JP2020519029A5 - - Google Patents
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- Publication number
- JP2020519029A5 JP2020519029A5 JP2019560386A JP2019560386A JP2020519029A5 JP 2020519029 A5 JP2020519029 A5 JP 2020519029A5 JP 2019560386 A JP2019560386 A JP 2019560386A JP 2019560386 A JP2019560386 A JP 2019560386A JP 2020519029 A5 JP2020519029 A5 JP 2020519029A5
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- substrate
- power
- power semiconductor
- semiconductor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 27
- 238000001816 cooling Methods 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims 23
- 238000000465 moulding Methods 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 18
- 239000004020 conductor Substances 0.000 claims 5
- 238000000034 method Methods 0.000 claims 5
- 238000005266 casting Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 239000002826 coolant Substances 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP17169008.4 | 2017-05-02 | ||
| EP17169008 | 2017-05-02 | ||
| PCT/EP2018/061017 WO2018202615A1 (en) | 2017-05-02 | 2018-04-30 | Resin encapsulated power semiconductor module with exposed terminal areas |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020519029A JP2020519029A (ja) | 2020-06-25 |
| JP2020519029A5 true JP2020519029A5 (enExample) | 2021-03-04 |
| JP7030844B2 JP7030844B2 (ja) | 2022-03-07 |
Family
ID=58664584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019560386A Active JP7030844B2 (ja) | 2017-05-02 | 2018-04-30 | 露出した端子領域を有する樹脂封止パワー半導体モジュール |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10950516B2 (enExample) |
| EP (1) | EP3613075B1 (enExample) |
| JP (1) | JP7030844B2 (enExample) |
| CN (1) | CN110785838B (enExample) |
| WO (1) | WO2018202615A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE112018003850B4 (de) * | 2017-07-28 | 2023-04-27 | Mitsubishi Electric Corporation | Halbleitereinheit und halbleitermodul |
| US10796998B1 (en) * | 2019-04-10 | 2020-10-06 | Gan Systems Inc. | Embedded packaging for high voltage, high temperature operation of power semiconductor devices |
| US11342248B2 (en) | 2020-07-14 | 2022-05-24 | Gan Systems Inc. | Embedded die packaging for power semiconductor devices |
| DE102020124149A1 (de) * | 2020-09-16 | 2022-03-17 | Danfoss Silicon Power Gmbh | Leistungsmodul |
| EP4050645B1 (en) | 2021-02-24 | 2023-02-22 | Hitachi Energy Switzerland AG | Power semiconductor device and manufacturing method |
| EP4060724B1 (en) * | 2021-03-19 | 2023-08-23 | Hitachi Energy Switzerland AG | A power module comprising at least one semiconductor module, and a method for manufacturing a power module |
| JP7779690B2 (ja) * | 2021-09-24 | 2025-12-03 | ローム株式会社 | 半導体装置、及び半導体モジュール |
| KR20230131024A (ko) * | 2022-03-04 | 2023-09-12 | 현대자동차주식회사 | 차량용 파워 모듈 및 이의 제조 방법 |
| TWI787111B (zh) * | 2022-04-08 | 2022-12-11 | 強茂股份有限公司 | 具複合式針腳結構的封裝元件及其製法 |
| JP7771869B2 (ja) * | 2022-05-19 | 2025-11-18 | 株式会社デンソー | 半導体モジュールおよびその製造方法 |
| DE102022205490A1 (de) * | 2022-05-31 | 2023-11-30 | Rolls-Royce Deutschland Ltd & Co Kg | Thermische Schnittstellenmaterialien |
| US20240186218A1 (en) * | 2022-10-21 | 2024-06-06 | Semiconductor Components Industries, Llc | Molded power modules with fluidic-channel cooled substrates |
| EP4687170A1 (en) * | 2024-07-31 | 2026-02-04 | Hitachi Energy Ltd | Power semiconductor module and method for manufacturing a power semiconductor module |
Family Cites Families (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000196011A (ja) * | 1998-12-28 | 2000-07-14 | Mitsubishi Electric Corp | 電子装置及びその製造方法 |
| KR100608608B1 (ko) * | 2000-06-23 | 2006-08-09 | 삼성전자주식회사 | 혼합형 본딩패드 구조를 갖는 반도체 칩 패키지 및 그제조방법 |
| JP4070531B2 (ja) * | 2002-07-19 | 2008-04-02 | 株式会社日立製作所 | 半導体装置 |
