JP2021068763A - チップ部品 - Google Patents
チップ部品 Download PDFInfo
- Publication number
- JP2021068763A JP2021068763A JP2019191453A JP2019191453A JP2021068763A JP 2021068763 A JP2021068763 A JP 2021068763A JP 2019191453 A JP2019191453 A JP 2019191453A JP 2019191453 A JP2019191453 A JP 2019191453A JP 2021068763 A JP2021068763 A JP 2021068763A
- Authority
- JP
- Japan
- Prior art keywords
- barrier layer
- layer
- nickel
- plating
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 78
- 230000004888 barrier function Effects 0.000 claims abstract description 54
- 238000007747 plating Methods 0.000 claims abstract description 43
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 36
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 27
- 239000011574 phosphorus Substances 0.000 claims abstract description 27
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 13
- 239000000956 alloy Substances 0.000 claims abstract description 13
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000009713 electroplating Methods 0.000 claims abstract description 6
- 230000005389 magnetism Effects 0.000 claims description 8
- 239000000758 substrate Substances 0.000 abstract description 35
- 229910000679 solder Inorganic materials 0.000 abstract description 22
- 229910018104 Ni-P Inorganic materials 0.000 abstract description 5
- 229910018536 Ni—P Inorganic materials 0.000 abstract description 5
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 230000032798 delamination Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 107
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000009966 trimming Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 238000010304 firing Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
- C25D5/022—Electroplating of selected surface areas using masking means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/028—Housing; Enclosing; Embedding; Filling the housing or enclosure the resistive element being embedded in insulation with outer enclosing sheath
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
- H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
- H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
- H01C17/283—Precursor compositions therefor, e.g. pastes, inks, glass frits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
2 表電極(内部電極)
3 抵抗体(機能素子)
4 保護層
5 裏電極(内部電極)
6 端面電極(内部電極)
7 外部電極
8 バリア層
8a 内側メッキ層
8b 外側メッキ層
9 外部接続層
10,20 チップ抵抗器(チップ部品)
Claims (4)
- 機能素子が形成された部品本体と、前記部品本体の両端部を覆うように形成されて前記機能素子に接続する一対の内部電極と、前記内部電極の表面に形成されたニッケルを主成分とするバリア層と、前記バリア層の表面に形成されたスズを主成分とする外部接続層とを備え、
前記バリア層が電解メッキにより形成されたニッケルとリンの合金メッキからなると共に、前記バリア層が磁性を有するように前記合金メッキ中のリンの含有量が設定されていることを特徴とするチップ部品。 - 請求項1に記載のチップ部品において、
前記バリア層のニッケルに対するリンの含有率が0.5%〜5%の範囲に設定されていることを特徴とするチップ部品。 - 請求項1または2に記載のチップ部品において、
前記バリア層の厚みが2μm〜15μmの範囲に設定されていることを特徴とするチップ部品。 - 請求項1に記載のチップ部品において、
前記バリア層が、ニッケルからなる内側メッキ層と、ニッケルにリンを含有する外側メッキ層との2層構造になっていることを特徴とするチップ部品。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019191453A JP7372813B2 (ja) | 2019-10-18 | 2019-10-18 | チップ部品 |
CN202080073060.XA CN114631157A (zh) | 2019-10-18 | 2020-09-24 | 芯片零件 |
US17/769,855 US12027291B2 (en) | 2019-10-18 | 2020-09-24 | Chip component |
DE112020005016.5T DE112020005016T5 (de) | 2019-10-18 | 2020-09-24 | Chip-Bauteil |
PCT/JP2020/036054 WO2021075221A1 (ja) | 2019-10-18 | 2020-09-24 | チップ部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019191453A JP7372813B2 (ja) | 2019-10-18 | 2019-10-18 | チップ部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021068763A true JP2021068763A (ja) | 2021-04-30 |
