP2006186222A (ja) | 2004-12-28 | 2006-07-13 | Matsushita Electric Ind Co Ltd | プラズマ処理装置 |
| EP2309533A1 (en) * | 2006-10-30 | 2011-04-13 | Applied Materials, Inc. | Endpoint detection for photomask etching |
| US8009938B2 (en) * | 2008-02-29 | 2011-08-30 | Applied Materials, Inc. | Advanced process sensing and control using near infrared spectral reflectometry |
| US8709268B2 (en) | 2011-11-14 | 2014-04-29 | Spts Technologies Limited | Etching apparatus and methods |
| GB201119598D0 (en) | 2011-11-14 | 2011-12-28 | Spts Technologies Ltd | Etching apparatus and methods |
| CN104736744B (zh) | 2012-10-17 | 2017-06-06 | 东京毅力科创株式会社 | 使用多变量分析的等离子体蚀刻终点检测 |
| US9543225B2 (en) * | 2014-04-29 | 2017-01-10 | Lam Research Corporation | Systems and methods for detecting endpoint for through-silicon via reveal applications |
| JP2017168625A (ja) | 2016-03-16 | 2017-09-21 | 住友電気工業株式会社 | 面発光半導体レーザを作製する方法 |
| US10269545B2 (en) | 2016-08-03 | 2019-04-23 | Lam Research Corporation | Methods for monitoring plasma processing systems for advanced process and tool control |
| US10438825B2 (en) | 2016-08-29 | 2019-10-08 | Kla-Tencor Corporation | Spectral reflectometry for in-situ process monitoring and control |
| JP6808596B2 (ja) * | 2017-03-10 | 2021-01-06 | キオクシア株式会社 | センシングシステム |
| US11022877B2 (en) | 2017-03-13 | 2021-06-01 | Applied Materials, Inc. | Etch processing system having reflective endpoint detection |
| US20180286643A1 (en) * | 2017-03-29 | 2018-10-04 | Tokyo Electron Limited | Advanced optical sensor, system, and methodologies for etch processing monitoring |
| JP7265493B2 (ja) * | 2017-07-17 | 2023-04-26 | エーエスエムエル ネザーランズ ビー．ブイ． | 情報を測定する装置及び方法 |
-
2019
- 2019-11-05 GB GBGB1916079.5A patent/GB201916079D0/en not_active Ceased
-
2020
- 2020-05-12 CN CN202010396811.3A patent/CN112786423B/zh active Active
- 2020-08-07 JP JP2020134511A patent/JP7328944B2/ja active Active
- 2020-08-21 US US17/000,243 patent/US11710670B2/en active Active
- 2020-10-05 KR KR1020200128389A patent/KR20210054447A/ko active Pending
- 2020-10-05 TW TW109134345A patent/TWI887272B/zh active
- 2020-10-16 EP EP20202400.6A patent/EP3819927B1/en active Active
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