TWI752146B - 在晶圓幾何系統中透明薄膜誤差校正型態 - Google Patents

在晶圓幾何系統中透明薄膜誤差校正型態 Download PDF

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Publication number
TWI752146B
TWI752146B TW107100588A TW107100588A TWI752146B TW I752146 B TWI752146 B TW I752146B TW 107100588 A TW107100588 A TW 107100588A TW 107100588 A TW107100588 A TW 107100588A TW I752146 B TWI752146 B TW I752146B
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Taiwan
Prior art keywords
wafer
calibration model
calibration
thickness
geometry
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TW107100588A
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English (en)
Chinese (zh)
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TW201839876A (zh
Inventor
海倫 劉
曾安
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美商克萊譚克公司
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Publication of TW201839876A publication Critical patent/TW201839876A/zh
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/045—Correction of measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mathematical Physics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Seats For Vehicles (AREA)
TW107100588A 2017-01-09 2018-01-08 在晶圓幾何系統中透明薄膜誤差校正型態 TWI752146B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201762443815P 2017-01-09 2017-01-09
US62/443,815 2017-01-09
US15/649,259 2017-07-13
US15/649,259 US10571248B2 (en) 2017-01-09 2017-07-13 Transparent film error correction pattern in wafer geometry system

Publications (2)

Publication Number Publication Date
TW201839876A TW201839876A (zh) 2018-11-01
TWI752146B true TWI752146B (zh) 2022-01-11

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW107100588A TWI752146B (zh) 2017-01-09 2018-01-08 在晶圓幾何系統中透明薄膜誤差校正型態

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Country Link
US (1) US10571248B2 (enExample)
EP (1) EP3549159B1 (enExample)
JP (1) JP6917462B2 (enExample)
KR (1) KR102301560B1 (enExample)
CN (1) CN110419098B (enExample)
SG (1) SG11201906177WA (enExample)
TW (1) TWI752146B (enExample)
WO (1) WO2018129385A1 (enExample)

Cited By (1)

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TWI793321B (zh) * 2018-05-18 2023-02-21 日商大塚電子股份有限公司 光學量測裝置及光學量測方法

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US10317198B2 (en) * 2016-09-30 2019-06-11 Kla-Tencor Corporation Three-dimensional mapping of a wafer
US11067902B2 (en) * 2017-08-07 2021-07-20 Asml Netherlands B.V. Computational metrology
EP3489619B1 (en) 2017-11-28 2025-08-13 Koh Young Technology Inc. Apparatus for inspecting substrate and method thereof
US10852125B2 (en) * 2017-11-28 2020-12-01 Koh Young Technology Inc. Apparatus for inspecting film on substrate by using optical interference and method thereof
US11112234B2 (en) * 2018-03-07 2021-09-07 Applejack 199 L.P. Multi-probe gauge for slab characterization
US11049720B2 (en) * 2018-10-19 2021-06-29 Kla Corporation Removable opaque coating for accurate optical topography measurements on top surfaces of transparent films
EP3918384A1 (en) * 2019-01-31 2021-12-08 King Abdullah University of Science and Technology Light processing device based on multilayer nano-elements
US20250044073A1 (en) * 2023-08-04 2025-02-06 Orbotech Ltd. Thin film thickness adjustments for three-dimensional interferometric measurements

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TW201638153A (zh) * 2015-03-24 2016-11-01 Konica Minolta Inc 聚醯亞胺系光學薄膜、其製造方法及有機電致發光顯示器

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US5129724A (en) * 1991-01-29 1992-07-14 Wyko Corporation Apparatus and method for simultaneous measurement of film thickness and surface height variation for film-substrate sample
US7324214B2 (en) * 2003-03-06 2008-01-29 Zygo Corporation Interferometer and method for measuring characteristics of optically unresolved surface features
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TW200909845A (en) * 2007-06-28 2009-03-01 Microsharp Corp Ltd Optical film
TW200938501A (en) * 2007-11-02 2009-09-16 Agc Flat Glass Na Inc Transparent conductive oxide coating for thin film photovoltaic applications and methods of making the same
TW201638153A (zh) * 2015-03-24 2016-11-01 Konica Minolta Inc 聚醯亞胺系光學薄膜、其製造方法及有機電致發光顯示器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793321B (zh) * 2018-05-18 2023-02-21 日商大塚電子股份有限公司 光學量測裝置及光學量測方法

Also Published As

Publication number Publication date
WO2018129385A1 (en) 2018-07-12
US20180195855A1 (en) 2018-07-12
KR20190097281A (ko) 2019-08-20
TW201839876A (zh) 2018-11-01
CN110419098B (zh) 2021-02-02
CN110419098A (zh) 2019-11-05
EP3549159A1 (en) 2019-10-09
JP2020503526A (ja) 2020-01-30
US10571248B2 (en) 2020-02-25
JP6917462B2 (ja) 2021-08-11
EP3549159A4 (en) 2020-09-09
EP3549159B1 (en) 2024-08-07
KR102301560B1 (ko) 2021-09-10
SG11201906177WA (en) 2019-08-27

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