TW202105066A - Exposure device and exposure method - Google Patents
Exposure device and exposure method Download PDFInfo
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- TW202105066A TW202105066A TW109109107A TW109109107A TW202105066A TW 202105066 A TW202105066 A TW 202105066A TW 109109107 A TW109109107 A TW 109109107A TW 109109107 A TW109109107 A TW 109109107A TW 202105066 A TW202105066 A TW 202105066A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Abstract
Description
本發明,關於曝光裝置及曝光方法。The present invention relates to an exposure device and an exposure method.
以往,已知有將光照射至具有感光層的基板之曝光面,來在曝光面形成圖形用的曝光裝置(例如參照專利文獻1)。該曝光裝置具備透光性構件,其具有與基板之曝光面相對向的平面,且為與投影光學系統之成像面一致的平面。在該曝光裝置,使基板的曝光面密貼於透光性構件的平面,藉此在表面平坦性較差的基板之曝光面精度良好地使所期望的圖像成像。 [先前技術文獻] [專利文獻]Conventionally, there is known an exposure device for irradiating light to the exposure surface of a substrate having a photosensitive layer to form a pattern on the exposure surface (for example, refer to Patent Document 1). The exposure device is provided with a light-transmitting member, which has a flat surface opposite to the exposure surface of the substrate, and is a flat surface consistent with the imaging surface of the projection optical system. In this exposure device, the exposure surface of the substrate is closely adhered to the flat surface of the translucent member, thereby accurately forming a desired image on the exposure surface of the substrate with poor surface flatness. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本特開2011-81317號公報[Patent Document 1] JP 2011-81317 A
[發明所欲解決之問題][The problem to be solved by the invention]
在專利文獻1所記載的曝光裝置,使基板的曝光面密貼於透光性構件的平面。因此,基板的曝光面與透光性構件的平面會密貼,藉此在基板的曝光面,有著髒污附著、損傷、在與透光性構件的平面之間夾入垃圾等之不良情況發生。 [解決問題之技術手段]In the exposure device described in Patent Document 1, the exposure surface of the substrate is closely attached to the flat surface of the translucent member. Therefore, the exposed surface of the substrate and the flat surface of the light-transmitting member are closely adhered, so that on the exposed surface of the substrate, there are problems such as dirt adhesion, damage, and dust trapped between the flat surface of the light-transmitting member and the like. . [Technical means to solve the problem]
本發明,是用來解決上述般課題之至少一部分者,例如,可作為以下的形態來實現。The present invention is to solve at least a part of the above-mentioned general problems, and for example, it can be realized as the following forms.
根據本發明的第1形態,提供使基板曝光的曝光裝置。該曝光裝置,具備:基板固定器,其具有將基板予以吸引吸附來保持的保持面;以及驅動機構,其使基板固定器往與保持面正交的方向移動。且,該曝光裝置,具備基板按壓構件,其配置成不會往與保持面正交的方向位移。該基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。According to the first aspect of the present invention, an exposure apparatus for exposing a substrate is provided. This exposure apparatus includes: a substrate holder having a holding surface for sucking and holding the substrate; and a driving mechanism that moves the substrate holder in a direction orthogonal to the holding surface. Furthermore, this exposure apparatus is equipped with a board|substrate pressing member, and it is arrange|positioned so that it may not shift in the direction orthogonal to a holding surface. When the substrate held by the substrate holder is pressed against the substrate holding member by the drive mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate.
根據該曝光裝置,基板固定器會吸引吸附基板來保持,故可維持基板的平坦性。且,基板按壓構件,配置成不會往與基板固定器的保持面正交的方向位移。因此,使基板按壓構件之與基板抵接之面與曝光部的成像面一致,藉此可在基板與基板按壓構件抵接時使基板的曝光面與曝光部的成像面一致。且,基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。因此,可提升基板的平坦性,而防止發生於基板之曝光面的不良情況。According to this exposure apparatus, the substrate holder attracts and holds the substrate, so the flatness of the substrate can be maintained. In addition, the substrate pressing member is arranged so as not to be displaced in a direction orthogonal to the holding surface of the substrate holder. Therefore, the surface of the substrate pressing member that abuts against the substrate is aligned with the imaging surface of the exposure portion, whereby the exposure surface of the substrate can be aligned with the imaging surface of the exposure portion when the substrate and the substrate pressing member abut. In addition, when the substrate held by the substrate holder is pressed against the substrate pressing member by the driving mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate. Therefore, the flatness of the substrate can be improved, and defects that occur on the exposed surface of the substrate can be prevented.
