TW202105066A - Exposure device and exposure method - Google Patents

Exposure device and exposure method Download PDF

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Publication number
TW202105066A
TW202105066A TW109109107A TW109109107A TW202105066A TW 202105066 A TW202105066 A TW 202105066A TW 109109107 A TW109109107 A TW 109109107A TW 109109107 A TW109109107 A TW 109109107A TW 202105066 A TW202105066 A TW 202105066A
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Taiwan
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substrate
exposure
pressing member
holder
exposure device
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TW109109107A
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Chinese (zh)
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高木俊博
小林和弘
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日商三榮技研股份有限公司
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

According to the present invention, an exposure surface of a substrate and an imaging surface of an exposure part are matched while maintaining flatness of the substrate, and a flaw occurring on the exposure surface of the substrate is prevented. This exposure device for exposing a substrate is provided with: a substrate holder that has a holding surface for suctions and holds the substrate; a driving mechanism that moves the substrate holder in a direction perpendicular to the holding surface; and a substrate pressing member that is disposed so as not to be displaced in the direction perpendicular to the holding surface and that abuts the substrate at a position avoiding the exposure region of the substrate when the substrate held by the substrate holder pressed against the substrate pressing member by the driving mechanism.

Description

曝光裝置及曝光方法Exposure device and exposure method

本發明,關於曝光裝置及曝光方法。The present invention relates to an exposure device and an exposure method.

以往,已知有將光照射至具有感光層的基板之曝光面,來在曝光面形成圖形用的曝光裝置(例如參照專利文獻1)。該曝光裝置具備透光性構件,其具有與基板之曝光面相對向的平面,且為與投影光學系統之成像面一致的平面。在該曝光裝置,使基板的曝光面密貼於透光性構件的平面,藉此在表面平坦性較差的基板之曝光面精度良好地使所期望的圖像成像。 [先前技術文獻] [專利文獻]Conventionally, there is known an exposure device for irradiating light to the exposure surface of a substrate having a photosensitive layer to form a pattern on the exposure surface (for example, refer to Patent Document 1). The exposure device is provided with a light-transmitting member, which has a flat surface opposite to the exposure surface of the substrate, and is a flat surface consistent with the imaging surface of the projection optical system. In this exposure device, the exposure surface of the substrate is closely adhered to the flat surface of the translucent member, thereby accurately forming a desired image on the exposure surface of the substrate with poor surface flatness. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2011-81317號公報[Patent Document 1] JP 2011-81317 A

[發明所欲解決之問題][The problem to be solved by the invention]

在專利文獻1所記載的曝光裝置,使基板的曝光面密貼於透光性構件的平面。因此,基板的曝光面與透光性構件的平面會密貼,藉此在基板的曝光面,有著髒污附著、損傷、在與透光性構件的平面之間夾入垃圾等之不良情況發生。 [解決問題之技術手段]In the exposure device described in Patent Document 1, the exposure surface of the substrate is closely attached to the flat surface of the translucent member. Therefore, the exposed surface of the substrate and the flat surface of the light-transmitting member are closely adhered, so that on the exposed surface of the substrate, there are problems such as dirt adhesion, damage, and dust trapped between the flat surface of the light-transmitting member and the like. . [Technical means to solve the problem]

本發明,是用來解決上述般課題之至少一部分者,例如,可作為以下的形態來實現。The present invention is to solve at least a part of the above-mentioned general problems, and for example, it can be realized as the following forms.

根據本發明的第1形態,提供使基板曝光的曝光裝置。該曝光裝置,具備:基板固定器,其具有將基板予以吸引吸附來保持的保持面;以及驅動機構,其使基板固定器往與保持面正交的方向移動。且,該曝光裝置,具備基板按壓構件,其配置成不會往與保持面正交的方向位移。該基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。According to the first aspect of the present invention, an exposure apparatus for exposing a substrate is provided. This exposure apparatus includes: a substrate holder having a holding surface for sucking and holding the substrate; and a driving mechanism that moves the substrate holder in a direction orthogonal to the holding surface. Furthermore, this exposure apparatus is equipped with a board|substrate pressing member, and it is arrange|positioned so that it may not shift in the direction orthogonal to a holding surface. When the substrate held by the substrate holder is pressed against the substrate holding member by the drive mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate.

根據該曝光裝置,基板固定器會吸引吸附基板來保持,故可維持基板的平坦性。且,基板按壓構件,配置成不會往與基板固定器的保持面正交的方向位移。因此,使基板按壓構件之與基板抵接之面與曝光部的成像面一致,藉此可在基板與基板按壓構件抵接時使基板的曝光面與曝光部的成像面一致。且,基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。因此,可提升基板的平坦性,而防止發生於基板之曝光面的不良情況。According to this exposure apparatus, the substrate holder attracts and holds the substrate, so the flatness of the substrate can be maintained. In addition, the substrate pressing member is arranged so as not to be displaced in a direction orthogonal to the holding surface of the substrate holder. Therefore, the surface of the substrate pressing member that abuts against the substrate is aligned with the imaging surface of the exposure portion, whereby the exposure surface of the substrate can be aligned with the imaging surface of the exposure portion when the substrate and the substrate pressing member abut. In addition, when the substrate held by the substrate holder is pressed against the substrate pressing member by the driving mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate. Therefore, the flatness of the substrate can be improved, and defects that occur on the exposed surface of the substrate can be prevented.