JP7372813B2 JP7372813B2 (ja) | 2023-11-01 |
Family
ID=75537605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019191453A Active JP7372813B2 (ja) | 2019-10-18 | 2019-10-18 | チップ部品 |
Country Status (5)
Country | Link |
---|---|
US (1) | US12027291B2 (ja) |
JP (1) | JP7372813B2 (ja) |
CN (1) | CN114631157A (ja) |
DE (1) | DE112020005016T5 (ja) |
WO (1) | WO2021075221A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1167588A (ja) * | 1997-08-18 | 1999-03-09 | Tdk Corp | Cr複合電子部品とその製造方法 |
JP2001060843A (ja) * | 1999-08-23 | 2001-03-06 | Murata Mfg Co Ltd | チップ型圧電部品 |
JP2001110601A (ja) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2001274539A (ja) * | 2000-03-28 | 2001-10-05 | Matsushita Electric Works Ltd | 電子デバイス搭載プリント配線板の電極接合方法 |
WO2009133717A1 (ja) * | 2008-05-02 | 2009-11-05 | 株式会社Neomaxマテリアル | 気密封止用キャップ |
CN103695977A (zh) * | 2014-01-08 | 2014-04-02 | 苏州道蒙恩电子科技有限公司 | 一种令镀锡层平整且预防长锡须的电镀方法 |
US20150357097A1 (en) * | 2014-06-06 | 2015-12-10 | Yageo Corporation | Chip resistor |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3555376A (en) * | 1965-12-15 | 1971-01-12 | Matsushita Electric Ind Co Ltd | Ohmic contact electrode to semiconducting ceramics and a method for making the same |
JPS58107605A (ja) * | 1981-12-21 | 1983-06-27 | 松下電器産業株式会社 | チツプ抵抗器の製造方法 |
JPS6460843A (en) | 1987-09-01 | 1989-03-07 | Clarion Co Ltd | Device for preventing tape winding in magnetic recording and reproducing device |
JP2786921B2 (ja) * | 1990-01-19 | 1998-08-13 | アルプス電気株式会社 | 可変抵抗器 |
JP3276765B2 (ja) | 1994-02-16 | 2002-04-22 | 清川メッキ工業株式会社 | チップ固定抵抗器の電極端子形成方法 |
JPH1060843A (ja) | 1996-08-12 | 1998-03-03 | Asahi Art Kk | 車止め |
JP3751102B2 (ja) * | 1997-02-03 | 2006-03-01 | 北陸電気工業株式会社 | チップ部品 |
JP3104690B2 (ja) * | 1998-11-09 | 2000-10-30 | 松下電器産業株式会社 | 角板型チップ抵抗器の製造方法 |
JP2004259864A (ja) * | 2003-02-25 | 2004-09-16 | Rohm Co Ltd | チップ抵抗器 |
CN101840760A (zh) * | 2009-03-16 | 2010-09-22 | 国巨股份有限公司 | 芯片电阻器及其制造方法 |
JP6777066B2 (ja) * | 2017-12-27 | 2020-10-28 | Tdk株式会社 | 積層電子部品 |
-
2019
- 2019-10-18 JP JP2019191453A patent/JP7372813B2/ja active Active
-
2020
- 2020-09-24 CN CN202080073060.XA patent/CN114631157A/zh active Pending
- 2020-09-24 US US17/769,855 patent/US12027291B2/en active Active
- 2020-09-24 DE DE112020005016.5T patent/DE112020005016T5/de active Pending
- 2020-09-24 WO PCT/JP2020/036054 patent/WO2021075221A1/ja active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1167588A (ja) * | 1997-08-18 | 1999-03-09 | Tdk Corp | Cr複合電子部品とその製造方法 |
JP2001060843A (ja) * | 1999-08-23 | 2001-03-06 | Murata Mfg Co Ltd | チップ型圧電部品 |
JP2001110601A (ja) * | 1999-10-14 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 抵抗器およびその製造方法 |
JP2001274539A (ja) * | 2000-03-28 | 2001-10-05 | Matsushita Electric Works Ltd | 電子デバイス搭載プリント配線板の電極接合方法 |
WO2009133717A1 (ja) * | 2008-05-02 | 2009-11-05 | 株式会社Neomaxマテリアル | 気密封止用キャップ |
CN103695977A (zh) * | 2014-01-08 | 2014-04-02 | 苏州道蒙恩电子科技有限公司 | 一种令镀锡层平整且预防长锡须的电镀方法 |
US20150357097A1 (en) * | 2014-06-06 | 2015-12-10 | Yageo Corporation | Chip resistor |
Also Published As
Publication number | Publication date |
---|---|
US20220392673A1 (en) | 2022-12-08 |
JP7372813B2 (ja) | 2023-11-01 |
US12027291B2 (en) | 2024-07-02 |
WO2021075221A1 (ja) | 2021-04-22 |
DE112020005016T5 (de) | 2022-07-07 |
CN114631157A (zh) | 2022-06-14 |
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