JP2020533200A - Mems装置の製造方法 - Google Patents
Mems装置の製造方法 Download PDFInfo
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Abstract
Description
接合材層を形成することが、不活性雰囲気中で第1の温度まで加熱することによって、第1の構成要素の表面上の硬化性材料を部分的に硬化することを含み、第2の構成要素をパターニングされた接着材層および第1の構成要素に接合することが、構成要素を第1の温度とは異なり第1の温度より高い第2の温度まで加熱することによって、部分的に硬化した材料を完全に硬化することを含む方法を提供する。
Claims (15)
- 微小電気機械システム(MEMS)駆動流体デバイスの製造方法であって、前記デバイスが、前記デバイス内の流体チャンバおよび/または流体経路を共に画定する接合した構成要素を備え、前記方法が、第1の構成要素の表面上に接合材層を形成することと、前記接合材層および任意選択で前記第1の構成要素をパターニングすることと、第2の構成要素をパターニングされた前記接合材層および前記第1の構成要素に接合することとを含み、前記接合材層を形成することが、前記第1の構成要素の表面上の硬化性材料を不活性雰囲気中で第1の温度まで加熱することによって部分的に硬化させることを含み、前記第2の構成要素を前記パターニングされた接合材層および前記第1の構成要素に接合することが、前記構成要素を前記第1の温度とは異なり前記第1の温度より高い第2の温度まで加熱することによって、部分的に硬化した前記材料を完全に硬化することを含む、請求項1に記載の方法。
- 前記接合材層および任意選択で前記第1の構成要素をパターニングすることが、前記接合材層上のマスクを画定するマスク層を形成することと、前記接合材層の一部分および任意選択で前記第1の構成要素の一部分を前記マスクを通して除去することを含む、請求項1に記載の方法。
- 前記接合材層および任意選択で前記第1の構成要素をパターニングすることが別個の工程で実施される、請求項1または請求項2に記載の方法。
- 前記接合材層および前記第1の構成要素をパターニングすることがエッチングによって実施される、請求項1〜3のいずれか1項に記載の方法。
- 前記エッチングが異方性エッチングとして実行される、請求項1〜4のいずれか1項に記載の方法。
- 前記異方性エッチングが、流体チャンバまたは流体経路の壁表面であって、テーパー状である、台形の断面を有する、または接合材層の接合表面と直角をなさない壁表面を、少なくとも1つ提供する、請求項5に記載の方法。
- 前記硬化性材料が、重合性の環状アルケン、および特に、ベンゾシクロブテンまたは置換ベンゾシクロブテンを含む、請求項1〜6のいずれか1項に記載の方法。
- 前記第1の構成要素が、電子制御信号を受信すると膜を変形させるように前記膜上に配置されたアクチュエータ素子を含み、前記第2の構成要素がノズルプレートを備え、前記第1の構成要素および前記第2の構成要素が共に、前記デバイス内の流体チャンバおよび流体経路を画定する、請求項1〜7のいずれか1項に記載の方法。
- 前記第1の構成要素が、電子制御信号を受信すると膜を変形させるように前記膜上に配置されたアクチュエータ素子を含み、前記第2の構成要素が予め形成された空洞を内部に有するキャップ層を備え、前記第1の構成要素および前記第2の構成要素が共に、前記デバイス内の流体経路を画定する、請求項1〜7のいずれか1項に記載の方法。
- 前記第1の構成要素の別の表面上に接合材層を形成することと、前記接合材層および任意選択で前記第1の構成要素をパターニングすることと、第3の構成要素を前記接合材層および前記第1の構成要素に接合することとをさらに含み、前記接合材層を前記第1の構成要素の前記別の表面上に形成することが、前記表面上の硬化性材料を不活性雰囲気中で第1の温度まで加熱することによって部分的に硬化させることを含み、前記第3の構成要素を前記接合材層および前記第1の構成要素に接合することが、前記構成要素を前記第2の温度まで加熱することによって、部分的に硬化した前記材料を完全に硬化することを含む、請求項1〜7のいずれか1項に記載の方法。
- 第3の構成要素の表面上に接合材層を形成することと、前記接合材層および任意選択で前記第3の構成要素をパターニングすることと、前記第1の構成要素を前記接合材層および前記第3の構成要素に接合することとをさらに含み、前記第3の構成要素の表面上に前記接合材層を形成することが、前記表面上の硬化性材料を不活性雰囲気中で前記第1の温度まで加熱することによって部分的に硬化することを含み、前記第3の構成要素を前記接合材層および前記第1の構成要素に接合することが、前記構成要素を前記第2の温度まで加熱することによって、部分的に硬化した前記材料を完全に硬化することを含む、請求項1〜7のいずれか1項に記載の方法。
- 前記第1の構成要素の前記別の表面上および任意選択で前記第1の構成要素上で、または第3の構成要素の表面上および任意選択で前記第3の構成要素上での前記接合材層のパターニングが、請求項2〜7のいずれか一項に記載のパターニングと同じ方法で実行される、請求項10または請求項11に記載の方法。
- 前記硬化性材料が、重合性の環状アルケン、および特に、ベンゾシクロブテンまたは置換ベンゾシクロブテンを含む、請求項10〜12のいずれか1項に記載の方法。
- 前記第1の構成要素が、電子制御信号を受信すると膜を変形させるように前記膜上に配置されたアクチュエータ素子を含み、前記第2の構成要素がノズルプレートを備え、前記第3の構成要素が予め形成された空洞を有するキャップ層を備え、前記第1の構成要素および前記第2の構成要素が共に、前記デバイス内の流体チャンバおよび流体経路を画定し、前記第1の構成要素および前記第3の構成要素が前記デバイス内の流体経路を画定する、請求項1〜13のいずれか1項に記載の方法。
- 前記デバイスが液滴堆積ヘッド用の液滴生成ユニットを備える、請求項1〜14のいずれか1項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1714507.9A GB2566309B (en) | 2017-09-08 | 2017-09-08 | A method for the manufacture of a MEMS device |
GB1714507.9 | 2017-09-08 | ||
PCT/GB2018/052566 WO2019048888A1 (en) | 2017-09-08 | 2018-09-10 | METHOD FOR MANUFACTURING MEMS DEVICE |
Publications (3)
Publication Number | Publication Date |
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JP2020533200A true JP2020533200A (ja) | 2020-11-19 |
JP2020533200A5 JP2020533200A5 (ja) | 2021-10-21 |
JP7174752B2 JP7174752B2 (ja) | 2022-11-17 |