根據本發明的第2形態,是第1形態中,基板按壓構件,構成為可在與保持面平行的方向移動。因此,可在曝光裝置適用各種尺寸的基板。且,在將基板載置於基板固定器或是從基板固定器拆下基板的情況時,使基板按壓構件移動至基板固定器的外側,藉此可容易進行基板的替換。According to the second aspect of the present invention, in the first aspect, the substrate pressing member is configured to be movable in a direction parallel to the holding surface. Therefore, substrates of various sizes can be applied to the exposure device. In addition, when the substrate is placed on the substrate holder or removed from the substrate holder, the substrate pressing member is moved to the outside of the substrate holder, whereby the substrate can be easily replaced.

根據本發明的第3形態,是第2形態中,基板按壓構件,構成為在位置固定的導引軌道上滑動。因此,可一邊防止基板按壓構件往與基板固定器之保持面正交的方向位移,一邊使基板按壓構件往與保持面平行的方向移動。According to a third aspect of the present invention, in the second aspect, the substrate pressing member is configured to slide on a guide rail having a fixed position. Therefore, while preventing displacement of the substrate pressing member in a direction orthogonal to the holding surface of the substrate holder, the substrate pressing member can be moved in a direction parallel to the holding surface.

根據本發明的第4形態,是第1形態中,基板按壓構件的位置固定。因此,可使曝光裝置的構造簡易化。According to the fourth aspect of the present invention, in the first aspect, the position of the substrate pressing member is fixed. Therefore, the structure of the exposure device can be simplified.

根據本發明的第5形態,是第1形態至第4形態中任一形態,其中,基板按壓構件,具有與基板抵接的平坦面。因此,可使基板與基板按壓構件彼此以面來穩定地抵接。According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the substrate pressing member has a flat surface that abuts the substrate. Therefore, the substrate and the substrate pressing member can be stably contacted with each other on the surface.

根據本發明的第6形態,是第1形態至第5形態中任一形態,其中,基板按壓構件,配置成與基板之互相對向的兩個邊緣部分抵接。因此,可穩定夾持基板。According to a sixth aspect of the present invention, it is any one of the first to fifth aspects, wherein the substrate pressing member is arranged so as to abut the two opposite edge portions of the substrate. Therefore, the substrate can be held stably.

根據本發明的第7形態,是第1形態至第5形態中任一形態,其中,基板按壓構件,是使與設在基板的複數個曝光區域對應的區域開口的格子狀構件。藉此,在基板的邊緣部分以外亦與基板按壓構件抵接,故可更加提升基板的平坦性。According to a seventh aspect of the present invention, in any one of the first to fifth aspects, the substrate pressing member is a lattice-shaped member that opens regions corresponding to a plurality of exposure regions provided on the substrate. Thereby, the substrate pressing member abuts on the substrate except the edge portion of the substrate, so that the flatness of the substrate can be further improved.

根據本發明的第8形態,是第1形態至第7形態中任一形態,其中,驅動機構,構成為對基板固定器之外周部的複數個位置施加力。因此,可確實使基板固定器抵接。According to an eighth aspect of the present invention, in any one of the first to seventh aspects, the drive mechanism is configured to apply force to a plurality of positions on the outer periphery of the substrate holder. Therefore, the substrate holder can be reliably brought into contact with each other.

根據本發明的第9形態,是第1形態至第8形態中任一形態,其進一步具備:第1基板搬運部,其在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件的狀態下,將基板搬運至曝光部;以及第2基板搬運部,其與第1基板搬運部並排配置,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件的狀態下,將基板搬運至曝光部,一個曝光部,是使被第1基板搬運部給搬運的基板、被第2基板搬運部給搬運的基板交互地曝光。藉此,可有效率地進行曝光處理。According to a ninth aspect of the present invention, it is any one of the first to the eighth aspect, and further includes: a first substrate conveying portion that is pressed against the substrate pressing member by a driving mechanism on the substrate held in the substrate holder In the state, the substrate is transported to the exposure section; and the second substrate transport section, which is arranged side by side with the first substrate transport section, and the substrate held in the substrate holder is pressed by the substrate pressing member by the driving mechanism. It is conveyed to the exposure part, and one exposure part exposes the substrate conveyed by the 1st board|substrate conveyance part and the board|substrate conveyed by the 2nd board|substrate conveyance part alternately. Thereby, the exposure process can be efficiently performed.

根據本發明的第10形態,提供使用曝光裝置來曝光基板的曝光方法。該曝光方法,具備:準備第1形態至第9形態中任一形態的曝光裝置的步驟。且,該曝光方法,具備:藉由基板固定器來吸引吸附基板的步驟、藉由驅動機構來將保持在基板固定器的基板按壓於基板按壓構件的步驟、藉由曝光部進行曝光的步驟。According to a tenth aspect of the present invention, there is provided an exposure method that uses an exposure device to expose a substrate. This exposure method includes a step of preparing an exposure device of any one of the first aspect to the ninth aspect. In addition, this exposure method includes a step of sucking and sucking the substrate by a substrate holder, a step of pressing the substrate held by the substrate holder to a substrate pressing member by a drive mechanism, and a step of exposing by the exposure unit.

根據該曝光方法,基板固定器會吸引吸附基板來保持,故可維持基板的平坦性。且,基板按壓構件,配置成不會往與保持面正交的方向位移。因此,使基板按壓構件之與基板抵接之面與曝光部的成像面一致,藉此可在基板與基板按壓構件抵接時使基板的曝光面與曝光部的成像面一致。且,基板按壓構件,在保持於基板固定器的基板被驅動機構給按壓於基板按壓構件時,會在避開基板之曝光區域的位置與基板抵接。因此,可提升基板的平坦性,而防止發生於基板之曝光面的不良情況。According to this exposure method, the substrate holder attracts and holds the substrate, so the flatness of the substrate can be maintained. In addition, the substrate pressing member is arranged so as not to be displaced in a direction orthogonal to the holding surface. Therefore, the surface of the substrate pressing member that abuts against the substrate is aligned with the imaging surface of the exposure portion, whereby the exposure surface of the substrate can be aligned with the imaging surface of the exposure portion when the substrate and the substrate pressing member abut. In addition, when the substrate held by the substrate holder is pressed against the substrate pressing member by the driving mechanism, the substrate pressing member abuts against the substrate at a position avoiding the exposure area of the substrate. Therefore, the flatness of the substrate can be improved, and defects that occur on the exposed surface of the substrate can be prevented.

