JP2020184045A - Direct drawing type exposure device - Google Patents

Abstract

To provide a practical direct drawing type exposure device which can expose various sizes of substrates with light while sufficiently vacuum-sucking the substrates to a stage.SOLUTION: A substrate S is mounted on a stage 2 formed with a large number of vacuum suction holes 21 and is vacuum-sucked. When an exposure stage 2 for an exposure pattern light by an exposure unit 1 is moved by a conveyance system 3 and passes through an exposure area, the stage is irradiated with the exposure pattern light by the exposure unit 1 and is exposed with the light. The large number of vacuum suction holes 21 are formed corresponding to the substrate S having the largest size, and the vacuum suction hole 21 not blocked with the substrate S is blocked with a sheet 71. The sheet 71 has a suction hole 73 or openings 75 and 76, and vacuum suction of the substrate S is not blocked by positioning of a sheet mechanism 72. The sheet 71 and the sheet mechanism 72 are mounted on the stage 2, and are moved integrally with the stage 2.SELECTED DRAWING: Figure 1

Description

The invention of this application relates to a direct drawing type exposure apparatus that irradiates a substrate with a predetermined pattern of light to expose it without using a mask. Hereinafter, a predetermined pattern of light in exposure is referred to as an exposure pattern.

An exposure technique for exposing an object having a photosensitive layer formed on its surface to expose the photosensitive layer is actively used as a main technique of photolithography for forming various fine circuits and fine structures. A typical exposure technique is to irradiate a mask on which a pattern similar to the exposure pattern is formed with light, and project the image of the mask onto the surface of the object so that the light of the exposure pattern is applied to the object. It is a technology to do.

Apart from the exposure technique using such a mask, a technique is known in which an image is directly formed on the surface of an object and exposed by using a spatial light modulator. Hereinafter, this technique will be referred to as direct drawing exposure in the present specification.
In direct exposure, a typical spatial light modulator is a DMD (Digital Mirror Device). The DMD has a structure in which minute square mirrors are arranged in a right-angled grid pattern. Each mirror is designed so that the angle with respect to the optical axis is controlled independently, and it takes a posture in which the light from the light source is reflected to reach the object and a posture in which the light from the light source does not reach the object. It is supposed to get. The DMD includes a controller that controls each mirror, and the controller controls each mirror according to an exposure pattern so that the surface of the object is irradiated with the light of the exposure putter.

In the case of direct drawing type exposure, since a mask is not used, an advantage is exhibited in high-mix low-volume production. In the case of exposure using a mask, it is necessary to prepare a mask for each product type, which requires a large cost including the cost of storing the mask. In addition, when replacing the mask for the production of different types, it is necessary to stop the operation of the device, and it takes time and effort to restart the operation. Therefore, it causes a decrease in productivity. On the other hand, in the case of direct drawing type exposure, it is only necessary to prepare a control program for each mirror for each type, and when manufacturing different types, it is possible to respond only by changing the control program, which is cost effective and productive. The superiority of is remarkable. Further, it is possible to finely adjust the exposure pattern for each substrate as needed, which is excellent in process flexibility.

In such a direct drawing type exposure apparatus, a stage on which the substrate is placed is used in order to make the substrate vertical to the optical axis of the exposure unit having a built-in spatial light modulator. The exposure unit irradiates the set area (hereinafter referred to as the exposure area) with the light of the exposure pattern, and the stage on which the substrate is placed moves through the exposure area by the transport system to move the exposure area. The substrate is exposed as it passes through.

Japanese Unexamined Patent Publication No. 2008-191303

In the above-mentioned direct drawing type exposure apparatus, in order to improve the exposure accuracy, a configuration in which the substrate is vacuum-adsorbed to the stage is adopted. A large number of vacuum suction holes are formed on the stage, and each vacuum suction hole is connected to a vacuum pump. By operating the vacuum pump, the substrate is evacuated to the stage.

Vacuum adsorption of the substrate has two purposes. One is to prevent the displacement of the substrate. In many cases, the substrate is placed on the stage in an aligned state. If the substrate shifts on the stage after alignment, the exposure pattern will not be formed at the correct position and the exposure accuracy will decrease. Therefore, the substrate is vacuum-adsorbed to the stage. Another purpose of vacuum suction is to correct the deformation of the substrate. The substrate may be deformed such as warped. If exposed as it is, the formed exposure pattern will also be distorted, which may cause product defects. Therefore, the deformation is corrected by vacuum adsorption on the stage, and the exposure is performed in that state.

The direct drawing type exposure apparatus that performs such vacuum adsorption has a unique problem in relation to its superiority of being suitable for high-mix low-volume production. This point will be described below.
High-mix low-volume production means that there are various sizes of substrates as objects to be exposed. It is technically difficult to perform good vacuum adsorption on such substrates of various sizes.

When the exposure process is performed while vacuum-sucking on substrates of various sizes, a configuration in which vacuum suction holes are provided on the stage according to the smallest size substrate is usually adopted. If a vacuum suction hole is provided according to a large size substrate, a vacuum suction hole that is not blocked by the substrate is created when processing a small size substrate. If the vacuum suction holes are not closed, a sufficient negative pressure cannot be obtained in the exhaust system, and a sufficient suction force cannot be obtained even in the vacuum suction holes closed by the substrate. Therefore, a vacuum suction hole is provided according to the smallest size substrate.

However, if the vacuum suction holes are provided according to the smallest size substrate, vacuum suction will not be performed in the peripheral portion of the substrate when processing a larger size substrate. The problem in this case is when there is warpage in the peripheral portion of the substrate. Warping can cause the substrate to separate from the stage at the periphery, resulting in vacuum leaking from that portion. If this happens, the vacuum suction will be insufficient as well. Further, when the peripheral portion of the substrate is used as a product for the reason of increasing the mounting density, an exposure pattern is formed also in the peripheral portion, but if the warp is not eliminated, a product defect is likely to occur. Further, providing the vacuum suction holes according to the smallest size substrate means that when processing a large size substrate, the area of vacuum suction is relatively small with respect to the size of the substrate, and the whole is The adsorptive power as a result is also relatively reduced.

As a configuration for solving the above problems, a configuration is conceivable in which the vacuum exhaust path system in the stage is divided into a plurality of systems, and each system is individually controlled to turn on / off the vacuum according to the size of the substrate. However, in this configuration, the structure inside the stage becomes complicated, and the structure of the vacuum exhaust also becomes complicated. In addition, even if it is possible to deal with the difference in substrate size of about 2 to 3 types, the difference beyond that will not be too complicated and complicated, and the equipment cost will increase. Therefore, it is a practical device. It cannot be said.
The invention of this application has been made to solve the above-mentioned problems of the direct drawing type exposure apparatus related to the vacuum adsorption of the substrate, and is practically capable of exposing substrates of various sizes to the stage while sufficiently vacuum-adsorbing them. An object of the present invention is to provide a direct drawing type exposure apparatus.