根據本發明的第2形態,是第1形態中,基板按壓構件,構成為可在與保持面平行的方向移動。因此,可在曝光裝置適用各種尺寸的基板。且,在將基板載置於基板固定器或是從基板固定器拆下基板的情況時,使基板按壓構件移動至基板固定器的外側,藉此可容易進行基板的替換。According to the second aspect of the present invention, in the first aspect, the substrate pressing member is configured to be movable in a direction parallel to the holding surface. Therefore, substrates of various sizes can be applied to the exposure device. In addition, when the substrate is placed on the substrate holder or removed from the substrate holder, the substrate pressing member is moved to the outside of the substrate holder, whereby the substrate can be easily replaced.
根據本發明的第3形態,是第2形態中,基板按壓構件,構成為在位置固定的導引軌道上滑動。因此,可一邊防止基板按壓構件往與基板固定器之保持面正交的方向位移,一邊使基板按壓構件往與保持面平行的方向移動。According to a third aspect of the present invention, in the second aspect, the substrate pressing member is configured to slide on a guide rail having a fixed position. Therefore, while preventing displacement of the substrate pressing member in a direction orthogonal to the holding surface of the substrate holder, the substrate pressing member can be moved in a direction parallel to the holding surface.
根據本發明的第4形態,是第1形態中,基板按壓構件的位置固定。因此,可使曝光裝置的構造簡易化。According to the fourth aspect of the present invention, in the first aspect, the position of the substrate pressing member is fixed. Therefore, the structure of the exposure device can be simplified.
根據本發明的第5形態,是第1形態至第4形態中任一形態,其中,基板按壓構件,具有與基板抵接的平坦面。因此,可使基板與基板按壓構件彼此以面來穩定地抵接。According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the substrate pressing member has a flat surface that abuts the substrate. Therefore, the substrate and the substrate pressing member can be stably contacted with each other on the surface.
根據本發明的第6形態,是第1形態至第5形態中任一形態,其中,基板按壓構件,配置成與基板之互相對向的兩個邊緣部分抵接。因此,可穩定夾持基板。According to a sixth aspect of the present invention, it is any one of the first to fifth aspects, wherein the substrate pressing member is arranged so as to abut the two opposite edge portions of the substrate. Therefore, the substrate can be held stably.
根據本發明的第7形態,是第1形態至第5形態中任一形態,其中,基板按壓構件,是使與設在基板的複數個曝光區域對應的區域開口的格子狀構件。藉此,在基板的邊緣部分以外亦與基板按壓構件抵接,故可更加提升基板的平坦性。According to a seventh aspect of the present invention, in any one of the first to fifth aspects, the substrate pressing member is a lattice-shaped member that opens regions corresponding to a plurality of exposure regions provided on the substrate. Thereby, the substrate pressing member abuts on the substrate except the edge portion of the substrate, so that the flatness of the substrate can be further improved.
根據本發明的第8形態,是第1形態至第7形態中任一形態,其中,驅動機構,構成為對基板固定器之外周部的複數個位置施加力。因此,可確實使基板固定器抵接。According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the drive mechanism is configured to apply force to a plurality of positions on the outer periphery of the substrate holder. Therefore, the substrate holder can be reliably brought into contact with each other.