以下,針對本發明之曝光裝置之適合的實施形態使用圖式來說明,但在各圖中相同或相當的部分,附上相同符號來說明。Hereinafter, suitable embodiments of the exposure apparatus of the present invention will be described using drawings, but the same or equivalent parts in each figure will be described with the same reference numerals.

圖1,是表示本發明之一實施形態之曝光裝置之全體構造的立體圖。曝光裝置100,對於在表面具有感光層的基板之曝光面,基於顯示電路等之二維圖形的曝光資料,來進行曝光,藉此將該圖形形成在基板上。Fig. 1 is a perspective view showing the overall structure of an exposure apparatus according to an embodiment of the present invention. The exposure device 100 exposes the exposure surface of a substrate having a photosensitive layer on the surface based on exposure data of a two-dimensional pattern such as a display circuit, thereby forming the pattern on the substrate.

圖1中,曝光裝置100,具備:第1基板搬運部10、第2基板搬運部20、對位攝影部30、及曝光部40。第1基板搬運部10及第2基板搬運部20,例如在第1基座構件102上互相並排地配置,該第1基座構件102固定於設置在地面的基座框101上。對位攝影部30及曝光部40,是在設在第1基座構件102上的第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20來配置。In FIG. 1, the exposure apparatus 100 includes a first substrate conveying unit 10, a second substrate conveying unit 20, a registration imaging unit 30, and an exposure unit 40. The first substrate conveying unit 10 and the second substrate conveying unit 20 are arranged side by side on, for example, a first base member 102, and the first base member 102 is fixed to a base frame 101 installed on the floor. The alignment imaging section 30 and the exposure section 40 are arranged on the second base member 103 provided on the first base member 102 and straddle the first substrate conveying section 10 and the second substrate conveying section 20.

在本實施形態,將對位攝影部30之攝影機34及曝光部40之曝光頭44的移動方向(從圖1的左上方向往右下方向)定為X軸方向。且,將第1基板搬運部10及第2基板搬運部20所搬運之基板固定部60的移動方向定為Y軸方向(從圖1的左下方向往右上方向)。此外,將與X軸方向及Y軸方向正交的方向(從圖1的下方向往上方向)定為Z軸方向。In this embodiment, the moving direction (from the upper left direction to the lower right direction of FIG. 1) of the camera 34 of the registration photographing unit 30 and the exposure head 44 of the exposure unit 40 is defined as the X-axis direction. In addition, the movement direction of the board fixing portion 60 conveyed by the first board conveying portion 10 and the second board conveying portion 20 is defined as the Y-axis direction (from the lower left direction to the upper right direction in FIG. 1). In addition, the direction orthogonal to the X-axis direction and the Y-axis direction (from the downward direction in FIG. 1 to the upward direction) is defined as the Z-axis direction.

第1基板搬運部10,沿著曝光處理的流程將被基板固定部60夾持的基板50往Y軸方向搬運。第2基板搬運部20,與第1基板搬運部10同樣地,沿著曝光處理的流程將被基板固定部60夾持的基板50往Y軸方向搬運。第1基板搬運部10及第2基板搬運部20,具有相同的構造,故以下僅針對第1基板搬運部10來說明。第1基板搬運部10,具有:支撐構件11、導引構件12、及線性馬達13。The first substrate conveying section 10 conveys the substrate 50 held by the substrate fixing section 60 in the Y-axis direction along the flow of the exposure process. The second substrate conveying section 20 conveys the substrate 50 held by the substrate fixing section 60 in the Y-axis direction in the same manner as the first substrate conveying section 10 along the flow of the exposure process. Since the first board conveying unit 10 and the second board conveying unit 20 have the same structure, only the first board conveying unit 10 will be described below. The first substrate conveying unit 10 includes a supporting member 11, a guide member 12, and a linear motor 13.

支撐構件11,是在第1基座構件102上沿著Y軸方向來配置。導引構件12,是在支撐構件11上,沿著Y軸方向來配置。線性馬達13,是在支撐構件11的上表面與導引構件12平行地配置。基板固定部60,將曝光的基板50予以夾持,以線性馬達13為動力源,構成為可在導引構件12上移動。針對基板固定部60的詳細構造,待留後述。The supporting member 11 is arranged along the Y-axis direction on the first base member 102. The guide member 12 is arranged on the support member 11 along the Y-axis direction. The linear motor 13 is arranged in parallel with the guide member 12 on the upper surface of the support member 11. The substrate fixing portion 60 clamps the exposed substrate 50, uses the linear motor 13 as a power source, and is configured to be movable on the guide member 12. The detailed structure of the substrate fixing portion 60 will be described later.

對位攝影部30,是以攝影機34來光學地讀取出設在基板50上之既定位置的對位標記,藉此基於所讀取之對位標記的座標(X、Y),來檢測出基板50的配置位置。對位攝影部30,具有:支撐構件31、導引構件32、軸馬達33、及兩台攝影機34。The registration photographing unit 30 uses a camera 34 to optically read the registration mark provided at a predetermined position on the substrate 50, and thereby detects based on the coordinates (X, Y) of the read registration mark Arrangement position of substrate 50. The alignment imaging unit 30 includes a supporting member 31, a guide member 32, a shaft motor 33, and two cameras 34.