In order to solve the above problems, the invention of the present application is a direct drawing type exposure apparatus that irradiates a substrate with a predetermined pattern of light without a mask to expose the substrate, and irradiates the exposure area with a predetermined pattern of light. A stage in which a large number of vacuum suction holes for vacuum-sucking the substrate to be mounted are formed, a transport system for moving the stage on which the substrate is mounted through the exposure area, and a substrate in which the suction holes are vacuum-sucked. It is provided with an exhaust system that evacuates the light to the stage and a suction hole closing means that closes the suction holes that are not blocked by the substrate among a large number of suction holes. The suction hole closing means includes a long sheet wound in a roll shape and a sheet mechanism for feeding and winding the sheet, and the sheet mechanism is a mechanism for keeping the sheet in a state that does not hinder the vacuum suction of the substrate. The seat and the seat mechanism are attached to the stage so as to move integrally with the stage by the transport system.
Further, in order to solve the above problems, the sheet may be formed with a suction hole overlapping the vacuum suction hole closed by the substrate or an opening corresponding to the size of the substrate so as not to hinder the vacuum suction of the substrate.
Further, in order to solve the above problems, the direct drawing type exposure apparatus has a plurality of hole groups having a plurality of suction holes in the sheet and different sizes of the entire arrangement area, or a plurality of different sizes corresponding to different sizes of the substrate. Apertures are formed, and a plurality of hole groups or a plurality of openings are formed along the length direction of the sheet, and one of the plurality of hole groups or one of the plurality of openings is the size of the substrate. It may have a configuration in which a control unit for controlling the seat mechanism is provided so that the selected hole group or the selected opening is positioned at a predetermined position with respect to the stage when the selected holes are selected together.
Further, in order to solve the above problems, in the direct drawing type exposure apparatus, the sheet is composed of a plurality of suction holes and a plurality of hole groups having different sizes of the entire arrangement area are formed, and the plurality of hole groups are the sheets. When one of a plurality of hole groups is selected according to the size of the substrate, each suction hole of the selected hole group is formed of each vacuum suction hole of the stage. It may have a configuration in which a control unit for controlling the seat mechanism is provided so as to be located at a position overlapping the seat mechanism.
Further, in order to solve the above problems, in the direct drawing type exposure apparatus, a plurality of openings of different sizes corresponding to different sizes of the substrate are formed on the sheet, and the plurality of openings are formed along the length direction of the sheet. Each opening is formed and is larger than the size of the corresponding substrate, and the stage has a set mounting position as a position for mounting the substrate, and one opening corresponding to the size of the substrate. It is possible to have a configuration in which a control unit for controlling the seat mechanism is provided so that the substrate mounted at the set mounting position when is selected is located within the selected opening.
Further, in order to solve the above problems, in the direct drawing type exposure apparatus, a plurality of openings of different sizes corresponding to different sizes of the substrate are formed on the sheet, and the plurality of openings are formed along the length direction of the sheet. Each opening is formed and is smaller than the size of the corresponding substrate, and the stage has a set mounting position as a position for mounting the substrate, and one opening corresponding to the size of the substrate. It may have a configuration in which a control unit for controlling the seat mechanism is provided so that the peripheral edge of the selected opening is placed on the peripheral portion of the substrate mounted at the set mounting position when is selected.
Further, in order to solve the above problems, the direct drawing type exposure apparatus is provided with a removable opening in the sheet in addition to an opening smaller than the size of the corresponding substrate, and the removable opening is larger than that of the largest size substrate. It has a large opening, and the control unit has a configuration in which the attachment / detachment opening is positioned at a position facing the set mounting position of the stage when the substrate is mounted on the stage and the board is removed from the stage. obtain.

As described below, according to the direct drawing exposure apparatus of the present application, the suction hole sealing means closes the vacuum suction holes that are not blocked by the substrate when processing a small substrate, so that sufficient vacuum suction is performed. .. Therefore, a practical direct drawing type exposure apparatus capable of performing highly accurate exposure processing while supporting high-mix low-volume production is provided. Further, since the sheet mechanism is provided, the sheet can be arranged easily and quickly, and the productivity does not decrease. Further, since the seat and the seat mechanism are attached to the stage, the mechanism related to the movement of the stage is not complicated and large-scale.
Further, the sheet is provided with an opening smaller than the size of the corresponding substrate, and the sheet mechanism is provided so that the peripheral edge of the selected opening is placed on the peripheral portion of the substrate with respect to the substrate mounted at the set mounting position. In the configuration in which is controlled, in addition to the above effects, the sheet suppresses the peripheral portion of the substrate, so that even if the substrate is warped, vacuum suction is reliably performed and deterioration of exposure accuracy is prevented.

It is a front schematic view of the direct drawing type exposure apparatus of 1st Embodiment. It is the schematic of the exposure head mounted on the apparatus of FIG. It is a perspective view which showed about the exposure area. It is the schematic which showed the structure of a stage. It is a top view which showed the layout of a large number of vacuum suction holes in the apparatus of embodiment. It is a plan schematic diagram which showed the structure of the closing sheet in 1st Embodiment. It is a perspective schematic diagram which showed the selection and positioning of the hole group in the closing sheet in 1st Embodiment. It is a side schematic view which showed the structure of a seat mechanism and the attachment structure of a closed seat and a seat mechanism. It is a plan schematic diagram which showed the structure of the closing sheet in 2nd Embodiment. It is a perspective schematic view which showed the operation of the suction hole closing means in 2nd Embodiment. It is a front sectional schematic diagram which showed the operation of the suction hole closing means in 2nd Embodiment. It is a plan schematic diagram which showed the structure of the closing sheet in 3rd Embodiment. It is a front sectional schematic diagram which showed the operation of the suction hole closing means in 3rd Embodiment.

Next, an embodiment (embodiment) for carrying out the invention of this application will be described.
FIG. 1 is a front schematic view of the direct drawing type exposure apparatus of the first embodiment. This device is a device that irradiates a substrate with light of an exposure pattern without a mask to expose the substrate. As shown in FIG. 1, the direct drawing type exposure apparatus includes an exposure head 1 that irradiates an exposure area with light of an exposure pattern, a stage 2 on which a substrate S is mounted, and a stage 2 on which the substrate S is mounted. It is provided with a transport system 3 that moves through the exposure area.