根據本發明的第9形態,是第1形態至第8形態中任一形態,其進一步具備:第1基板搬運部,其在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件的狀態下,將基板搬運至曝光部;以及第2基板搬運部,其與第1基板搬運部並排配置,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件的狀態下,將基板搬運至曝光部,一個曝光部,是使被第1基板搬運部給搬運的基板、被第2基板搬運部給搬運的基板交互地曝光。藉此,可有效率地進行曝光處理。According to a ninth aspect of the present invention, it is any one of the first to the eighth aspect, and further includes: a first substrate conveying portion that is pressed against the substrate pressing member by a driving mechanism on the substrate held in the substrate holder In the state, the substrate is transported to the exposure section; and the second substrate transport section, which is arranged side by side with the first substrate transport section, and the substrate held in the substrate holder is pressed by the substrate pressing member by the driving mechanism. It is conveyed to the exposure part, and one exposure part exposes the substrate conveyed by the 1st board|substrate conveyance part and the board|substrate conveyed by the 2nd board|substrate conveyance part alternately. Thereby, the exposure process can be efficiently performed.
根據本發明的第10形態,提供使用曝光裝置來曝光基板的曝光方法。該曝光方法,具備:準備第1形態至第9形態中任一形態的曝光裝置的步驟。且,該曝光方法,具備:藉由基板固定器來吸引吸附基板的步驟、藉由驅動機構來將保持在基板固定器的基板按壓於基板按壓構件的步驟、藉由曝光部進行曝光的步驟。According to a tenth aspect of the present invention, there is provided an exposure method that uses an exposure device to expose a substrate. This exposure method includes a step of preparing an exposure device of any one of the first aspect to the ninth aspect. In addition, this exposure method includes a step of sucking and sucking the substrate by a substrate holder, a step of pressing the substrate held by the substrate holder to a substrate pressing member by a drive mechanism, and a step of exposing by the exposure unit.
根據該曝光方法,基板固定器會吸引吸附基板來保持,故可維持基板的平坦性。且,基板按壓構件,配置成不會往與保持面正交的方向位移。因此,使基板按壓構件之與基板抵接之面與曝光部的成像面一致,藉此可在基板與基板按壓構件抵接時使基板的曝光面與曝光部的成像面一致。且,基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。因此,可提升基板的平坦性,而防止發生於基板之曝光面的不良情況。According to this exposure method, the substrate holder attracts and holds the substrate, so the flatness of the substrate can be maintained. In addition, the substrate pressing member is arranged so as not to be displaced in a direction orthogonal to the holding surface. Therefore, the surface of the substrate pressing member that abuts against the substrate is aligned with the imaging surface of the exposure portion, whereby the exposure surface of the substrate can be aligned with the