支撐構件31,是在第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20而沿著X軸方向來配置。導引構件32,是在支撐構件31的側面,沿著X軸方向來配置。軸馬達33,是在支撐構件31的上部,與導引構件32平行地配置。攝影機34,是各自以軸馬達33為動力源,構成為可在導引構件32上移動。The support member 31 is arranged on the second base member 103 along the X-axis direction across the first substrate conveying section 10 and the second substrate conveying section 20. The guide member 32 is arranged on the side surface of the support member 31 along the X-axis direction. The shaft motor 33 is arranged in parallel with the guide member 32 on the upper part of the support member 31. The cameras 34 each use the shaft motor 33 as a power source, and are configured to be movable on the guide member 32.

在基板50為矩形形狀的情況,對位標記,例如設在基板50的四角。因此,藉由使用兩台攝影機34,可同時讀取出兩處的對位標記,故可有效率地檢測出基板50的配置位置。又,對位攝影部30,具有一台攝影機34亦可,具有三台以上的攝影機34亦可。When the substrate 50 has a rectangular shape, the alignment marks are provided at the four corners of the substrate 50, for example. Therefore, by using two cameras 34, two alignment marks can be read at the same time, so that the placement position of the substrate 50 can be detected efficiently. In addition, the registration photographing unit 30 may have one camera 34, or may have three or more cameras 34.

曝光部40,基於曝光資料,來曝光基板50的曝光面。曝光部40,具有:支撐構件41、導引構件42、線性馬達43、及曝光頭44。曝光部40的動作,是藉由處理曝光資料之未圖示的圖像處理單元來控制。該圖像處理單元,因應對位攝影部30所檢測出之基板50的配置位置來修正曝光資料,基於修正資料來控制曝光部40。藉此,可在基板50上的適當位置進行曝光。The exposure unit 40 exposes the exposed surface of the substrate 50 based on the exposure data. The exposure unit 40 has a supporting member 41, a guide member 42, a linear motor 43, and an exposure head 44. The operation of the exposure unit 40 is controlled by an image processing unit (not shown) that processes exposure data. This image processing unit corrects the exposure data according to the arrangement position of the substrate 50 detected by the photographing unit 30, and controls the exposure unit 40 based on the correction data. In this way, exposure can be performed at an appropriate position on the substrate 50.

支撐構件41,是在第2基座構件103上,跨越第1基板搬運部10及第2基板搬運部20而沿著X軸方向來配置。導引構件42,是在支撐構件41上,沿著X軸方向來配置。線性馬達43,是在支撐構件41的側面,與導引構件42平行地配置。曝光頭44,是以線性馬達43為動力源,構成為可在導引構件42上移動。The support member 41 is arranged on the second base member 103 along the X-axis direction across the first substrate conveying section 10 and the second substrate conveying section 20. The guide member 42 is arranged on the support member 41 along the X-axis direction. The linear motor 43 is arranged on the side surface of the support member 41 in parallel with the guide member 42. The exposure head 44 uses the linear motor 43 as a power source and is configured to be movable on the guide member 42.

曝光頭44,具有:LED光源、光調變元件亦即數位微鏡裝置(DMD:Digital Mirror Device)。藉由使用數位微鏡裝置,不必透過光罩,就可直接在基板50上形成圖形。又,光源,不限於LED光源,可使用雷射或UV燈等之各種光源。且,即使是取代數位微鏡裝置,使用多邊形鏡的情況,亦可不透過光罩,就直接在基板50上形成圖形。使用多邊形鏡的情況,作為光源是使用雷射光源為佳。The exposure head 44 has an LED light source and a light modulating element, that is, a digital micro-mirror device (DMD: Digital Mirror Device). By using a digital micro-mirror device, patterns can be directly formed on the substrate 50 without having to pass through the mask. In addition, the light source is not limited to LED light sources, and various light sources such as lasers or UV lamps can be used. Moreover, even if a polygon mirror is used instead of a digital micro-mirror device, it is possible to directly form a pattern on the substrate 50 without passing through the mask. In the case of using a polygon mirror, it is better to use a laser light source as the light source.

在本實施形態,曝光裝置100,具備第1基板搬運部10及第2基板搬運部20。且,對位攝影部30及曝光部40,是跨越第1基板搬運部10及第2基板搬運部20來配置。因此,例如在將以第1基板搬運部10所搬運的基板50藉由曝光部40來曝光的期間,可藉由對位攝影部30來檢測出以第2基板搬運部20所搬運之基板50的配置位置。亦即,曝光部40會交互地使第1基板搬運部10所搬運之基板50與第2基板搬運部20所搬運之基板50曝光,藉此可有效率地進行曝光處理。又,基板搬運部,為一個亦可,三個以上亦可。In this embodiment, the exposure apparatus 100 includes a first substrate conveying unit 10 and a second substrate conveying unit 20. In addition, the alignment imaging section 30 and the exposure section 40 are arranged across the first substrate conveying section 10 and the second substrate conveying section 20. Therefore, for example, while the substrate 50 conveyed by the first substrate conveying section 10 is exposed by the exposure section 40, the alignment imaging section 30 can detect the substrate 50 conveyed by the second substrate conveying section 20. The configuration location. That is, the exposure unit 40 alternately exposes the substrate 50 conveyed by the first substrate conveying unit 10 and the substrate 50 conveyed by the second substrate conveying unit 20, thereby enabling efficient exposure processing. In addition, the number of substrate conveying parts may be one, or three or more.