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Application Number | Title | Priority Date | Filing Date |
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JP2020513858A Active JP7174752B2 (ja) | 2017-09-08 | 2018-09-10 | Mems装置の製造方法 |
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US (1) | US10906316B2 (ja) |
EP (1) | EP3678867B1 (ja) |
JP (1) | JP7174752B2 (ja) |
GB (1) | GB2566309B (ja) |
WO (1) | WO2019048888A1 (ja) |
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TW202125872A (zh) * | 2019-12-27 | 2021-07-01 | 晶元光電股份有限公司 | 發光裝置的修補方法 |
KR102574711B1 (ko) * | 2021-05-07 | 2023-09-07 | 한국생산기술연구원 | Mems 제조기술에 의한 전기수력학적 노즐칩과 그 제조방법 및 노즐헤드 모듈 |
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JP2001015683A (ja) * | 1999-04-02 | 2001-01-19 | Interuniv Micro Electronica Centrum Vzw | 極薄基板の転写方法及び該方法を用いた多層薄膜デバイスの製造方法 |
JP2009525899A (ja) * | 2006-02-08 | 2009-07-16 | イーストマン コダック カンパニー | プリントヘッド製造方法 |
JP2011523383A (ja) * | 2008-05-23 | 2011-08-11 | 富士フイルム株式会社 | 基板を接合する方法及び装置 |
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JP2004074806A (ja) * | 1996-01-26 | 2004-03-11 | Seiko Epson Corp | インクジェット式記録ヘッド及びその製造方法 |
JP3861532B2 (ja) * | 1999-11-01 | 2006-12-20 | カシオ計算機株式会社 | インクジェットプリンタヘッドの製造方法 |
WO2005122217A1 (en) * | 2004-06-09 | 2005-12-22 | The Regents Of The University Of California | Thermosetting polymer bonding for micro electro-mechanical systems |
US9401471B2 (en) * | 2010-09-15 | 2016-07-26 | Ricoh Company, Ltd. | Electromechanical transducing device and manufacturing method thereof, and liquid droplet discharging head and liquid droplet discharging apparatus |
US9662880B2 (en) * | 2015-09-11 | 2017-05-30 | Xerox Corporation | Integrated thin film piezoelectric printhead |
IT201700082961A1 (it) * | 2017-07-20 | 2019-01-20 | St Microelectronics Srl | Dispositivo microfluidico mems per la stampa a getto di inchiostro ad attuazione piezoelettrica e relativo metodo di fabbricazione |
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- 2018-09-10 EP EP18769463.3A patent/EP3678867B1/en active Active
- 2018-09-10 JP JP2020513858A patent/JP7174752B2/ja active Active
- 2018-09-10 US US16/645,336 patent/US10906316B2/en active Active
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JPH09118013A (ja) * | 1995-08-11 | 1997-05-06 | Xerox Corp | インクジェットプリントヘッド及びその製造方法 |
JP2001015683A (ja) * | 1999-04-02 | 2001-01-19 | Interuniv Micro Electronica Centrum Vzw | 極薄基板の転写方法及び該方法を用いた多層薄膜デバイスの製造方法 |
JP2009525899A (ja) * | 2006-02-08 | 2009-07-16 | イーストマン コダック カンパニー | プリントヘッド製造方法 |
JP2011523383A (ja) * | 2008-05-23 | 2011-08-11 | 富士フイルム株式会社 | 基板を接合する方法及び装置 |
US20130278677A1 (en) * | 2012-04-24 | 2013-10-24 | Kathleen M. Vaeth | Nozzle plate including permanently bonded fluid channel |
WO2017082354A1 (ja) * | 2015-11-11 | 2017-05-18 | 京セラ株式会社 | 液体吐出ヘッド、記録装置、および液体吐出ヘッドの製造方法 |
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US10906316B2 (en) | 2021-02-02 |
GB2566309B (en) | 2021-06-16 |
US20200369030A1 (en) | 2020-11-26 |
GB2566309A (en) | 2019-03-13 |
WO2019048888A1 (en) | 2019-03-14 |
JP7174752B2 (ja) | 2022-11-17 |
EP3678867B1 (en) | 2021-12-15 |
EP3678867A1 (en) | 2020-07-15 |
GB201714507D0 (en) | 2017-10-25 |
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