JP2021002786A - 信号伝送回路、電子制御装置 - Google Patents
信号伝送回路、電子制御装置 Download PDFInfo
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- 230000008054 signal transmission Effects 0.000 title claims abstract description 84
- 239000002184 metal Substances 0.000 claims description 55
- 229910052751 metal Inorganic materials 0.000 claims description 55
- 239000011347 resin Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 11
- 230000005540 biological transmission Effects 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- 230000001902 propagating effect Effects 0.000 description 4
- 230000000149 penetrating effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005405 multipole Effects 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
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- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
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- 230000001737 promoting effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
- H04L25/00—Baseband systems
- H04L25/02—Details ; arrangements for supplying electrical power along data transmission lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
- Waveguides (AREA)
- Dc Digital Transmission (AREA)
Abstract
Description
本発明による電子制御装置は、上記の信号伝送回路を備える。
以下、図1を参照して本発明の第1の実施形態を説明する。
以下、図2を参照して本発明の第2の実施形態を説明する。
以下、図3を参照して本発明の第3の実施形態を説明する。
以下、図4を参照して本発明の第4の実施形態を説明する。
以下、図5を参照して本発明の第5の実施形態を説明する。
以下、図6を参照して本発明の第6の実施形態を説明する。
以下、図7を参照して本発明の第7の実施形態を説明する。
以下、図8を参照して本発明の第8の実施形態を説明する。
101:金属ベース
102:回路基板
103:同軸コネクタ
104,501,502:コネクタ信号端子
105,503:コネクタグランド端子
112,508:信号配線
113,509:集積回路
114,510:集積回路信号端子
115,511:集積回路グランド端子
120:信号グランド配線
130:金属カバー
132,133,134,135:金属ねじ
200:容量素子
203:フレームグランド配線
302:EMIガスケット
400:コネクタシールド
401:誘電体
500:2極同軸コネクタ
600:車体
601:樹脂ベース
630:樹脂カバー
700:電子制御装置
Claims (9)
- 筐体に格納された回路基板と、
前記回路基板上に実装され、第1の信号端子および第1のグランド端子を備えるコネクタと、
前記回路基板上に実装され、第2の信号端子および第2のグランド端子を備える集積回路と、を備え、
前記第1の信号端子と前記第2の信号端子とは、前記回路基板に配置された信号配線により互いに接続され、
前記第1のグランド端子と前記第2のグランド端子とは、前記回路基板において前記信号配線の直上または直下を含む所定の範囲に配置されたグランド配線により互いに接続され、
前記グランド配線は、前記信号配線の直上または直下の少なくとも一部において、前記信号配線よりも幅広で、かつ前記第1の信号端子と前記第1のグランド端子を合わせた幅よりも幅狭に形成された高インピーダンス構造を有する信号伝送回路。 - 請求項1に記載の信号伝送回路において、
前記コネクタは、同軸ケーブルと前記回路基板とを電気的に接続する同軸コネクタである信号伝送回路。 - 請求項2に記載の信号伝送回路において、
前記同軸ケーブルは、前記第1の信号端子と前記第2の信号端子の間で入出力される信号に電力を重畳して伝送し、
前記集積回路は、前記同軸ケーブルから前記コネクタを介して供給される前記電力を用いて動作する信号伝送回路。 - 請求項1に記載の信号伝送回路において、
前記筐体は、導体を用いて形成され、
前記第1のグランド端子は、容量素子を介して前記筐体と電気的に接続される信号伝送回路。 - 請求項4に記載の信号伝送回路において、
前記回路基板と前記筐体の間に配置されたEMIガスケットを備え、
前記第1のグランド端子は、前記容量素子および前記EMIガスケットを介して前記筐体と電気的に接続される信号伝送回路。 - 請求項1に記載の信号伝送回路において、
前記コネクタの周囲に配置された導電性のコネクタシールドと、
前記コネクタシールドと前記筐体の間に配置された誘電体と、を備え、
前記筐体は、導体を用いて形成され、
前記第1のグランド端子は、前記コネクタシールドおよび前記誘電体を介して前記筐体と電気的に接続される信号伝送回路。 - 請求項1に記載の信号伝送回路において、
前記集積回路を複数備え、
前記コネクタは、前記第1の信号端子を前記集積回路と同じ個数有する信号伝送回路。 - 請求項1に記載の信号伝送回路において、
前記筐体は、樹脂を用いて形成され、
前記回路基板は、導体を用いて形成された固定部材により、前記筐体とともに金属製の搭載部に固定され、
前記グランド配線は、前記固定部材を介して前記搭載部と電気的に接続される信号伝送回路。 - 請求項1から請求項8のいずれか一項に記載の信号伝送回路を備える電子制御装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019116261A JP7133516B2 (ja) | 2019-06-24 | 2019-06-24 | 信号伝送回路、電子制御装置 |
PCT/JP2020/019163 WO2020261790A1 (ja) | 2019-06-24 | 2020-05-13 | 信号伝送回路、電子制御装置 |