FIG. 2 is a schematic view of the exposure head 1 mounted on the apparatus of FIG. The exposure head 1 has a cylindrical shape as a whole, is arranged in a vertically standing state, and emits light downward. FIG. 2 is a schematic view showing the internal structure of the exposure head 1. As shown in FIG. 2, the exposure head 1 has a light source 11, a spatial light modulator 12 that spatially modulates the light from the light source 11, and optics that project an image of light modulated by the spatial light modulator 12. A system (hereinafter, projection optical system) 13 and the like are provided.

As the light source 11, a light source that outputs light having an optimum wavelength according to the photosensitive wavelength of the photosensitive layer on the substrate S is used. The photosensitive wavelength of the resist film is often in the visible short wavelength region to the ultraviolet region, and as the light source 11, a light source that outputs light in the visible short wavelength region to the ultraviolet region such as 405 nm or 365 nm is used. Further, in order to utilize the performance of the spatial light modulator 12, it is preferable that the spatial light modulator 12 outputs coherent light, and therefore the laser light source 11 is preferably used. For example, a gallium nitride (GaN) -based semiconductor laser is used.

As the spatial light modulator 12, a DMD is used in this embodiment. As mentioned above, in the DMD, each pixel is a minute mirror. The mirror (hereinafter referred to as a pixel mirror) is, for example, a square mirror having a size of about 13.68 μm square, and has a structure in which a large number of pixel mirrors are arranged in a right-angled grid pattern. The number of sequences is, for example, 1024 x 768.

The spatial light modulator 12 includes a modulator controller 121 that controls each pixel mirror. The exposure apparatus of the embodiment includes a main control unit 9 that controls the whole. The modulator controller 121 controls each pixel mirror according to the signal from the main control unit 9. Each pixel mirror uses a plane on which each pixel mirror is arranged as a reference plane, and has a first posture along the reference plane and a second posture tilted at, for example, about 11 to 13 ° with respect to the reference plane. You can take a posture. In this embodiment, the first posture is in the off state and the second posture is in the on state.
The spatial light modulator 12 includes a drive mechanism for driving each pixel mirror, and the modulator controller 121 independently controls whether to take the first posture or the second posture for each pixel mirror. You can do it. Such a spatial light modulator 12 is available from Texas Instruments.

As shown in FIG. 2, the exposure head 1 includes an irradiation optical system 14 that irradiates such a spatial light modulator 12 with light from a light source 11. In this embodiment, the irradiation optical system 14 includes an optical fiber 141. In order to form an image with higher illuminance, one exposure head 1 is provided with a plurality of light sources 11, and an optical fiber 141 is provided for each light source 11. As the optical fiber 141, for example, a quartz-based multimode fiber is used.

In order to form an image with high accuracy using the spatial light modulator 12 which is a DMD, it is desirable that parallel light is incident and reflected by each pixel mirror, and the light is obliquely emitted to each pixel mirror. It is desirable to make it incident. Therefore, as shown in FIG. 2, the irradiation optical system 14 includes a collimator lens 142 that makes the light emitted from each optical fiber 141 and spread as parallel light.

The projection optical system 13 is composed of two projection lens groups 131 and 132 and a microlens array (hereinafter abbreviated as MLA) 133 and the like arranged between the projection lens groups 131 and 132. The MLA 133 is supplementarily arranged in order to perform exposure with higher shape accuracy. The MLA 133 is an optical component in which a large number of minute lenses are arranged in a right-angled grid pattern. Each lens element has a one-to-one correspondence with each pixel mirror of the spatial light modulator 12.

In the exposure head 1 described above, the light from the light source 11 is guided by the optical fiber 141 and then incident on the spatial light modulator 12 by the irradiation optical system 14. At this time, each pixel mirror of the spatial light modulator 12 is controlled by the modulator controller 121, and the posture is selectively tilted according to the exposure pattern. That is, according to the exposure pattern, the pixel mirrors located at positions where the light should reach the exposure area are turned on, and the other pixel mirrors are turned off. The light reflected by the pixel mirror in the off state does not reach the exposure area, and only the light reflected by the pixel mirror in the on state reaches. Therefore, the light of the exposure pattern is applied to the exposure area.

A plurality of such exposure heads 1 are provided. As shown in FIG. 2, eight exposure heads 1 are provided in this embodiment. The eight exposure heads 1 form one exposure pattern as a whole. Each exposure head 1 has the same configuration.
The exposed area will be supplemented with reference to FIG. FIG. 3 is a schematic perspective view showing an exposure area. In FIG. 3, a region (hereinafter referred to as an individual area) E that can be irradiated with light by one exposure head 1 is shown by a square frame. A group of individual areas E is an exposure area.
The substrate S receives light irradiation in each individual area E while moving in the direction indicated by the arrow in FIG. At this time, since the two rows of exposure heads 1 are arranged so as to be offset from each other, exposure is performed without a gap even in the horizontal direction perpendicular to the moving direction.

In reality, each individual area E is a collection of minute irradiation patterns (hereinafter referred to as minute patterns). One minute pattern is a pattern by one pixel mirror. The substrate S mounted on the stage 2 moves in the exposure area as the stage 2 moves, and the minute pattern is turned on and off in a predetermined sequence according to the timing of the movement. As a result, a desired exposure pattern is formed on the substrate S.

As shown in FIG. 1, the direct drawing exposure apparatus of this embodiment includes two stages 2. FIG. 4 is a schematic view showing the structure of the stage 2. The stage 2 is a trapezoidal member on which the substrate S is placed on a flat upper surface. As shown in FIG. 4, a vacuum suction hole 21 is formed on the upper surface of the stage 2. Each vacuum suction hole 21 is connected to the exhaust system 4 via an exhaust passage 22 formed in the stage 2. The exhaust system 4 includes a vacuum pump, and when the exhaust system 4 operates, each vacuum suction hole 21 is sucked through the exhaust passage 22, and the mounted substrate S is vacuum sucked on the stage 2.

The transport system 3 includes a linear guide 31 arranged through the exposure area and a linear drive source (not shown) that linearly moves each stage 2 along the linear guide 31. As shown in FIG. 1, each stage 2 is mounted on a pedestal 32. The pedestal 32 can be moved along the linear guide 31. Each pedestal 32 is provided with a linear drive source (not shown). For example, a linear motor is used as the linear drive source, and a linear motor stage configuration can be adopted. When the linear drive source operates, the stage 2 moves integrally with the pedestal 32, whereby the substrate S on the stage 2 is conveyed. In this example, the linear guide 31 is shared by the pair of stages 2, and each pedestal 32 moves on the same orbit.

The standby positions (left standby position and right standby position) are set on both sides away from the exposure area. A transfer unit 5 is arranged at each standby position. In this example, the substrate S to be exposed is carried by the conveyor 50, and the exposed substrate S is housed in a rack (not shown). The transfer unit 5 is configured to load the substrate S on the stage 2 from the conveyor 50 and unload the exposed substrate S by removing it from the stage 2 and accommodating it in a rack.