且,在本實施形態,雖說明了圖像處理單元,因應對位攝影部30所檢測出之基板50的配置位置來修正曝光資料,基於修正資料來控制曝光部40,但並不限定於此。例如,將專利文獻1所揭示之對位機構設在本實施形態的導引構件12與基板固定部60之間,配合曝光資料來使對位機構修正基板50的配置位置亦可。該情況,亦可在基板50上的適當位置進行曝光。In addition, in this embodiment, although the image processing unit has been described, the exposure data is corrected in response to the placement position of the substrate 50 detected by the photographing section 30, and the exposure section 40 is controlled based on the correction data, but it is not limited to this. . For example, the alignment mechanism disclosed in Patent Document 1 may be provided between the guide member 12 and the substrate fixing portion 60 of the present embodiment, and the alignment mechanism may correct the placement position of the substrate 50 in accordance with exposure data. In this case, exposure may be performed at an appropriate position on the substrate 50.

接著,針對設在第1基板搬運部10的基板固定部60之詳細構造進行說明。圖2,是表示本發明之一實施形態之基板固定部的立體圖。圖3,是表示本發明之一實施形態之基板固定部夾持基板之狀態的立體圖。圖4,是表示本發明之一實施形態之基板固定部夾持基板之狀態的剖面圖。又,圖4,是以通過氣壓缸62的線來表示將基板固定部予以切斷的剖面。Next, the detailed structure of the substrate fixing section 60 provided in the first substrate conveying section 10 will be described. Fig. 2 is a perspective view showing a substrate fixing portion according to an embodiment of the present invention. Fig. 3 is a perspective view showing a state in which a substrate is clamped by a substrate fixing portion according to an embodiment of the present invention. Fig. 4 is a cross-sectional view showing a state in which a substrate is clamped by a substrate fixing portion in an embodiment of the present invention. In addition, FIG. 4 is a line passing through the pneumatic cylinder 62 to show the cross section of the substrate fixing portion cut.

圖2~4中,基板固定部60,具有:基板固定器61、氣壓缸62、基板固定器支撐構件63、基板固定器導引構件64、導引構件65、滑動構件66、及基板按壓構件67。基板固定部60的動作,是因應作業員的操作,而被控制部控制。In FIGS. 2 to 4, the substrate fixing portion 60 has: a substrate holder 61, a pneumatic cylinder 62, a substrate holder support member 63, a substrate holder guide member 64, a guide member 65, a sliding member 66, and a substrate pressing member 67. The operation of the substrate fixing unit 60 is controlled by the control unit in response to an operator's operation.

基板固定器61,具有保持基板50的保持面61a,為往XY平面擴張之矩形形狀的板狀構件。在基板固定器61的保持面61a,複數形成有未圖示之微細的貫通孔。透過該貫通孔,朝向保持面61a的相反側,以未圖示的吸引機構來進行吸引,藉此使載置於基板固定器61的基板50,被吸引吸附於保持面61a上。藉此,可將基板50平坦地保持。The substrate holder 61 has a holding surface 61a for holding the substrate 50, and is a rectangular plate-shaped member that expands toward the XY plane. The holding surface 61a of the substrate holder 61 is formed with a plurality of fine through holes (not shown). Through the through hole, the substrate 50 placed on the substrate holder 61 is sucked onto the holding surface 61a by suction by a suction mechanism (not shown) toward the opposite side of the holding surface 61a. Thereby, the substrate 50 can be held flat.

氣壓缸62,是從基板固定器61的內面,使基板固定器61往與保持面61a正交的方向(Z軸方向)移動的驅動機構。氣壓缸62,配置在基板固定器61的四角。氣壓缸62,具有:固定在基板固定器支撐構件63的缸體部62a、前端抵接於基板固定器61之內面的桿62b。氣壓缸62,是以空氣壓來使桿62b從缸體部62a伸長,藉此使基板固定器61移動。The pneumatic cylinder 62 is a driving mechanism that moves the substrate holder 61 in a direction (Z-axis direction) orthogonal to the holding surface 61a from the inner surface of the substrate holder 61. The pneumatic cylinders 62 are arranged at the four corners of the substrate holder 61. The pneumatic cylinder 62 has a cylinder portion 62 a fixed to the substrate holder support member 63 and a rod 62 b whose tip abuts against the inner surface of the substrate holder 61. The pneumatic cylinder 62 uses air pressure to extend the rod 62b from the cylinder portion 62a, thereby moving the substrate holder 61.

將氣壓缸62設在基板固定器61的四角,藉此可對基板固定器61的全面均勻地施加力來移動。且,使用氣壓缸62來作為驅動機構,藉此可用簡單的構造來使基板固定器61移動。又,氣壓缸62,並不一定要設在基板固定器61的四角,亦可設在基板固定器61之各邊的中央位置。該情況亦可對基板固定器61的全面均勻地施加力。The pneumatic cylinders 62 are arranged at the four corners of the substrate holder 61, whereby the substrate holder 61 can be moved evenly by applying force to the entire surface of the substrate holder 61. In addition, the pneumatic cylinder 62 is used as the driving mechanism, whereby the substrate holder 61 can be moved with a simple structure. In addition, the pneumatic cylinder 62 does not have to be provided at the four corners of the substrate holder 61, and may be provided at the center of each side of the substrate holder 61. In this case, the force may be uniformly applied to the entire surface of the substrate holder 61.

基板固定器支撐構件63,是往XY平面擴張之矩形形狀的板狀構件。基板固定器支撐構件63,是透過基板固定器導引構件64而可將基板固定器61往上下導引。基板固定器導引構件64,是使桿部64a固定在基板固定器61,使軸承部64b固定在基板固定器支撐構件63。The substrate holder support member 63 is a rectangular plate-shaped member that expands toward the XY plane. The substrate holder support member 63 can guide the substrate holder 61 up and down through the substrate holder guide member 64. The substrate holder guide member 64 fixes the rod portion 64 a to the substrate holder 61 and fixes the bearing portion 64 b to the substrate holder support member 63.