imaging surface of the exposure portion when the substrate and the substrate pressing member abut. In addition, when the substrate held by the substrate holder is pressed against the substrate pressing member by the driving mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate. Therefore, the flatness of the substrate can be improved, and defects that occur on the exposed surface of the substrate can be prevented.
以下,針對本發明之曝光裝置之適合的實施形態使用圖式來說明,但在各圖中相同或相當的部分,附上相同符號來說明。Hereinafter, suitable embodiments of the exposure apparatus of the present invention will be described using drawings, but the same or equivalent parts in each figure will be described with the same reference numerals.
圖1,是表示本發明之一實施形態之曝光裝置之全體構造的立體圖。曝光裝置100,對於在表面具有感光層的基板之曝光面,基於顯示電路等之二維圖形的曝光資料,來進行曝光,藉此將該圖形形成在基板上。Fig. 1 is a perspective view showing the overall structure of an exposure apparatus according to an embodiment of the present invention. The
圖1中,曝光裝置100,具備:第1基板搬運部10、第2基板搬運部20、對位攝影部30、及曝光部40。第1基板搬運部10及第2基板搬運部20,例如在第1基座構件102上互相並排地配置,該第1基座構件102固定於設置在地面的基座框101上。對位攝影部30及曝光部40,是在設在第1基座構件102上的第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20來配置。In FIG. 1, the
在本實施形態,將對位攝影部30之攝影機34及曝光部40之曝光頭44的移動方向(從圖1的左上方向往右下方向)定為X軸方向。且,將第1基板搬運部10及第2基板搬運部20所搬運之基板固定部60的移動方向定為Y軸方向(從圖1的左下方向往右上方向)。此外,將與X軸方向及Y軸方向正交的方向(從圖1的下方向往上方向)定為Z軸方向。In this embodiment, the moving direction (from the upper left direction to the lower right direction of FIG. 1) of the
第1基板搬運部10,沿著曝光處理的流程將被基板固定部60夾持的基板50往Y軸方向搬運。第2基板搬運部20,與第1基板搬運部10同樣地,沿著曝光處理的流程將被基板固定部60夾持的基板50往Y軸方向搬運。第1基板搬運部10及第2基板搬運部20,具有相同的構造,故以下僅針對第1基板搬運部10來說明。第1基板搬運部10,具有:支撐構件11、導引構件12、及線性馬達13。The first
支撐構件11,是在第1基座構件102上沿著Y軸方向來配置。導引構件12,是在支撐構件11上,沿著Y軸方向來配置。線性馬達13,是在支撐構件11的上表面與導引構件12平行地配置。基板固定部60,將曝光的基板50予以夾持,以線性馬達13為動力源,構成為可在導引構件12上移動。針對基板固定部60的詳細構造,待留後述。The supporting
對位攝影部30,是以攝影機34來光學地讀取出設在基板50上之既定位置的對位標記,藉此基於所讀取之對位標記的座標(X、Y),來檢測出基板50的配置位置。對位攝影部30,具有:支撐構件31、導引構件32、軸馬達33、及兩台攝影機34。The
支撐構件31,是在第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20而沿著X軸方向來配置。導引構件32,是在支撐構件31的側面,沿著X軸方向來配置。軸馬達33,是在支撐構件31的上部,與導引構件32平行地配置。攝影機34,是各自以軸馬達33為動力源,構成為可在導引構件32上移動。The
在基板50為矩形形狀的情況,對位標記,例如設在基板50的四角。因此,藉由使用兩台攝影機34,可同時讀取出兩處的對位標記,故可有效率地檢測出基板50的配置位置。又,對位攝影部30,具有一台攝影機34亦可,具有三台以上的攝影機34亦可。When the
曝光部40,基於曝光資料,來曝光基板50的曝光面。曝光部40,具有:支撐構件41、導引構件42、線性馬達43、及曝光頭44。曝光部40的動作,是藉由處理曝光資料之未圖示的圖像處理單元來控制。該圖像處理單元,因應對位攝影部30所檢測出之基板50的配置位置來修正曝光資料,基於修正資料來控制曝光部40。藉此,可在基板50上的適當位置進行曝光。The
支撐構件41,是在第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20而沿著X軸方向來配置。導引構件42,是在支撐構件41上,沿著X軸方向來配置。線性馬達43,是在支撐構件41的側面,與導引構件42平行地配置。曝光頭44,是以線性馬達43為動力源,構成為可在導引構件42上移動。The