The transfer units 5 on both sides have the same configuration, and include a transfer hand 52 having a suction pad 51 and a hand drive mechanism 53 for moving the transfer hand 52 up and down, front and back, left and right. A plurality of suction pads 51 are provided in a downwardly oriented posture, and the substrate S can be sucked and held by vacuum suction.

Further, the direct drawing type exposure apparatus includes an alignment means for forming an exposure pattern at a predetermined position on the substrate S. The alignment means includes a pre-alignment mechanism for mounting the substrate S at a predetermined position with respect to each stage 2, and an alignment sensor for detecting the mounting position of the substrate S in the pre-aligned state.
The alignment sensor is an image sensor 6 that captures an alignment mark on the substrate S. The pre-alignment mechanism is a mechanism for the image sensor 6 to position the alignment mark within the image-capable area. As the prealignment mechanism, the transfer unit 5 is also used. For example, pre-alignment is performed by pressing the substrate S against the backing plate set at a predetermined position and the transfer hand 52 holding the substrate S again. By prealignment, the substrate S is placed in a state of being positioned with respect to the stage 2.

As shown in FIG. 1, the direct drawing type exposure apparatus includes a main control unit 9 that controls each unit. The main control unit 9 is equipped with a main sequence program 91 that operates each unit in a predetermined sequence.
Further, the main control unit 9 is equipped with an exposure pattern program 92 that sends a control signal to each modulator controller 121 so that a predetermined exposure pattern is achieved. The exposure pattern program 92 is created in advance based on the design information of what kind of circuit is formed on the substrate S, and is stored in the storage unit 90 of the main control unit 9.

Further, an alignment program (not shown) constituting the alignment means is mounted on the main control unit 9. The imaging data of the alignment mark captured by the image sensor 6 as the alignment sensor is sent to the main control unit 9. The alignment program processes the imaging data to calculate the formation position of the exposure pattern, and rewrites the exposure pattern program 92 accordingly.
The main control unit 9 includes an input unit 901. In the input unit 901, various information such as information on the type of the substrate S to be exposed is input.

The direct drawing type exposure apparatus of such an embodiment is provided with a suction hole closing means in order to have a practical vacuum suction configuration corresponding to high-mix low-volume production. The suction hole closing means includes a long sheet 71 wound in a roll shape and a sheet mechanism 72 for feeding and winding the sheet 71. Hereinafter, the suction hole closing means will be described.

First, the layout of a large number of vacuum suction holes 21 in the apparatus of the embodiment will be described. FIG. 5 is a schematic plan view showing the layout of a large number of vacuum suction holes in the apparatus of the embodiment.
As described above, in the case of high-mix low-volume production, the vacuum suction holes 21 are usually formed in accordance with the smallest size substrate. That is, when there are three substrates S1, S2, and S3 having different sizes, as shown in FIG. 5 (1), a large number of vacuum suction holes 21 are laid out according to the smallest substrate S3. That is, a large number of vacuum suction holes 21 are provided at equal intervals in a square region slightly smaller than the size of the substrate S3.

On the other hand, in the direct drawing type exposure apparatus of the embodiment, as shown in FIG. 5 (2), a large number of vacuum suction holes 21 are laid out according to the largest substrate S1. That is, a large number of vacuum suction holes 21 are provided at equal intervals in a square region slightly smaller than the size of the substrate S1.
As described above, in the direct drawing type exposure apparatus of the embodiment, the vacuum suction hole 21 is provided according to the substrate having the largest size. However, in this configuration, as described above, when processing a substrate having a small size, a vacuum is provided. It can be a leak. In order to solve this problem, the direct drawing type exposure apparatus of the embodiment includes a suction hole closing means. As shown in FIG. 1, the suction hole closing means includes a long sheet 71 wound in a roll shape and a sheet mechanism 72 for feeding and winding the sheet 71.

The sheet 71 is used to close the vacuum suction hole 21 in which the substrate S is not closed. That is, when processing a small-sized substrate S, a vacuum suction hole 21 that is not closed by the substrate S appears, and the sheet 71 is for closing the vacuum suction hole 21. Hereinafter, the sheet 71 is paraphrased as a closed sheet. A sheet made of a flexible and airtight material can be used as the closing sheet 71 without particular limitation, and for example, a sheet made of PET (Polyethylene terephthalate) can be used. The thickness may be, for example, about 0.15 mm to 0.3 mm.

FIG. 6 is a schematic plan view showing the configuration of the closing sheet according to the first embodiment. The closing sheet 71 is a long one wrapped in a roll, but in FIG. 6, a state in which the closing sheet 71 is pulled out for a long time is drawn for the purpose of explaining the structure.
In this embodiment, the closing sheet 71 needs to be one that does not hinder the vacuum adsorption of the substrate S. Although there are several possible configurations that do not hinder, in this embodiment, the same holes 73 are formed in the same positional relationship as the vacuum suction holes 21 of the stage 2. Hereinafter, since the hole 73 of the closing sheet 71 is also a hole for suction, it is referred to as a sheet suction hole 73.

As shown in FIG. 6, a large number of sheet suction holes 73 are formed in the closed sheet 71. The large number of sheet suction holes 73 are divided into a plurality of groups 73G. Hereinafter, the group 73G of the sheet suction holes 73 is referred to as a hole group. In FIG. 6, each hole group 73G is surrounded by a broken line, but this is for the sake of understanding, and such a line is not drawn on the closing sheet 71.

As shown in FIG. 6, each hole group 73G has a different number of sheet suction holes 73. Each hole group 73G is composed of sheet suction holes 73 formed at equal intervals in the rectangular arrangement region. In each hole group 73G, the separation intervals of the sheet suction holes 73 are the same, but the size of the square arrangement region is different, so that the number of sheet suction holes 73 is different. There is also a hole group 73G having a different aspect ratio of the square arrangement area. The "arrangement region" means the entire arrangement region of a large number of sheet suction holes 73 in each hole group 73G. It can also be regarded as one of the smallest rectangular regions in which all the sheet suction holes 73 enter.

Each of such hole groups 73G is provided in consideration of the difference in the size of the substrate S to be processed. That is, in each hole group 73G, the size of the arrangement region in which the sheet suction holes 73 are formed corresponds to the size of the substrate S to be processed. That is, in FIG. 6, the broken line indicating each hole group 73G corresponds to the size (length and width) of the substrate S.