| US20050062155A1 (en) * | 2003-09-24 | 2005-03-24 | Chung-Che Tsai | Window ball grid array semiconductor package and method for fabricating the same |
| US8039956B2 (en) * | 2005-08-22 | 2011-10-18 | Texas Instruments Incorporated | High current semiconductor device system having low resistance and inductance |
| JP5536975B2 (ja) * | 2007-01-31 | 2014-07-02 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 回路装置およびその製造方法 |
| JP2009246116A (ja) * | 2008-03-31 | 2009-10-22 | Yamaha Corp | リードフレーム及びパッケージ本体、パッケージ、半導体装置、並びにマイクロフォンパッケージ |
| DE102008001413A1 (de) | 2008-04-28 | 2009-10-29 | Robert Bosch Gmbh | Elektrische Leistungseinheit |
| WO2010004802A1 (ja) * | 2008-07-10 | 2010-01-14 | 三菱電機株式会社 | 電力用半導体モジュール |
| DE102008045615C5 (de) | 2008-09-03 | 2018-01-04 | Infineon Technologies Ag | Verfahren zur Herstellung eines Leistungshalbleitermoduls |
| JP5136458B2 (ja) * | 2009-02-20 | 2013-02-06 | ヤマハ株式会社 | 半導体パッケージ及びその製造方法 |
| DE102010001545A1 (de) | 2010-02-03 | 2011-08-04 | Robert Bosch GmbH, 70469 | Elektrische Kontaktierung von Leistungsmodulen |
| DE102010002945A1 (de) | 2010-03-17 | 2011-09-22 | Robert Bosch Gmbh | Schaltungsanordnung und zugehöriges steuergerät für ein kraftfahrzeug |
| JP2011228528A (ja) | 2010-04-21 | 2011-11-10 | Mitsubishi Electric Corp | パワーブロック及びそれを用いたパワー半導体モジュール |
| CN102354688A (zh) | 2011-10-11 | 2012-02-15 | 深圳市威怡电气有限公司 | 一种功率模块 |
| JP2014013848A (ja) * | 2012-07-05 | 2014-01-23 | Uacj Corp | 熱交換器 |
| JP5818102B2 (ja) * | 2012-07-13 | 2015-11-18 | 三菱電機株式会社 | 半導体装置の製造方法 |
| JP5741565B2 (ja) * | 2012-12-25 | 2015-07-01 | 三菱電機株式会社 | 半導体モジュール |
| JP6028592B2 (ja) * | 2013-01-25 | 2016-11-16 | 三菱電機株式会社 | 半導体装置 |
| US9666557B2 (en) * | 2013-05-30 | 2017-05-30 | Infineon Technologies Ag | Small footprint semiconductor package |
| JP6115505B2 (ja) * | 2013-06-21 | 2017-04-19 | 株式会社デンソー | 電子装置 |
| CN203394862U (zh) | 2013-08-12 | 2014-01-15 | 沃德(天津)传动有限公司 | 一种减速机及其风扇罩 |
| US9431394B2 (en) * | 2013-08-29 | 2016-08-30 | Infineon Technologies Ag | Power semiconductor package with gate and field electrode leads |
| WO2015039771A1 (en) * | 2013-09-17 | 2015-03-26 | Abb Technology Ag | Method for ultrasonic welding with particles trapping |
| DE102013219833B4 (de) * | 2013-09-30 | 2020-02-13 | Infineon Technologies Ag | Halbleitermodul mit leiterplatte und vefahren zur hertellung eines halbleitermoduls mit einer leiterplatte |
| KR102143890B1 (ko) | 2013-10-15 | 2020-08-12 | 온세미컨덕터코리아 주식회사 | 파워 모듈 패키지 및 이의 제조 방법 |
| KR20150060036A (ko) | 2013-11-25 | 2015-06-03 | 삼성전기주식회사 | 전력 반도체 모듈 및 그 제조 방법 |
| EP3089209B1 (en) | 2013-12-25 | 2019-12-04 | Mitsubishi Materials Corporation | Substrate for power module, method for manufacturing same, and power module |
| DE102014219998B4 (de) | 2014-10-02 | 2020-09-24 | Vitesco Technologies GmbH | Leistungsmodul, Leistungsmodulgruppe, Leistungsendstufe sowie Antriebssystem mit einer Leistungsendstufe |
| JP6053858B2 (ja) * | 2015-04-06 | 2016-12-27 | 三菱電機株式会社 | パワー半導体装置および車載用回転電機の駆動装置 |
| JP6482955B2 (ja) * | 2015-06-02 | 2019-03-13 | 昭和電工株式会社 | 液冷式冷却装置 |
| DE102015112451B4 (de) | 2015-07-30 | 2021-02-04 | Danfoss Silicon Power Gmbh | Leistungshalbleitermodul |
| US9728493B2 (en) * | 2015-08-28 | 2017-08-08 | Infineon Technologies Ag | Mold PackageD semiconductor chip mounted on a leadframe and method of manufacturing the same |
| EP3217774B1 (en) * | 2016-03-08 | 2018-06-13 | ABB Schweiz AG | Semiconductor module |
-
2018
- 2018-04-30 JP JP2019560386A patent/JP7030844B2/ja active Active
- 2018-04-30 CN CN201880044170.6A patent/CN110785838B/zh active Active
- 2018-04-30 WO PCT/EP2018/061017 patent/WO2018202615A1/en not_active Ceased
- 2018-04-30 EP EP18720271.8A patent/EP3613075B1/en active Active
-
2019
- 2019-11-04 US US16/673,201 patent/US10950516B2/en active Active
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