導引構件65,是在基板固定器61之Y軸方向外側,在基板固定器支撐構件63上之互相對向的位置,沿著X軸方向配置兩根。滑動構件66,是對一根導引構件65設置兩個。滑動構件66,是與導引構件65卡合,且構成為以未圖示之馬達等為動力源,而可在導引構件65上移動。The guide members 65 are arranged outside the substrate holder 61 in the Y-axis direction at positions facing each other on the substrate holder support member 63, and two are arranged along the X-axis direction. Two sliding members 66 are provided for one guide member 65. The sliding member 66 is engaged with the guide member 65 and is configured to be movable on the guide member 65 by using a motor or the like not shown as a power source.

基板按壓構件67,是在滑動構件66上,互相對向地配置兩個。基板按壓構件67,具有:與基板50抵接的抵接部67a、從抵接部67a的兩端往與抵接部67a正交的方向延伸且分別固定於滑動構件66的固定部67b。藉由配置兩個基板按壓構件67,而可使基板50之互相對向的兩個邊緣部分與基板按壓構件67抵接。Two substrate pressing members 67 are arranged on the sliding member 66 so as to face each other. The substrate pressing member 67 has an abutting portion 67a that abuts the substrate 50, and a fixing portion 67b that extends from both ends of the abutting portion 67a in a direction orthogonal to the abutting portion 67a and is fixed to the sliding member 66, respectively. By arranging the two substrate pressing members 67, the two opposite edge portions of the substrate 50 can be brought into contact with the substrate pressing members 67.

抵接部67a,沿著Y軸方向延伸而形成,具有與基板50之曝光面之非曝光區域抵接的平坦面67d。抵接部67a具有平坦面67d,藉此可使基板50與基板按壓構件67彼此以面來穩定地抵接。又,抵接部67a,具有凸部,且與基板50之曝光面之非曝光區域以點或線來抵接亦可。且,固定部67b與滑動構件66,一體化亦可。The contact portion 67 a is formed to extend along the Y-axis direction, and has a flat surface 67 d that abuts against the non-exposed area of the exposed surface of the substrate 50. The contact portion 67a has a flat surface 67d, whereby the substrate 50 and the substrate pressing member 67 can be stably contacted with each other on the surface. In addition, the abutting portion 67a may have a convex portion and may be in contact with the non-exposed area of the exposed surface of the substrate 50 by dots or lines. In addition, the fixed portion 67b and the sliding member 66 may be integrated.

基板按壓構件67,透過滑動構件66及導引構件65來安裝於基板固定器支撐構件63,藉此配置成不會往與保持面61a正交的方向(Z軸方向)位移。且,將互相對向的兩個基板按壓構件67之抵接部67a之平坦面67d予以延長的面,界定出基準面68。在本實施形態,基準面68,構成為與曝光部40的成像面一致。The substrate pressing member 67 is attached to the substrate holder support member 63 through the sliding member 66 and the guide member 65, and thereby is arranged so as not to be displaced in the direction (Z-axis direction) orthogonal to the holding surface 61a. In addition, the flat surface 67 d of the abutting portion 67 a of the two substrate pressing members 67 facing each other is extended to define the reference surface 68. In this embodiment, the reference surface 68 is configured to coincide with the imaging surface of the exposure unit 40.

在此,基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。因此,在基板50之曝光區域的上方,不存在妨礙曝光的東西。且,此時,基板50的曝光面與基準面68,亦即基板50的曝光面與曝光部40的成像面會一致。Here, when the substrate 50 held by the substrate holder 61 is pressed against the substrate pressing member 67 by the pneumatic cylinder 62, the substrate pressing member 67 abuts against the substrate 50 at a position avoiding the exposure area of the substrate 50. Therefore, above the exposure area of the substrate 50, there is nothing that hinders the exposure. In addition, at this time, the exposure surface of the substrate 50 and the reference surface 68, that is, the exposure surface of the substrate 50 and the imaging surface of the exposure portion 40 will coincide.

接著,針對基板固定部60夾持基板50的動作進行說明。在此,針對夾持矩形形狀之基板50之情況的動作進行說明。首先,作業員將基板50載置於基板固定器61,例如將設在曝光裝置100的開關按下去時,基板固定器61會吸引吸附基板50來保持。Next, the operation of clamping the substrate 50 by the substrate fixing portion 60 will be described. Here, the operation in the case where the rectangular substrate 50 is clamped will be described. First, when an operator places the substrate 50 on the substrate holder 61, for example, when a switch provided in the exposure apparatus 100 is pressed down, the substrate holder 61 attracts and holds the substrate 50 by suction.

接著,在基板固定器61的X軸方向外側待機的基板按壓構件67,會配合基板50的尺寸來往X軸方向平行移動,避開基板50的曝光區域而停止在與基板50的邊緣部分於Z軸方向重疊的位置。在此,基板50的尺寸,事先由作業員來登錄於控制部亦可,以未圖示的感測器檢測亦可。Next, the substrate pressing member 67 waiting outside the X-axis direction of the substrate holder 61 will move parallel to the X-axis direction in accordance with the size of the substrate 50, avoiding the exposure area of the substrate 50 and stopping at the edge of the substrate 50. The position where the axis directions overlap. Here, the size of the substrate 50 may be registered in the control unit by an operator in advance, or may be detected by a sensor (not shown).