For such a closing sheet 71, any hole group 73G is selected and positioned for use. This point will be described with reference to FIG. FIG. 7 is a schematic perspective view showing the selection and positioning of the hole group 73G in the closing sheet 71 according to the first embodiment. As shown in FIG. 1, the stage 2, the closing sheet 71, and the substrate S are actually in contact with each other in this order from the bottom, but in FIG. 7, they are separated from each other for easy understanding. Further, in FIGS. 6 and 7, for the sake of understanding, the vacuum suction hole 21 and the sheet suction hole 73 are drawn large, and are actually smaller than the illustrated state. An example of the size of the vacuum suction hole 21 and the sheet suction hole 73 is about 0.5 mm to 3.0 mm in diameter.

In FIG. 7, a substrate S of a certain size is placed on stage 2 for processing. As described above, the substrate S is placed in a state of being prealigned with respect to the stage 2. That is, they are placed in a predetermined positional relationship with respect to the reference position of the stage 2. The mounting position of the substrate S in the prealigned state is shown by a broken line S'in FIG. 7.
Then, in the closing sheet 71, one hole group 73G is selected according to the size of the substrate S, and the selected hole group 73G is positioned with respect to the stage 2. Positioning means, as shown in FIG. 7, a position where each sheet suction hole 73 of the selected hole group 73G and the vacuum suction hole 21 of the stage 2 overlap.

In this embodiment, positioning is performed by the seat mechanism 72. That is, the sheet mechanism 72 is a mechanism that not only feeds and winds the sheet 71, but also positions the sheet 71.
As shown in FIG. 1, the seat mechanism 72 is a mechanism for feeding and winding the closed sheet 71 by roll-to-roll. The seat mechanism 72 includes a pair of guide rollers 723 in order to keep the closing seat 71 in a horizontal position without slack.

FIG. 8 is a schematic side view showing the configuration of the seat mechanism 72 and the mounting structure of the closed seat 71 and the seat mechanism 72. The seat mechanism 72 has substantially the same configuration on the rolls on both sides, and FIG. 8 illustrates the configuration on one side. As can be seen from FIGS. 1 and 8, the seat mechanism 72 includes a pair of round bar-shaped roll bars 721 around which the closing sheet 71 is wound, and a roll drive source 722 for driving each roll bar 721. The roll drive source 722 may be, for example, one is a torque motor, and the other is a servo motor or a stepping motor that rotates the roll rod 721 against the torque.

Each roll drive source 722 is controlled by the main control unit 9 to position the closed sheet 71. Specifically, each roll drive source 722 is connected to the main control unit 9, and the seat positioning program 93 is mounted on the main control unit 9.
An ID for identifying each of the above-mentioned hole groups 73G (hereinafter referred to as a hole group ID) is assigned. A specific reference position (hereinafter referred to as a seat reference position) is set on the closed sheet 71 in the elongated direction. The position of each hole group 73G formed in the closed sheet 71 is specified by the distance from the sheet reference position. The storage unit 90 of the main control unit 9 stores a hole group information file 94 that records the positions of the hole groups 73G. The hole group information file 94 is a file in which the formation position (distance from the sheet reference position) of each hole group 73G is recorded in correspondence with the hole group ID.

Information on which position the seat reference position is currently located with respect to the stage 2 is passed as an argument to the seat positioning program 93. The origin position for the seat positioning program 93 (hereinafter referred to as the stage origin) is set in the stage 2, and the seat reference position is specified in relation to the stage origin. For example, the hole group 73G selected during the previous execution of the sheet positioning program 93 is held in the storage unit 90, and by reading this, the current position of the sheet reference position with respect to the stage origin can be obtained. At the first operation of the device, the seat reference position = stage origin.

Further, the hole group ID is passed as an argument to the sheet positioning program 93. The sheet 71 positioning program calculates a value of how much distance to move the closed sheet 71 in which direction from the current position of the sheet reference position and the hole group ID. That is, with reference to the hole group information file 94, it is calculated in which direction and how much distance the hole group 73G of the hole group ID should be moved with respect to the stage 2. Then, when the calculated value is sent to the sheet mechanism 72, the program ends. As a result, the seat mechanism 72 is controlled, and as shown in FIG. 7, the selected hole group 73G is positioned with respect to the stage 2.

The closing seat 71 and the seat mechanism 72 described above are attached to the stage 2. The closing seat 71 and the seat mechanism 72 are attached to the pedestal 32 together with the elevating mechanism 74. As shown in FIG. 8, the elevating mechanism 74 includes a pair of extendable columns 741 holding the seat mechanism 72, a vertical drive source 742 that expands and contracts each column, and the like.

The roll rod 721 is fixed to the support column 741 via a bearing. Further, the roll drive source 722 is also held by the support column 741, and the closing seat 71 and the entire seat mechanism 72 are attached to the pedestal 32 via the elevating mechanism 74. The guide roller 723 is also held by the support column 741 via a bearing. Therefore, when the transport system 3 operates and the pedestal 32 moves, the closing seat 71 and the seat mechanism 72 also move integrally.

The operation of the direct drawing type exposure apparatus of the first embodiment will be described below.
Prior to the operation of the device, the operator inputs necessary information in the input unit 901. The information here includes information on the product type of the substrate S to be processed, and the information on the product type includes information on the size of the substrate S.

The main control unit 9 sends a control signal to the sheet mechanism 72 prior to the exposure process. That is, the main sequence program 91 calls and executes the sheet positioning program 93. The main sequence program 91 identifies the hole group ID according to the input product type information and passes it to the sheet positioning program 93 together with the information on the current position of the sheet reference position. The sheet positioning program 93 calculates the required movement amount (direction and distance) of the closed sheet 71 according to these product type information, and outputs the required movement amount (direction and distance) to the sheet mechanism 72. As a result, the selected hole group 73G is positioned with respect to stage 2.

When the closing sheet 71 is sent out and wound up, the elevating mechanism 74 operates to lift the closing sheet 71 and the seat mechanism 72 slightly upward. Then, after the positioning is performed as described above, the elevating mechanism 74 lowers the closing sheet 71 and the seat mechanism 72, and the closing sheet 71 is brought into contact with or in close contact with the stage 2 in the positioned state.

Next, one transfer unit 5 operates, and the substrate S is placed on one stage 2. At this time, pre-alignment is performed, and the substrate S is placed at a predetermined position with respect to the stage 2. Then, the exhaust system 4 operates, and the substrate S is evacuated to the stage 2. At this time, as described above, the hole group 73G is positioned in the closed sheet 71, and the vacuum suction hole 21 and the sheet suction hole 73 of the stage 2 are in an overlapping state. Therefore, the vacuum adsorption of the substrate S is not hindered.