曝光頭44,具有:LED光源、光調變元件亦即數位微鏡裝置(DMD:Digital Mirror Device)。藉由使用數位微鏡裝置,不必透過光罩,就可直接在基板50上形成圖形。又,光源,不限於LED光源,可使用雷射或UV燈等之各種光源。且,即使是取代數位微鏡裝置,使用多邊形鏡的情況,亦可不透過光罩,就直接在基板50上形成圖形。使用多邊形鏡的情況,作為光源是使用雷射光源為佳。The
在本實施形態,曝光裝置100,具備第1基板搬運部10及第2基板搬運部20。且,對位攝影部30及曝光部40,是跨越第1基板搬運部10及第2基板搬運部20來配置。因此,例如在將以第1基板搬運部10所搬運的基板50藉由曝光部40來曝光的期間,可藉由對位攝影部30來檢測出以第2基板搬運部20所搬運之基板50的配置位置。亦即,曝光部40會交互地使第1基板搬運部10所搬運之基板50與第2基板搬運部20所搬運之基板50曝光,藉此可有效率地進行曝光處理。又,基板搬運部,為一個亦可,三個以上亦可。In this embodiment, the
且,在本實施形態,雖說明了圖像處理單元,因應對位攝影部30所檢測出之基板50的配置位置來修正曝光資料,基於修正資料來控制曝光部40,但並不限定於此。例如,將專利文獻1所揭示之對位機構設在本實施形態的導引構件12與基板固定部60之間,配合曝光資料來使對位機構修正基板50的配置位置亦可。該情況,亦可在基板50上的適當位置進行曝光。In addition, in this embodiment, although the image processing unit has been described, the exposure data is corrected in response to the placement position of the
接著,針對設在第1基板搬運部10的基板固定部60之詳細構造進行說明。圖2,是表示本發明之一實施形態之基板固定部的立體圖。圖3,是表示本發明之一實施形態之基板固定部夾持基板之狀態的立體圖。圖4,是表示本發明之一實施形態之基板固定部夾持基板之狀態的剖面圖。又,圖4,是以通過氣壓缸62的線來表示將基板固定部予以切斷的剖面。Next, the detailed structure of the
圖2~4中,基板固定部60,具有:基板固定器61、氣壓缸62、基板固定器支撐構件63、基板固定器導引構件64、導引構件65、滑動構件66、及基板按壓構件67。基板固定部60的動作,是因應作業員的操作,而被控制部控制。In FIGS. 2 to 4, the
基板固定器61,具有保持基板50的保持面61a,為往XY平面擴張之矩形形狀的板狀構件。在基板固定器61的保持面61a,複數形成有未圖示之微細的貫通孔。透過該貫通孔,朝向保持面61a的相反側,以未圖示的吸引機構來進行吸引,藉此使載置於基板固定器61的基板50,被吸引吸附於保持面61a上。藉此,可將基板50平坦地保持。The
氣壓缸62,是從基板固定器61的內面,使基板固定器61往與保持面61a正交的方向(Z軸方向)移動的驅動機構。氣壓缸62,配置在基板固定器61的四角。氣壓缸62,具有:固定在基板固定器支撐構件63的缸體部62a、前端抵接於基板固定器61之內面的桿62b。氣壓缸62,是以空氣壓來使桿62b從缸體部62a伸長,藉此使基板固定器61移動。The
將氣壓缸62設在基板固定器61的四角,藉此可對基板固定器61的全面均勻地施加力來移動。且,使用氣壓缸62來作為驅動機構,藉此可用簡單的構造來使基板固定器61移動。又,氣壓缸62,並不一定要設在基板固定器61的四角,亦可設在基板固定器61之各邊的中央位置。該情況亦可對基板固定器61的全面均勻地施加力。The
基板固定器支撐構件63,是往XY平面擴張之矩形形狀的板狀構件。基板固定器支撐構件63,是透過基板固定器導引構件64而可將基板固定器61往上下導引。基板固定器導引構件64,是使桿部64a固定在基板固定器61,使軸承部64b固定在基板固定器支撐構件63。The substrate
導引構件65,是在基板固定器61之Y軸方向外側,在基板固定器支撐構件63上之互相對向的位置,沿著X軸方向配置兩根。滑動構件66,是對一根導引構件65設置兩個。滑動構件66,是與導引構件65卡合,且構成為以未圖示之馬達等為動力源,而可在導引構件65上移動。The
基板按壓構件67,是在滑動構件66上,互相對向地配置兩個。基板按壓構件67,具有:與基板50抵接的抵接部67a、從抵接部67a的兩端往與抵接部67a正交的方向延伸且分別固定於滑動構件66的固定部67b。藉由配置兩個基板按壓構件67,而可使基板50之互相對向的兩個邊緣部分與基板按壓構件67抵接。Two
抵接部67a,沿著Y軸方向延伸而形成,具有與基板50之曝光面之非曝光區域抵接的平坦面67d。抵接部67a具有平坦面67d,藉此可使基板50與基板按壓構件67彼此以面來穩定地抵接。又,抵接部67a,具有凸部,且與基板50之曝光面之非曝光區域以點或線來抵接亦可。且,固定部67b與滑動構件66,一體化亦可。The
基板按壓構件67,透過滑動構件66及導引構件65來安裝於基板固定器支撐構件63,藉此配置成不會往與保持面61a正交的方向(Z軸方向)位移。且,將互相對向的兩個基板按壓構件67之抵接部67a之平坦面67d予以延長的面,界定出基準面68。在本實施形態,基準面68,構成為與曝光部40的成像面一致。The
在此,基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。因此,在基板50之曝光區域的上方,不存在妨礙曝光的東西。且,此時,基板50的曝光面與基準面68,亦即基板50的曝光面與曝光部40的成像面會一致。Here, when the
