JP2020532633A5 - - Google Patents
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- JP2020532633A5 JP2020532633A5 JP2020513550A JP2020513550A JP2020532633A5 JP 2020532633 A5 JP2020532633 A5 JP 2020532633A5 JP 2020513550 A JP2020513550 A JP 2020513550A JP 2020513550 A JP2020513550 A JP 2020513550A JP 2020532633 A5 JP2020532633 A5 JP 2020532633A5
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- Prior art keywords
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- alkyl
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- patterned
- coating
- Prior art date
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- 239000000203 mixture Substances 0.000 claims description 141
- 125000000217 alkyl group Chemical group 0.000 claims description 49
- 238000000576 coating method Methods 0.000 claims description 39
- 239000011248 coating agent Substances 0.000 claims description 37
- 125000003118 aryl group Chemical group 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 29
- 125000003545 alkoxy group Chemical group 0.000 claims description 28
- 229910052799 carbon Inorganic materials 0.000 claims description 26
- 150000002736 metal compounds Chemical class 0.000 claims description 25
- 239000000654 additive Substances 0.000 claims description 23
- 229910052739 hydrogen Inorganic materials 0.000 claims description 19
- 239000001257 hydrogen Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 17
- 229920002120 photoresistant polymer Polymers 0.000 claims description 17
- 229910052710 silicon Inorganic materials 0.000 claims description 17
- 239000010703 silicon Substances 0.000 claims description 17
- 125000002947 alkylene group Chemical group 0.000 claims description 16
- 229920005862 polyol Polymers 0.000 claims description 16
- 150000003077 polyols Chemical class 0.000 claims description 16
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- 238000012876 topography Methods 0.000 claims description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 6
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 125000001181 organosilyl group Chemical group [SiH3]* 0.000 claims description 5
- 125000005157 alkyl carboxy group Chemical group 0.000 claims description 4
- 125000004390 alkyl sulfonyl group Chemical group 0.000 claims description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- 229910044991 metal oxide Inorganic materials 0.000 claims description 4
- 150000004706 metal oxides Chemical class 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- 238000001020 plasma etching Methods 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 230000004888 barrier function Effects 0.000 claims description 2
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical group OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- -1 siloxane moiety Chemical group 0.000 claims 1
- 230000000996 additive effect Effects 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 12
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 0 CC(C)(C(C(CCCC1)C1C(O*)=O)=O)OC(C)(C)OC(CCCC1)(C1C(ON)=O)C=O Chemical compound CC(C)(C(C(CCCC1)C1C(O*)=O)=O)OC(C)(C)OC(CCCC1)(C1C(ON)=O)C=O 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 2
- VFFFESPCCPXZOQ-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol;oxirane Chemical compound C1CO1.OCC(CO)(CO)CO VFFFESPCCPXZOQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- UWHCKJMYHZGTIT-UHFFFAOYSA-N Tetraethylene glycol, Natural products OCCOCCOCCOCCO UWHCKJMYHZGTIT-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical group 0.000 description 1
- IYABWNGZIDDRAK-UHFFFAOYSA-N allene Chemical group C=C=C IYABWNGZIDDRAK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 125000005594 diketone group Chemical group 0.000 description 1
- 150000002148 esters Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000002576 ketones Chemical group 0.000 description 1
- 150000002596 lactones Chemical group 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000007725 thermal activation Methods 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762554695P | 2017-09-06 | 2017-09-06 | |
| US62/554,695 | 2017-09-06 | ||
| PCT/EP2018/073657 WO2019048393A1 (en) | 2017-09-06 | 2018-09-04 | AN INORGANIC OXIDE-CONTAINING VINYL DEPOSITION COMPOSITION USEFUL AS HARD MASKS AND FILLING MATERIALS HAVING ENHANCED THERMAL STABILITY |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020532633A JP2020532633A (ja) | 2020-11-12 |
| JP2020532633A5 true JP2020532633A5 (https=) | 2021-07-29 |
| JP6978594B2 JP6978594B2 (ja) | 2021-12-08 |
Family
ID=63524261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020513550A Active JP6978594B2 (ja) | 2017-09-06 | 2018-09-04 | 向上した熱安定性を有する、ハードマスク及び充填材料として有用なスピンオン無機酸化物含有組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US11042091B2 (https=) |
| JP (1) | JP6978594B2 (https=) |
| KR (1) | KR102399362B1 (https=) |
| CN (1) | CN111051570B (https=) |
| SG (1) | SG11202001741PA (https=) |
| TW (1) | TWI755564B (https=) |
| WO (1) | WO2019048393A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3559746B1 (en) * | 2016-12-21 | 2021-03-31 | Merck Patent GmbH | Composition of spin-on materials containing metal oxide nanoparticles and an organic polymer |
| JP7717721B2 (ja) * | 2020-04-17 | 2025-08-04 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 炭素材料、金属有機化合物および溶媒を含んでなるスピンコーティング組成物、および基板の上方への金属酸化物膜の製造方法 |
| JP2021190637A (ja) | 2020-06-03 | 2021-12-13 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | 基板洗浄液、これを用いる洗浄された基板の製造方法およびデバイスの製造方法 |
| KR102841479B1 (ko) | 2021-05-10 | 2025-07-31 | 삼성전자주식회사 | 반도체 장치의 제조 방법 |
| WO2023275221A1 (en) | 2021-07-02 | 2023-01-05 | Merck Patent Gmbh | Metal complexes for optical and microelectronic applications |
| KR102396715B1 (ko) * | 2021-10-21 | 2022-05-13 | 이근수 | 금속 함유 하드마스크 막의 제조 방법 및 레지스트 패턴 형성 방법 |
| JP2024097388A (ja) * | 2023-01-06 | 2024-07-19 | 信越化学工業株式会社 | 金属含有膜形成用化合物、金属含有膜形成用組成物、及びパターン形成方法 |
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-
2018
- 2018-09-04 TW TW107130962A patent/TWI755564B/zh active
- 2018-09-04 CN CN201880058075.1A patent/CN111051570B/zh active Active
- 2018-09-04 KR KR1020207010009A patent/KR102399362B1/ko active Active
- 2018-09-04 WO PCT/EP2018/073657 patent/WO2019048393A1/en not_active Ceased
- 2018-09-04 SG SG11202001741PA patent/SG11202001741PA/en unknown
- 2018-09-04 JP JP2020513550A patent/JP6978594B2/ja active Active
- 2018-09-04 US US16/643,290 patent/US11042091B2/en active Active
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