Further, in the closed sheet 71, since the hole group 73G selected according to the size of the substrate S is positioned with respect to the stage 2, in addition to not hindering the vacuum adsorption of the mounted substrate S, the substrate S The unused vacuum suction holes 21 around the surface are closed by the closing sheet 71.
While maintaining this state, the transport system 3 moves the stage 2. Then, when the substrate S on the stage 2 reaches below the image sensor 6, the image sensor 6 takes an image of the alignment mark, sends the image data to the main control unit 9, and rewrites the exposure pattern program 92.

Further, when the transport system 3 moves the stage 2 and passes through the exposure area below the exposure unit 1, the exposure unit 1 operates to expose the substrate S in the exposure pattern. After passing through the exposure area, the transport system 3 inverts the stage 2 and returns the stage 2 to the initial standby position. Then, the transfer unit 5 operates at the standby position, and the exposed substrate S is carried out to the conveyor 50.

During this time, the other transfer unit 5 performs the placement operation of the substrate S after pre-aligning with the other stage 2. Then, when one stage 2 returns to the standby position, the transport system 3 moves the other stage 2 from the opposite side, and the exposure unit 1 similarly exposes when passing through the exposure area. At this time, a control signal is similarly sent to the sheet mechanism 72, and the closed sheet 71 covers the other stage 2 in a state where the hole group 73G corresponding to the input product type is positioned, and the substrate S is placed on the other stage 2. It is placed and vacuum-adsorbed, and the exposure is performed in that state.

By alternately repeating such an operation, each substrate S is exposed. When the exposure processing of the substrate S of one lot is completed and the substrate S of the next lot is processed, if the product types are different, the product type information is input in the input unit 901. The main sequence program 91 executes the sheet positioning program 93 and positions the corresponding hole group 73G according to the input product type information before starting the processing of the next lot. At this time, the elevating mechanism 74 operates to raise the closing sheet 71 slightly to separate it from the stage 2, and after positioning, lower it to make contact with or bring it into close contact with the stage 2. After positioning the hole group 73G in this way, each substrate S is similarly exposed.

According to the direct drawing type exposure apparatus of the embodiment related to the above-described configuration and operation, a large number of vacuum suction holes 21 are provided on the stage 2 in a layout corresponding to the largest size substrate S, and a smaller substrate S is processed. Since the suction hole closing means closes the vacuum suction hole 21 which is not closed by the substrate S at the time of the operation, the device is capable of sufficient vacuum suction. That is, there is provided a practical direct drawing type exposure apparatus capable of performing highly accurate exposure processing while supporting high-mix low-volume production.

In the above configuration, the sheet mechanism 72 is a mechanism that keeps the closed sheet 71 in a state that does not hinder the vacuum suction of the substrate S, but this operation can also be performed manually by the operator. However, since it is complicated and is a work that is required every time the product type is changed, the productivity is significantly reduced. The sheet mechanism 72 makes it possible to quickly omit the change of the hole group 73G due to the change of the type, and it is significant that the productivity is not lowered.
The fact that the closing seat 71 and the seat mechanism 72 are attached to the stage 2 and move integrally with the stage 2 is significant in that the mechanism related to the movement of the stage 2 is not complicated. The closing sheet 71 and the seat mechanism 72 may be attached to a member separated from the stage 2 so as not to move integrally, but the closing sheet 71 maintains a state of closing the unused vacuum suction holes 31. Must move in synchronization with stage 2 (at the same speed and in the same direction). It is mechanically possible, but it becomes complicated and large-scale.

In the above-described operation, the directions of movement of the stage 2 when passing through the exposure area during exposure are opposite to each other in the two stages 2. If the direction of movement of the stage 2 is different, the on / off pattern of each pixel mirror is also different, so the exposure pattern program 92 is implemented for each. However, if one stage 2 is exposed on the outward path and the other stage 2 is exposed on the return path, the direction of movement during exposure will be the same. Therefore, the same exposure pattern program 92 Is executed to perform the exposure.

Next, the direct drawing type exposure apparatus of the second embodiment will be described.
Also in the direct drawing type exposure apparatus of the second embodiment, a large number of vacuum suction holes 21 of each stage 2 are provided in a layout corresponding to the largest size substrate S. Then, a suction hole closing means for closing the vacuum suction hole 21 which is not closed by the substrate S is provided, and the suction hole closing means includes a closing sheet 71 and a sheet mechanism 72. The second embodiment is different from the first embodiment in that the closed sheet 71 has an opening 75 instead of the sheet suction hole 73 as a configuration of the closed sheet 71 so as not to hinder the vacuum suction of the substrate S. ..

FIG. 9 is a schematic plan view showing the configuration of the closing sheet 71 in the second embodiment. Also in the second embodiment, the closing sheet 71 has a long strip shape, and is fed and wound by the sheet mechanism 72 in a state of being wound on a pair of rolls.
As shown in FIG. 9, in the second embodiment, the openings 75 are square, and a large number of openings 75 having different sizes are formed along the length direction of the closing sheet 71. Each opening 75 is formed corresponding to the different size of each substrate S having a different size. In this embodiment, each opening 75 is formed in a size slightly larger than the corresponding substrate S.

Each opening 75 is assigned an ID (hereinafter, opening ID) as in the hole group 73G in the first embodiment. Then, the opening information file 95 that stores the formation position (position with respect to the sheet reference position) of each opening 75 corresponding to the opening ID is stored in the storage unit 90 of the main control unit 9.
Also in this embodiment, the seat mechanism 72 includes a pair of roll rods 721 and a pair of roll drive sources 722 that drive each roll rod 721 to feed and wind the closed sheet 71. The closing seat 71 and the seat mechanism 72 are attached to the pedestal 32 on which the stage 2 is mounted together with the elevating mechanism 74, and move integrally with the stage 2.

10 and 11 are schematic views showing the operation of the suction hole closing means in the second embodiment, FIG. 10 is a schematic perspective view, and FIG. 11 is a schematic front sectional view. In FIG. 10, as in FIG. 7, the stage 2, the closing sheet 71, and the substrate S are drawn separately for the sake of understanding, but they are actually overlapped and in contact with each other.
Also in the second embodiment, the seat positioning program 93 is mounted on the main control unit 9. The sheet positioning program 93 calculates the movement amount (direction and distance) of the sheet 71 for positioning the corresponding opening 75 according to the product type information input by the input unit 901, and sends the sheet positioning program 93 to the sheet mechanism 72 for positioning. .. At this time, the elevating mechanism 74 operates in the same manner, and the closing sheet 71 is once raised slightly, positioned, and then lowered to come into contact with the stage 2.