接著,針對基板固定部60夾持基板50的動作進行說明。在此,針對夾持矩形形狀之基板50之情況的動作進行說明。首先,作業員將基板50載置於基板固定器61,例如將設在曝光裝置100的開關按下去時,基板固定器61會吸引吸附基板50來保持。Next, the operation of clamping the
接著,在基板固定器61的X軸方向外側待機的基板按壓構件67,會配合基板50的尺寸來往X軸方向平行移動,避開基板50的曝光區域而停止在與基板50的邊緣部分於Z軸方向重疊的位置。在此,基板50的尺寸,事先由作業員來登錄於控制部亦可,以未圖示的感測器檢測亦可。Next, the
構成為可使基板按壓構件67往與保持面61a平行的方向移動,藉此可讓基板固定部60夾持各種尺寸的基板50。且,在將基板50載置於基板固定器61或是從基板固定器61拆下基板50的情況時,使基板按壓構件67移動至基板固定器61的外側,藉此可容易進行基板50的替換。且,構成為可使基板按壓構件67在位置固定的導引軌道亦即導引構件65上滑動,藉此可一邊防止基板按壓構件67往與基板固定器61之保持面61a正交的方向位移,一邊使基板按壓構件67移動。It is configured such that the
之後,驅動氣壓缸62,使基板固定器61往Z軸方向移動,而將保持在基板固定器61的基板50,以既定的壓力按壓於基板按壓構件67。在此,將基板50按壓於基板按壓構件67的壓力,是事先由作業員登錄於控制部亦可,使用未圖示的感測器來迴授控制亦可。藉此,使基板50被基板固定部60夾持。且,此時,如上述般,藉由基板50的曝光面與基板按壓構件67來界定的基準面68為一致。After that, the
如以上所述,曝光裝置100,具備將基板50予以吸引吸附來保持的基板固定器61。且,曝光裝置100,具備基板按壓構件67,其配置成不會往與保持面61a正交的方向(Z軸方向)位移。該基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。As described above, the
根據該曝光裝置100,基板固定器61會吸引吸附基板50來保持,故可維持基板50的平坦性。且,基板按壓構件67,配置成不會往與保持面61a正交的方向位移。因此,使基板按壓構件67之與基板50抵接之面與曝光部40的成像面一致,藉此可在基板50與基板按壓構件67抵接時使基板50的曝光面與曝光部40的成像面一致。且,基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。因此,可提升基板50的平坦性,而防止發生於基板50之曝光面的不良情況。According to the
在本實施形態,雖說明了基板按壓構件67配合基板50的尺寸而於X軸方向平行移動,但並不限定於此。基板按壓構件67,避開基板50的曝光區域而固定在與基板50的邊緣部分於Z軸方向重疊的位置亦可。在以曝光裝置100曝光之基板50的尺寸沒有變化的情況,藉由該構造,省略導引構件65及滑動構件66,而可使基板固定部60的構造簡易化。此時,為了讓作業員容易將基板固定器61載置於基板50,亦可設置從X軸方向或Y軸方向,通過基板固定器61與基板按壓構件67之間的間隙來供給基板50的基板供給機構。基板供給機構,例如為並排配置有滾軸而成的滑送機構亦可。In this embodiment, although the
此外,在基板50設有複數個曝光區域的情況時,亦可如圖5所示般,使用格子狀的基板按壓構件67A,其具有使與基板50之複數個曝光區域對應的區域開口的開口部67c。在該情況時,在基板50的邊緣部分以外亦與基板按壓構件67A抵接,故可更加提升基板50的平坦性。此時,藉由氣壓缸62,除了基板固定器61的外周部以外,還對基板固定器61的中央部施加力亦可。In addition, when the
以上,雖針對本發明的幾個實施形態進行了說明,但上述之發明的實施形態,為用來易於理解本發明者,並非用來限定本發明。本發明,在不超出其主旨的範圍內可進行變更或改良,且於本發明包含其同等物。且,在可解決上述課題的至少一部分的範圍,或是發揮效果的至少一部分的範圍,可進行申請專利範圍及說明書所記載之各構成要件的組合或省略。Although several embodiments of the present invention have been described above, the above-mentioned embodiments of the invention are intended to facilitate the understanding of the present invention and are not intended to limit the present invention. The present invention can be changed or improved within the scope not exceeding the gist thereof, and the equivalents thereof are included in the present invention. In addition, in the range where at least a part of the above-mentioned problems can be solved or at least a part of the effect is exerted, the combination or omission of the respective constituent elements described in the scope of the patent application and the specification can be made.