構成為可使基板按壓構件67往與保持面61a平行的方向移動,藉此可讓基板固定部60夾持各種尺寸的基板50。且,在將基板50載置於基板固定器61或是從基板固定器61拆下基板50的情況時,使基板按壓構件67移動至基板固定器61的外側,藉此可容易進行基板50的替換。且,構成為可使基板按壓構件67在位置固定的導引軌道亦即導引構件65上滑動,藉此可一邊防止基板按壓構件67往與基板固定器61之保持面61a正交的方向位移,一邊使基板按壓構件67移動。It is configured such that the substrate pressing member 67 can be moved in a direction parallel to the holding surface 61 a, whereby the substrate fixing portion 60 can clamp the substrate 50 of various sizes. In addition, when the substrate 50 is placed on the substrate holder 61 or when the substrate 50 is removed from the substrate holder 61, the substrate pressing member 67 is moved to the outside of the substrate holder 61, whereby the substrate 50 can be easily installed. replace. In addition, the substrate pressing member 67 is configured to slide on the guide member 65 which is a fixed position guide rail, thereby preventing the substrate pressing member 67 from being displaced in a direction orthogonal to the holding surface 61a of the substrate holder 61 , While moving the substrate pressing member 67.

之後,驅動氣壓缸62,使基板固定器61往Z軸方向移動,而將保持在基板固定器61的基板50,以既定的壓力按壓於基板按壓構件67。在此,將基板50按壓於基板按壓構件67的壓力,是事先由作業員登錄於控制部亦可,使用未圖示的感測器來迴授控制亦可。藉此,使基板50被基板固定部60夾持。且,此時,如上述般,藉由基板50的曝光面與基板按壓構件67來界定的基準面68為一致。After that, the pneumatic cylinder 62 is driven to move the substrate holder 61 in the Z-axis direction, and the substrate 50 held by the substrate holder 61 is pressed against the substrate pressing member 67 with a predetermined pressure. Here, the pressure for pressing the substrate 50 against the substrate pressing member 67 may be registered in the control unit by an operator in advance, or feedback control may be performed using a sensor not shown. Thereby, the substrate 50 is clamped by the substrate fixing portion 60. Also, at this time, as described above, the reference plane 68 defined by the exposure surface of the substrate 50 and the substrate pressing member 67 are the same.

如以上所述,曝光裝置100,具備將基板50予以吸引吸附來保持的基板固定器61。且,曝光裝置100,具備基板按壓構件67,其配置成不會往與保持面61a正交的方向(Z軸方向)位移。該基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。As described above, the exposure apparatus 100 includes the substrate holder 61 that sucks and holds the substrate 50 by suction. Furthermore, the exposure apparatus 100 is equipped with the board|substrate pressing member 67, and it is arrange|positioned so that it may not shift to the direction (Z-axis direction) orthogonal to the holding surface 61a. When the substrate 50 held by the substrate holder 61 is pressed against the substrate pressing member 67 by the pneumatic cylinder 62, the substrate pressing member 67 abuts against the substrate 50 at a position avoiding the exposure area of the substrate 50.

根據該曝光裝置100,基板固定器61會吸引吸附基板50來保持,故可維持基板50的平坦性。且,基板按壓構件67,配置成不會往與保持面61a正交的方向位移。因此,使基板按壓構件67之與基板50抵接之面與曝光部40的成像面一致,藉此可在基板50與基板按壓構件67抵接時使基板50的曝光面與曝光部40的成像面一致。且,基板按壓構件67,在保持於基板固定器61的基板50被氣壓缸62給按壓於基板按壓構件67時,會在避開基板50之曝光區域的位置與基板50抵接。因此,可提升基板50的平坦性,而防止發生於基板50之曝光面的不良情況。According to the exposure apparatus 100, the substrate holder 61 attracts and holds the substrate 50, so the flatness of the substrate 50 can be maintained. In addition, the substrate pressing member 67 is arranged so as not to be displaced in a direction orthogonal to the holding surface 61a. Therefore, the surface of the substrate pressing member 67 that is in contact with the substrate 50 is aligned with the imaging surface of the exposure section 40, so that the exposure surface of the substrate 50 and the exposure section 40 can be imaged when the substrate 50 and the substrate pressing member 67 are in contact with each other. Same face. When the substrate 50 held by the substrate holder 61 is pressed against the substrate pressing member 67 by the pneumatic cylinder 62, the substrate pressing member 67 abuts against the substrate 50 at a position avoiding the exposure area of the substrate 50. Therefore, the flatness of the substrate 50 can be improved, and defects that occur on the exposed surface of the substrate 50 can be prevented.

在本實施形態,雖說明了基板按壓構件67配合基板50的尺寸而於X軸方向平行移動,但並不限定於此。基板按壓構件67,避開基板50的曝光區域而固定在與基板50的邊緣部分於Z軸方向重疊的位置亦可。在以曝光裝置100曝光之基板50的尺寸沒有變化的情況,藉由該構造,省略導引構件65及滑動構件66,而可使基板固定部60的構造簡易化。此時,為了讓作業員容易將基板固定器61載置於基板50,亦可設置從X軸方向或Y軸方向,通過基板固定器61與基板按壓構件67之間的間隙來供給基板50的基板供給機構。基板供給機構,例如為並排配置有滾軸而成的滑送機構亦可。In this embodiment, although the substrate pressing member 67 has been described to move in parallel in the X-axis direction in accordance with the size of the substrate 50, it is not limited to this. The substrate pressing member 67 may avoid the exposure area of the substrate 50 and be fixed at a position overlapping the edge portion of the substrate 50 in the Z-axis direction. In the case where the size of the substrate 50 exposed by the exposure apparatus 100 does not change, with this structure, the guide member 65 and the sliding member 66 are omitted, and the structure of the substrate fixing portion 60 can be simplified. At this time, in order for the operator to easily place the substrate holder 61 on the substrate 50, it is also possible to provide the substrate 50 from the X-axis direction or the Y-axis direction through the gap between the substrate holder 61 and the substrate pressing member 67. Substrate supply mechanism. The substrate supply mechanism may be, for example, a sliding mechanism in which rollers are arranged side by side.