FIG. 11 shows a state in which the substrate S is prealigned and placed after the closing sheet 71 is positioned and comes into contact with the stage 2 as described above. As shown in FIG. 11, the prealigned and placed substrate S is located within the opening 75 of the positioned closing sheet 71. The opening 75 is selected according to the size of the substrate S to be processed, and as shown in FIG. 11, the opening 75 has a size slightly larger than that of the substrate S. The difference in size between the opening 75 and the substrate S is called an opening margin, and is shown by m in FIG.

What is important in the opening margin m is that it is sufficiently smaller than the pitch (distance between adjacent vacuum suction holes 21) p of the vacuum suction holes 21 of the stage 2. If the opening margin p is larger than the pitch p of the vacuum suction holes 21, the vacuum suction holes 21 that are not closed by the substrate S will not be closed even by the closing sheet 71, and the vacuum will leak. is there. On the other hand, if the opening margin m is too small, the substrate S tends not to be located in the opening 75 depending on the accuracy of pre-alignment. If the substrate S is not located in the opening 75, the substrate S will ride on the edge of the opening 75, which also causes a vacuum suction error. Therefore, it is preferable that the opening margin m is, for example, 1/2 or less and 2.0 mm or more of the pitch of the vacuum suction holes 21.

The direct drawing type exposure apparatus of the second embodiment is the same as the apparatus of the first embodiment except that the configuration of the suction hole closing means is different as described above.
Also in the second embodiment, a large number of vacuum suction holes 21 are provided in the stage 2 in a layout corresponding to the largest size substrate S, and a vacuum that is not blocked by the substrate S when processing a smaller substrate S. Since the suction hole 21 is closed by the suction hole closing means, the device is capable of sufficient vacuum suction. For this reason, a practical direct drawing type exposure apparatus capable of performing highly accurate exposure processing while supporting high-mix low-volume production is provided.

Next, the direct drawing type exposure apparatus of the third embodiment will be described.
Also in the third embodiment, a large number of vacuum suction holes 21 are provided in the stage 2 in a layout corresponding to the largest size substrate S, and a vacuum that is not blocked by the substrate S when processing a smaller substrate S. A suction hole closing means for closing the suction hole 21 is provided. In the third embodiment, the suction hole closing means has a function of closing the vacuum suction hole 21 which is not closed by the substrate S, and also has a function of suppressing the peripheral portion of the substrate S.

FIG. 12 is a schematic plan view showing the configuration of the closing sheet 71 according to the third embodiment. Also in the third embodiment, the sheet 71 has a long strip shape, and is fed and wound by the sheet mechanism 72 in a state of being wound on a pair of rolls. Then, as in the second embodiment, a plurality of openings 76 having different sizes are formed along the length direction.
Each opening 76 is formed according to the size of the substrate S to be processed. In that respect, it is similar to the second embodiment. The third embodiment differs from the second embodiment in that the opening 76 is smaller than the size of the corresponding substrate S. Hereinafter, this opening 76 is referred to as a small opening.

As shown in FIG. 12, the closing sheet 71 of this embodiment has one large opening 77 in addition to the small opening 76 corresponding to each size of the substrate S. The opening 77 is an opening used when the substrate S is placed on the stage 2 and the substrate S is collected from the stage 2 (hereinafter, referred to as substrate attachment / detachment). Hereinafter, the opening 77 is referred to as a detachable opening. The attachment / detachment opening 77 is a square opening having a size slightly larger than that of the largest size substrate S.
Also in this embodiment, an opening ID is given to each small opening 76 and the attachment / detachment opening 77. Then, the information on the formation positions of the small openings 76 and the detachable openings 77 is acquired as the distance to the seat reference position, and is recorded in the opening information file 95.

FIG. 13 is a schematic front sectional view showing the operation of the suction hole closing means in the third embodiment. In the third embodiment, the transfer unit 5, the seat mechanism 72, and the elevating mechanism 74 cooperate with each other when the substrate S is attached / detached, which is different from the first and second embodiments. There is.

More specifically, as shown in FIG. 13 (1), the main sequence program 91 first sends a control signal to the seat mechanism 72 so that the attachment / detachment opening 77 is positioned. In the stage 2, the position on which the prealigned substrate S is placed is set as a predetermined position (hereinafter referred to as the set mounting position). The position of the attachment / detachment opening 77 is a position where the area occupied by the substrate S mounted at the set mounting position is inside the attachment / detachment opening 77 in a plan view. The seat mechanism 72 is controlled so as to be in this position.

When the attachment / detachment opening 77 is positioned, the main sequence program 91 sends a control signal to the transfer unit 5 to mount the prealigned substrate S on the stage 2 as shown in FIG. 13 (2). At this time, the closing sheet 71 may be in contact with the stage 2 or may be slightly floating.

Next, when the placement of the substrate S is completed, the main sequence program 91 sends a control signal to the seat mechanism 72, and as shown in FIG. 13 (3), positioning of the small opening 76 corresponding to the size of the substrate S. To do. At this time, the elevating mechanism 74 positions the closing sheet 71 at a position slightly above the substrate S.
Next, the main sequence program 91 sends a control signal to the elevating mechanism 74 to lower the closing sheet 71 and bring it into close contact with the stage 2. In this state, as shown in FIG. 14 (4), the edge of the small opening 76 is on the peripheral portion of the substrate S.

In this state, the main sequence program 91 sends a control signal to the exhaust system 4 to start vacuum suction. The substrate S is vacuum-sucked to the stage 2 by the vacuum suction of each vacuum suction hole 21, and the closing sheet 71 is also vacuum-sucked to the stage 2. At this time, as can be seen from FIG. 13 (4), the edge of the small opening 76 is in a state of pressing the peripheral portion of the substrate S. Therefore, even if the substrate S is warped, the closing sheet 71 suppresses the warp and brings it into close contact with the stage 2. Therefore, no vacuum leakage occurs, and the substrate S is exposed in a flat posture.

The operation when the substrate S is removed from the stage 2 after the end of the exposure is the reverse of the above. That is, after the operation of the exhaust system 4 is stopped and the vacuum suction is released, the elevating mechanism 74 raises the closing sheet 71 slightly. Then, the seat mechanism 72 operates to position the attachment / detachment opening 77. Then, the suction pad 51 of the transfer unit 5 sucks the substrate S, and the transfer hand 52 lifts the substrate S and carries it out to the conveyor 50.

According to the direct drawing type exposure apparatus of the third embodiment, the suction hole sealing means closes the vacuum suction hole 21 which is not closed by the substrate S, so that high-precision exposure processing can be performed while supporting high-mix low-volume production. It is said. In addition to this, since the closing sheet 71 suppresses the peripheral portion of the substrate S, even if the substrate S is warped, vacuum suction is surely performed, and deterioration of exposure accuracy is prevented.