10:第1基板搬運部
11,21,31,41:支撐構件
12,22,32,42,64:導引構件
13,23,43:線性馬達
20:第2基板搬運部
30:對位攝影部
33:軸馬達
34:攝影機
40:曝光部
44:曝光頭
50:基板
60:基板固定部
61:基板固定器
61a:保持面
62:氣壓缸
62a:缸體部
62b:桿
63:基板固定器支撐構件
64:基板固定器導引構件
64a:桿部
64b:軸承部
65:導引構件
66:滑動構件
67:基板按壓構件
67a:抵接部
67b:固定部
67d:平坦面
67A:基板按壓構件
67c:開口部
68:基準面
100:曝光裝置
101:基座框
102:第1基座構件
103:第2基座構件10: The first
[圖1]表示本發明之一實施形態之曝光裝置之全體構造的立體圖。 [圖2]表示本發明之一實施形態之基板固定部的立體圖。 [圖3]表示本發明之一實施形態之基板固定部夾持基板之狀態的立體圖。 [圖4]表示本發明之一實施形態之基板固定部夾持基板之狀態的剖面圖。 [圖5]表示具有與本發明之一實施形態之複數個曝光區域對應之開口的基板按壓構件的俯視圖。[Fig. 1] A perspective view showing the overall structure of an exposure apparatus according to an embodiment of the present invention. [Fig. 2] A perspective view showing a substrate fixing portion according to an embodiment of the present invention. [Fig. 3] A perspective view showing a state in which a substrate is clamped by a substrate fixing portion according to an embodiment of the present invention. [FIG. 4] A cross-sectional view showing a state in which a substrate is clamped by a substrate fixing portion in an embodiment of the present invention. [FIG. 5] A plan view showing a substrate pressing member having openings corresponding to a plurality of exposure regions in one embodiment of the present invention.
50:基板 50: substrate
60:基板固定部 60: Board fixing part
61:基板固定器 61: substrate holder
61a:保持面 61a: Keep the face
62:氣壓缸 62: pneumatic cylinder
63:基板固定器支撐構件 63: substrate holder support member
64:基板固定器導引構件 64: substrate holder guide member
64a:桿部 64a: pole
64b:軸承部 64b: Bearing part
65:導引構件 65: Guiding member
66:滑動構件 66: Sliding member
67:基板按壓構件 67: substrate pressing member
67a:抵接部 67a: Abutment part
67b:固定部 67b: Fixed part
Claims (10)
Applications Claiming Priority (2)
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JP2019070414A JP2020170059A (en) | 2019-04-02 | 2019-04-02 | Exposure device and exposure method |
JP2019-070414 | 2019-04-02 |
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TW202105066A true TW202105066A (en) | 2021-02-01 |
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TW (1) | TW202105066A (en) |
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JPH0778630B2 (en) * | 1986-07-15 | 1995-08-23 | サンエ−技研株式会社 | Exposure equipment |
JPS63154352A (en) * | 1986-12-18 | 1988-06-27 | Nikon Corp | Pattern image-forming device |
JP2006192520A (en) * | 2005-01-12 | 2006-07-27 | Fuji Photo Film Co Ltd | Clamping device, image forming device, clamping method, and image forming method |
JP3815687B1 (en) * | 2005-03-09 | 2006-08-30 | 株式会社 シーズ | Clamp unit for substrate transfer |
JP2011081317A (en) * | 2009-10-09 | 2011-04-21 | San Ei Giken Inc | Exposure device and method |
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2019
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