JP2020186153A - 半導体層の成長方法、半導体装置の製造方法、及び、バルク結晶の製造方法 - Google Patents
半導体層の成長方法、半導体装置の製造方法、及び、バルク結晶の製造方法 Download PDFInfo
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Abstract
Description
14 :半導体層
16 :結晶欠陥
18 :切断線
20 :切片
24 :半導体層
26 :切断線
28 :切片
30 :半導体層
Claims (16)
- 半導体層の成長方法であって、
表面に結晶層が露出する基板の前記表面に、前記結晶層とは材料と結晶構造の少なくとも一方が異なる第1半導体層を成長させる工程と、
前記第1半導体層をその表面からその裏面まで横切るように切断する工程と、
前記第1半導体層の切断面に、前記第1半導体層と材料及び結晶構造が等しい第2半導体層を成長させる工程、
を有する成長方法。 - 前記第1半導体層を成長させた後であって前記第2半導体層を成長させる前に、前記第1半導体層から前記基板を除去する工程をさらに有する請求項1の成長方法。
- 前記基板が、ベース層を有しており、
前記結晶層が、前記ベース層の表面を覆っている、
請求項1または2の成長方法。 - 前記第1半導体層と前記第2半導体層が準安定状態の材料により構成されている請求項1〜3のいずれか一項の成長方法。
- 前記結晶層が、α型酸化アルミニウムまたはα型酸化鉄により構成されており、
前記第1半導体層と前記第2半導体層が、α型酸化ガリウムにより構成されている、
請求項4の成長方法。 - 前記結晶層が、α型酸化アルミニウム、窒化ガリウム、窒化アルミニウム、炭化シリコン、イットリア安定化ジルコニア、酸化マグネシウム、酸化ニッケル、チタン酸ストロンチウム、ニオブ酸リチウム、タンタル酸リチウム、酸化スズ、酸化チタン、β型酸化ガリウム、または、ガドリニウムガリウムガーネットにより構成されており、
前記第1半導体層と前記第2半導体層が、ε型酸化ガリウムにより構成されている、
請求項4の成長方法。 - 前記結晶層が、スピネルにより構成されており、
前記第1半導体層と前記第2半導体層が、γ型酸化ガリウムにより構成されている、
請求項4の成長方法。 - 前記結晶層が、シリコン、α型酸化アルミニウム、窒化アルミニウム、または、炭化シリコンにより構成されており、
前記第1半導体層と前記第2半導体層が、窒化ガリウムにより構成されている、
請求項1〜4のいずれか一項の成長方法。 - 前記第2半導体層をハイドライド気相成長法によって成長させる請求項1〜8のいずれか一項の成長方法。
- 前記第2半導体層をミストCVD法によって成長させる請求項1〜8のいずれか一項の成長方法。
- 前記第2半導体層にドーパントがドープされる請求項1〜10のいずれか一項の成長方法。
- 前記第1半導体層の前記切断面を研磨する工程をさらに有し、
研磨後の前記第1半導体層の前記切断面に、前記第2半導体層を成長させる、
請求項1〜11のいずれか一項の成長方法。 - 前記第2半導体層をその表面からその裏面まで横切るように切断する工程と、
前記第2半導体層の切断面に、前記第2半導体層と材料及び結晶構造が等しい第3半導体層を成長させる工程、
をさらに有する請求項1〜12のいずれか一項の成長方法。 - 前記第2半導体層を成長させた後であって前記第3半導体層を成長させる前に、前記第2半導体層から前記第1半導体層を除去する工程をさらに有する請求項13の成長方法。
- 請求項1〜12のいずれか一項の成長方法によって形成された前記第2半導体層、または、請求項13若しくは14の成長方法によって形成された前記第3半導体層を用いて半導体装置を製造する前記半導体装置の製造方法。
- 請求項1〜12のいずれか一項の成長方法によって形成された前記第2半導体層、または、請求項13若しくは14の成長方法によって形成された前記第3半導体層を種結晶としてバルク結晶を成長させる前記バルク結晶の製造方法。
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JP2019092449A JP2020186153A (ja) | 2019-05-15 | 2019-05-15 | 半導体層の成長方法、半導体装置の製造方法、及び、バルク結晶の製造方法 |
US16/859,160 US11443944B2 (en) | 2019-05-15 | 2020-04-27 | Method of growing semiconductor layers, method of manufacturing semiconductor device, and method of growing balk crystal |