In the third embodiment, the closing sheet 71 preferably has appropriate elasticity. If the closing sheet 71 has high rigidity, the closing sheet 71 floats from the stage 2 due to the thickness of the substrate S, and is not sufficiently vacuum-adsorbed. On the contrary, if the closing sheet 71 is too soft, the force sufficient to press the peripheral portion of the substrate S to eliminate the warp is not generated. In consideration of these, the closing sheet 71 having appropriate elasticity is used. For example, when the closing sheet 71 is made of PET, if the thickness is set to about 0.3 mm to 0.5 mm, the above problems do not occur.

Further, the difference between the size of the small opening 76 and the size of the substrate S (indicated by m'in FIG. 13 (4)) is preferably about 3.0 to 5.0 mm. If it is smaller than 3.0 mm, it may be insufficient to eliminate the warp. Further, even if it is larger than 5.0 mm, the effect of eliminating the warp does not change, but on the other hand, it may hinder the formation of the exposure pattern on the substrate S.

Although it has been explained that the vacuum suction holes 21 provided in the stage 2 are arranged at equal intervals in each embodiment, they may not be partially evenly spaced. For example, since it is better to increase the vacuum suction force in the peripheral portion of the substrate S, the vacuum suction holes 21 located in the peripheral portion may be arranged densely with a narrow interval according to the size of each substrate S. obtain.
Further, in the first embodiment, it has been described that the sheet mechanism 72 positions the sheet suction holes 73 so as to overlap the vacuum suction holes 21 of the stage 2, but the “overlap” in this case is not limited to the case where the sheets completely overlap. It suffices if they overlap in an area of at least 1/2 or more. That is, it is sufficient that the area of 1/2 or more of the vacuum suction hole 21 is not blocked (if it communicates with the sheet suction hole 73). Further, each sheet suction hole 73 may have the same size as the vacuum suction hole 21 of the stage 2, but it is preferable to make it slightly larger. This is because if it is made slightly larger, strict positioning accuracy is not required for the seat mechanism 72. For example, the sheet suction hole 73 is preferably about 1.2 to 1.5 times the area ratio of the vacuum suction hole 21.

Further, although each of the above embodiments has a twin stage configuration in which two stages 2 are mounted, the invention of this application may adopt a single stage configuration in which only one stage is used. It is possible.
The direct drawing exposure apparatus of this application can also be used in the process of exposing both sides of a substrate. In the case of double-sided exposure, for example, a configuration may be adopted in which two devices having a single stage configuration are vertically installed and a reversing mechanism for turning the substrate up and down is provided in between.
In the direct drawing type exposure apparatus, the "substrate" means a plate-shaped exposure object, and does not necessarily mean a member that is a base of a product. A member that is not incorporated into the final product can be a "board".

1 Exposure unit 2 Stage 21 Vacuum suction hole 3 Transport system 4 Exhaust system 5 Transfer unit 6 Imaging element 71 Closing sheet 72 Sheet mechanism 721 Roll rod 722 Roll drive source 73 Sheet suction hole 73 G hole group 74 Elevating mechanism 75 Aperture 76 Small Aperture 77 Detachable opening 9 Main control unit 91 Main sequence program 92 Exposure pattern program 93 Sheet positioning program 94 Hole group information file 95 Aperture information file S Substrate

Claims (7)

It is a direct drawing type exposure apparatus that irradiates a substrate with a predetermined pattern of light without a mask to expose it.
An exposure head that irradiates the exposure area with a predetermined pattern of light,
A stage with a large number of vacuum suction holes that vacuum suck the substrate on which it is placed,
A transport system that moves the stage on which the substrate is placed through the exposure area,
An exhaust system that vacuum-sucks the vacuum suction holes and vacuum-sucks the substrate to the stage,
It is provided with a suction hole sealing means for closing the vacuum suction holes that are not closed by the substrate among the large number of vacuum suction holes.
The suction hole closing means includes a long sheet wound in a roll shape and a sheet mechanism for feeding and winding the sheet, and the sheet mechanism is a mechanism for keeping the sheet in a state that does not hinder the vacuum suction of the substrate. And
A direct drawing type exposure apparatus characterized in that a sheet and a sheet mechanism are attached to a stage so as to move integrally with the stage by a transport system. Claim 1 is characterized in that the sheet is formed with a suction hole that overlaps the vacuum suction hole that the substrate closes or an opening corresponding to the size of the substrate so as not to hinder the vacuum suction of the substrate. The direct drawing type exposure apparatus described. The sheet is formed of a plurality of hole groups consisting of the plurality of suction holes and different sizes of the entire arrangement region, or a plurality of openings of different sizes corresponding to different sizes of the substrate.
The plurality of hole groups or the plurality of openings are formed along the length direction of the sheet.
When one or a plurality of openings in the plurality of hole groups are selected according to the size of the substrate, the selected hole group or the selected openings are located in predetermined positions with respect to the stage. The direct drawing type exposure apparatus according to claim 2, wherein a control unit for controlling the sheet mechanism is provided. The sheet is formed of a plurality of pore groups composed of the plurality of adsorption holes and having different sizes of the entire arrangement region.
The plurality of hole groups are formed along the length direction of the sheet.
When one of the plurality of hole groups is selected according to the size of the substrate, the sheet mechanism is controlled so that each suction hole of the selected hole group is located at a position overlapping each vacuum suction hole of the stage. The direct drawing type exposure apparatus according to claim 2, wherein a control unit is provided. The sheet is formed with a plurality of openings of different sizes corresponding to different sizes of the substrate.
The plurality of openings are formed along the length direction of the sheet.
Each opening is larger than the size of the corresponding substrate,
A set mounting position is set as a position for mounting the board on the stage.
When one opening is selected according to the size of the substrate, a control unit is provided to control the seat mechanism so that the substrate mounted at the set mounting position is located within the selected opening. The direct drawing type exposure apparatus according to claim 2. The sheet is formed with a plurality of openings of different sizes corresponding to different sizes of the substrate.
The plurality of openings are formed along the length direction of the sheet.
Each opening is smaller than the size of the corresponding substrate,
A set mounting position is set as a position for mounting the board on the stage.
When one opening is selected according to the size of the substrate, a control unit for controlling the seat mechanism is provided so that the peripheral edge of the selected opening rides on the peripheral portion of the substrate mounted at the set mounting position. The direct drawing type exposure apparatus according to claim 2. In addition to openings smaller than the size of the corresponding substrate, the sheet is provided with removable openings.
The detachable opening is larger than the largest size substrate,
The control unit is characterized in that when the substrate is mounted on the stage and the substrate is removed from the stage, the attachment / detachment opening is positioned at a position facing the set mounting position of the stage. The direct drawing type exposure apparatus according to claim 6.

Images