JP2021036019A - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
JP2021036019A
JP2021036019A JP2019207733A JP2019207733A JP2021036019A JP 2021036019 A JP2021036019 A JP 2021036019A JP 2019207733 A JP2019207733 A JP 2019207733A JP 2019207733 A JP2019207733 A JP 2019207733A JP 2021036019 A JP2021036019 A JP 2021036019A
Authority
JP
Japan
Prior art keywords
epoxy resin
component
thiol
resin composition
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2019207733A
Other languages
English (en)
Japanese (ja)
Inventor
一希 岩谷
Kazuki Iwatani
一希 岩谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of JP2021036019A publication Critical patent/JP2021036019A/ja
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515—Three-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Sealing Material Composition (AREA)
JP2019207733A 2019-08-21 2019-11-18 エポキシ樹脂組成物 Pending JP2021036019A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019151617 2019-08-21
JP2019151617 2019-08-21

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019546417A Division JP6620273B1 (ja) 2019-08-21 2019-08-22 エポキシ樹脂組成物

Publications (1)

Publication Number Publication Date
JP2021036019A true JP2021036019A (ja) 2021-03-04

Family

ID=70000615

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019207733A Pending JP2021036019A (ja) 2019-08-21 2019-11-18 エポキシ樹脂組成物
JP2019223310A Active JP6667843B1 (ja) 2019-08-21 2019-12-10 エポキシ樹脂組成物

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019223310A Active JP6667843B1 (ja) 2019-08-21 2019-12-10 エポキシ樹脂組成物

Country Status (4)

Country Link
JP (2) JP2021036019A (zh)
CN (1) CN112689652B (zh)
TW (1) TWI815031B (zh)
WO (1) WO2021033327A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7295826B2 (ja) * 2020-04-17 2023-06-21 信越化学工業株式会社 エポキシ樹脂組成物
JP2022175617A (ja) * 2021-05-14 2022-11-25 住友化学株式会社 エポキシ樹脂組成物及びその硬化物
JP2024147840A (ja) * 2021-08-26 2024-10-17 ナミックス株式会社 エポキシ樹脂組成物
WO2024024881A1 (ja) * 2022-07-29 2024-02-01 株式会社スリーボンド エポキシ樹脂組成物
WO2024062904A1 (ja) * 2022-09-21 2024-03-28 ナミックス株式会社 樹脂組成物、硬化物、カメラモジュール、及び電子機器
WO2024090259A1 (ja) * 2022-10-28 2024-05-02 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
WO2024204053A1 (ja) * 2023-03-31 2024-10-03 味の素株式会社 チオール化合物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59182817A (ja) * 1983-04-01 1984-10-17 Nippon Paint Co Ltd 硬化性エポキシ樹脂組成物
JPH02122446A (ja) * 1988-11-01 1990-05-10 Canon Inc 光学的記録媒体
JP2009269984A (ja) * 2008-05-07 2009-11-19 Three Bond Co Ltd 熱伝導性樹脂組成物
CN106062030B (zh) * 2014-03-17 2018-03-20 纳美仕有限公司 树脂组合物
JP6864436B2 (ja) * 2016-03-24 2021-04-28 ナミックス株式会社 樹脂組成物、接着剤、硬化物、半導体装置
KR20190052071A (ko) * 2016-09-12 2019-05-15 폴리6 테크놀로지스, 인크. 재생가능한 폴리머 합성을 이용한 폴리머 폐기물용 원-포트 고성능 재활용 방법
US11472957B2 (en) * 2016-10-26 2022-10-18 Namics Corporation Resin composition, adhesive, sealing material, dam agent, semiconductor device and image sensor module
CN107022331A (zh) * 2017-03-09 2017-08-08 苏州润德新材料有限公司 一种新型的快干双组份环氧树脂粘合剂及其制备方法
JP2019156965A (ja) * 2018-03-13 2019-09-19 ナミックス株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
CN112689652A (zh) 2021-04-20
CN112689652B (zh) 2021-07-30
TWI815031B (zh) 2023-09-11
WO2021033327A1 (ja) 2021-02-25
JP6667843B1 (ja) 2020-03-18
JP2021036020A (ja) 2021-03-04
TW202115181A (zh) 2021-04-16

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