US17/622,174 US20220354006A1 (en) | 2019-06-24 | 2020-05-13 | Signal transmission circuit and electronic control device |
Applications Claiming Priority (1)
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JP2019116261A JP7133516B2 (ja) | 2019-06-24 | 2019-06-24 | 信号伝送回路、電子制御装置 |
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JP2021002786A true JP2021002786A (ja) | 2021-01-07 |
JP7133516B2 JP7133516B2 (ja) | 2022-09-08 |
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JP (1) | JP7133516B2 (ja) |
WO (1) | WO2020261790A1 (ja) |
Families Citing this family (1)
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JP2021086985A (ja) * | 2019-11-29 | 2021-06-03 | 日立Astemo株式会社 | 電子制御装置 |
Citations (3)
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JP2002043810A (ja) * | 2000-07-21 | 2002-02-08 | Sony Corp | マイクロストリップ線路 |
WO2010103901A1 (ja) * | 2009-03-13 | 2010-09-16 | 株式会社村田製作所 | 回路基板及びこれを備えた電子装置 |
JP2014049877A (ja) * | 2012-08-30 | 2014-03-17 | Mitsubishi Electric Corp | プリント配線板 |
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US7129421B2 (en) * | 2002-12-06 | 2006-10-31 | Gore Enterprise Holdings, Inc. | Soft surface mount technology compatible EMI gasket |
US7384306B2 (en) * | 2006-07-26 | 2008-06-10 | Tyco Electronics Corporation | RF connector with adjacent shielded modules |
US8169786B2 (en) * | 2008-05-16 | 2012-05-01 | Psion Teklogix Inc. | Ruggedized housing and components for a handled device |
JP5311912B2 (ja) * | 2008-07-26 | 2013-10-09 | 京楽産業.株式会社 | 遊技機 |
EP2498460A1 (en) * | 2009-11-05 | 2012-09-12 | Rohm Co., Ltd. | Signal transmission circuit device, semiconductor device, method and apparatus for inspecting semiconductor device, signal transmission device, and motor drive apparatus using signal transmission device |
WO2012112490A1 (en) * | 2011-02-17 | 2012-08-23 | Boston Scientific Neuromodulation Corporation | Systems for making and using electrical stimulation systems with improved rf compatibility |
JP2015153920A (ja) * | 2014-02-17 | 2015-08-24 | キヤノン株式会社 | 電子機器 |
JP3199753U (ja) * | 2015-06-19 | 2015-09-10 | Dxアンテナ株式会社 | 通信機器および通信機器セット |
KR101681202B1 (ko) * | 2016-08-18 | 2016-11-30 | 주식회사 베스트디지탈 | 동축 케이블 기반 고화질 카메라를 위한 제어 시스템 |
JP7136553B2 (ja) * | 2017-12-08 | 2022-09-13 | 日立Astemo株式会社 | 電子制御装置 |
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- 2019-06-24 JP JP2019116261A patent/JP7133516B2/ja active Active
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2020
- 2020-05-13 WO PCT/JP2020/019163 patent/WO2020261790A1/ja active Application Filing
- 2020-05-13 US US17/622,174 patent/US20220354006A1/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002043810A (ja) * | 2000-07-21 | 2002-02-08 | Sony Corp | マイクロストリップ線路 |
WO2010103901A1 (ja) * | 2009-03-13 | 2010-09-16 | 株式会社村田製作所 | 回路基板及びこれを備えた電子装置 |
JP2014049877A (ja) * | 2012-08-30 | 2014-03-17 | Mitsubishi Electric Corp | プリント配線板 |
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Publication number | Publication date |
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WO2020261790A1 (ja) | 2020-12-30 |
US20220354006A1 (en) | 2022-11-03 |
JP7133516B2 (ja) | 2022-09-08 |
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