JP2020503526A5 - - Google Patents

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Publication number
JP2020503526A5
JP2020503526A5 JP2019537105A JP2019537105A JP2020503526A5 JP 2020503526 A5 JP2020503526 A5 JP 2020503526A5 JP 2019537105 A JP2019537105 A JP 2019537105A JP 2019537105 A JP2019537105 A JP 2019537105A JP 2020503526 A5 JP2020503526 A5 JP 2020503526A5
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JP
Japan
Prior art keywords
wafer
correction model
shape
thickness
transparent film
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JP2019537105A
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English (en)
Japanese (ja)
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JP2020503526A (ja
JP6917462B2 (ja
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Priority claimed from US15/649,259 external-priority patent/US10571248B2/en
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Publication of JP2020503526A5 publication Critical patent/JP2020503526A5/ja
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Publication of JP6917462B2 publication Critical patent/JP6917462B2/ja
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JP2019537105A 2017-01-09 2018-01-05 ウェハ形状測定方法及びシステム Active JP6917462B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762443815P 2017-01-09 2017-01-09
US62/443,815 2017-01-09
US15/649,259 2017-07-13
US15/649,259 US10571248B2 (en) 2017-01-09 2017-07-13 Transparent film error correction pattern in wafer geometry system
PCT/US2018/012673 WO2018129385A1 (en) 2017-01-09 2018-01-05 Transparent film error correction pattern in wafer geometry system

Publications (3)

Publication Number Publication Date
JP2020503526A JP2020503526A (ja) 2020-01-30
JP2020503526A5 true JP2020503526A5 (enExample) 2021-02-12
JP6917462B2 JP6917462B2 (ja) 2021-08-11

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ID=62782771

Family Applications (1)

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JP2019537105A Active JP6917462B2 (ja) 2017-01-09 2018-01-05 ウェハ形状測定方法及びシステム

Country Status (8)

Country Link
US (1) US10571248B2 (enExample)
EP (1) EP3549159B1 (enExample)
JP (1) JP6917462B2 (enExample)
KR (1) KR102301560B1 (enExample)
CN (1) CN110419098B (enExample)
SG (1) SG11201906177WA (enExample)
TW (1) TWI752146B (enExample)
WO (1) WO2018129385A1 (enExample)

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US10317198B2 (en) * 2016-09-30 2019-06-11 Kla-Tencor Corporation Three-dimensional mapping of a wafer
US11067902B2 (en) * 2017-08-07 2021-07-20 Asml Netherlands B.V. Computational metrology
EP3489619B1 (en) 2017-11-28 2025-08-13 Koh Young Technology Inc. Apparatus for inspecting substrate and method thereof
US10852125B2 (en) * 2017-11-28 2020-12-01 Koh Young Technology Inc. Apparatus for inspecting film on substrate by using optical interference and method thereof
US11112234B2 (en) * 2018-03-07 2021-09-07 Applejack 199 L.P. Multi-probe gauge for slab characterization
JP6402273B1 (ja) * 2018-05-18 2018-10-10 大塚電子株式会社 光学測定装置及び光学測定方法
US11049720B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Removable opaque coating for accurate optical topography measurements on top surfaces of transparent films
EP3918384A1 (en) * 2019-01-31 2021-12-08 King Abdullah University of Science and Technology Light processing device based on multilayer nano-elements
US20250044073A1 (en) * 2023-08-04 2025-02-06 Orbotech Ltd. Thin film thickness adjustments for three-dimensional interferometric measurements

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US5042949A (en) 1989-03-17 1991-08-27 Greenberg Jeffrey S Optical profiler for films and substrates
US5129724A (en) * 1991-01-29 1992-07-14 Wyko Corporation Apparatus and method for simultaneous measurement of film thickness and surface height variation for film-substrate sample
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
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US8068234B2 (en) 2009-02-18 2011-11-29 Kla-Tencor Corporation Method and apparatus for measuring shape or thickness information of a substrate
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EP3150959B1 (en) * 2015-10-02 2018-12-26 Soitec Method for measuring thickness variations in a layer of a multilayer semiconductor structure

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