DE102020112206.3A DE102020112206A1 (de) | 2019-05-15 | 2020-05-06 | Verfahren zum Aufwachsen von Halbleiterschichten, Verfahren zum Herstellen einer Halbleitervorrichtung und Verfahren zum Aufwachsen eines Volumenkristalls |
CN202010409492.5A CN111952148A (zh) | 2019-05-15 | 2020-05-14 | 半导体层的生长方法、半导体装置的制造方法、以及体单晶的制造方法 |
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JP2002029897A (ja) * | 2000-07-10 | 2002-01-29 | Sumitomo Electric Ind Ltd | 単結晶GaN基板の製造方法と単結晶GaN基板 |
JP2006290671A (ja) * | 2005-04-08 | 2006-10-26 | Hitachi Cable Ltd | Iii−v族窒化物半導体結晶の製造方法 |
JP2006315947A (ja) * | 2005-04-11 | 2006-11-24 | Nichia Chem Ind Ltd | 窒化物半導体ウエハ及びその製造方法 |
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JP3772816B2 (ja) * | 2002-09-24 | 2006-05-10 | 昭和電工株式会社 | 窒化ガリウム結晶基板、その製造方法、窒化ガリウム系半導体素子および発光ダイオード |
US20070134833A1 (en) * | 2005-12-14 | 2007-06-14 | Toyoda Gosei Co., Ltd. | Semiconductor element and method of making same |
US9404197B2 (en) * | 2008-07-07 | 2016-08-02 | Soraa, Inc. | Large area, low-defect gallium-containing nitride crystals, method of making, and method of use |
JP5529420B2 (ja) * | 2009-02-09 | 2014-06-25 | 住友電気工業株式会社 | エピタキシャルウエハ、窒化ガリウム系半導体デバイスを作製する方法、窒化ガリウム系半導体デバイス、及び酸化ガリウムウエハ |
JP5491065B2 (ja) * | 2009-04-30 | 2014-05-14 | 住友電気工業株式会社 | ウエハ生産物を作製する方法、及び窒化ガリウム系半導体光素子を作製する方法 |
JP5758116B2 (ja) * | 2010-12-16 | 2015-08-05 | 株式会社ディスコ | 分割方法 |
CN103531447B (zh) * | 2012-07-06 | 2016-03-16 | 中国科学院金属研究所 | 一种降低氮化镓纳米线阵列晶体缺陷密度的方法 |
JP5865440B2 (ja) * | 2014-06-30 | 2016-02-17 | 株式会社タムラ製作所 | β−Ga2O3系単結晶基板の製造方法 |
JP6945119B2 (ja) | 2014-11-26 | 2021-10-06 | 株式会社Flosfia | 結晶性積層構造体およびその製造方法 |
WO2016132815A1 (ja) * | 2015-02-18 | 2016-08-25 | 国立大学法人東北大学 | 窒化物半導体自立基板作製方法 |
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JP2002029897A (ja) * | 2000-07-10 | 2002-01-29 | Sumitomo Electric Ind Ltd | 単結晶GaN基板の製造方法と単結晶GaN基板 |
JP2006290671A (ja) * | 2005-04-08 | 2006-10-26 | Hitachi Cable Ltd | Iii−v族窒化物半導体結晶の製造方法 |
JP2006315947A (ja) * | 2005-04-11 | 2006-11-24 | Nichia Chem Ind Ltd | 窒化物半導体ウエハ及びその製造方法 |
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DE102020112206A1 (de) | 2020-11-19 |
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