此外,在基板50設有複數個曝光區域的情況時,亦可如圖5所示般,使用格子狀的基板按壓構件67A,其具有使與基板50之複數個曝光區域對應的區域開口的開口部67c。在該情況時,在基板50的邊緣部分以外亦與基板按壓構件67A抵接,故可更加提升基板50的平坦性。此時,藉由氣壓缸62,除了基板固定器61的外周部以外,還對基板固定器61的中央部施加力亦可。In addition, when the substrate 50 is provided with a plurality of exposure regions, as shown in FIG. 5, a grid-shaped substrate pressing member 67A having openings for opening regions corresponding to the plurality of exposure regions of the substrate 50 may also be used.部67c. In this case, the substrate pressing member 67A is in contact with the substrate pressing member 67A except for the edge portion of the substrate 50, so that the flatness of the substrate 50 can be further improved. At this time, the pneumatic cylinder 62 may apply force to the center part of the substrate holder 61 in addition to the outer peripheral part of the substrate holder 61.

以上,雖針對本發明的幾個實施形態進行了說明,但上述之發明的實施形態,為用來易於理解本發明者,並非用來限定本發明。本發明,在不超出其主旨的範圍內可進行變更或改良,且於本發明包含其同等物。且,在可解決上述課題的至少一部分的範圍,或是發揮效果的至少一部分的範圍,可進行申請專利範圍及說明書所記載之各構成要件的組合或省略。Although several embodiments of the present invention have been described above, the above-mentioned embodiments of the invention are intended to facilitate the understanding of the present invention and are not intended to limit the present invention. The present invention can be changed or improved within the scope not exceeding the gist thereof, and the equivalents thereof are included in the present invention. In addition, in the range where at least a part of the above-mentioned problems can be solved or at least a part of the effect is exerted, the combination or omission of the respective constituent elements described in the scope of the patent application and the specification can be made.

10:第1基板搬運部 11,21,31,41:支撐構件 12,22,32,42,64:導引構件 13,23,43:線性馬達 20:第2基板搬運部 30:對位攝影部 33:軸馬達 34:攝影機 40:曝光部 44:曝光頭 50:基板 60:基板固定部 61:基板固定器 61a:保持面 62:氣壓缸 62a:缸體部 62b:桿 63:基板固定器支撐構件 64:基板固定器導引構件 64a:桿部 64b:軸承部 65:導引構件 66:滑動構件 67:基板按壓構件 67a:抵接部 67b:固定部 67d:平坦面 67A:基板按壓構件 67c:開口部 68:基準面 100:曝光裝置 101:基座框 102:第1基座構件 103:第2基座構件10: The first board conveying department 11, 21, 31, 41: support member 12, 22, 32, 42, 64: guide member 13,23,43: Linear motor 20: The second board conveying department 30: Counterpoint Photography Department 33: Shaft motor 34: Camera 40: Exposure Department 44: Exposure head 50: substrate 60: Board fixing part 61: substrate holder 61a: Keep the face 62: pneumatic cylinder 62a: Cylinder body 62b: Rod 63: substrate holder support member 64: substrate holder guide member 64a: pole 64b: Bearing part 65: Guiding member 66: Sliding member 67: substrate pressing member 67a: Abutment part 67b: Fixed part 67d: flat surface 67A: Board pressing member 67c: opening 68: datum plane 100: Exposure device 101: pedestal frame 102: The first base member 103: The second base member

[圖1]表示本發明之一實施形態之曝光裝置之全體構造的立體圖。 [圖2]表示本發明之一實施形態之基板固定部的立體圖。 [圖3]表示本發明之一實施形態之基板固定部夾持基板之狀態的立體圖。 [圖4]表示本發明之一實施形態之基板固定部夾持基板之狀態的剖面圖。 [圖5]表示具有與本發明之一實施形態之複數個曝光區域對應之開口的基板按壓構件的俯視圖。[Fig. 1] A perspective view showing the overall structure of an exposure apparatus according to an embodiment of the present invention. [Fig. 2] A perspective view showing a substrate fixing portion according to an embodiment of the present invention. [Fig. 3] A perspective view showing a state in which a substrate is clamped by a substrate fixing portion according to an embodiment of the present invention. [FIG. 4] A cross-sectional view showing a state in which a substrate is clamped by a substrate fixing portion in an embodiment of the present invention. [FIG. 5] A plan view showing a substrate pressing member having openings corresponding to a plurality of exposure regions in one embodiment of the present invention.

50:基板 50: substrate

60:基板固定部 60: Board fixing part

61:基板固定器 61: substrate holder

61a:保持面 61a: Keep the face

62:氣壓缸 62: pneumatic cylinder

63:基板固定器支撐構件 63: substrate holder support member

64:基板固定器導引構件 64: substrate holder guide member

64a:桿部 64a: pole

64b:軸承部 64b: Bearing part

65:導引構件 65: Guiding member

66:滑動構件 66: Sliding member

67:基板按壓構件 67: substrate pressing member

67a:抵接部 67a: Abutment part

67b:固定部 67b: Fixed part

Claims (10)

一種曝光裝置,使基板曝光,具備: 基板固定器,其具有將前述基板予以吸引吸附來保持的保持面; 驅動機構,其使前述基板固定器往與前述保持面正交的方向移動;以及 基板按壓構件,其配置成不會往與前述保持面正交的方向位移,在保持於前述基板固定器的前述基板被前述驅動機構給按壓於前述基板按壓構件時,會在避開前述基板之曝光區域的位置與前述基板抵接。An exposure device for exposing a substrate, including: A substrate holder, which has a holding surface for attracting and holding the aforementioned substrate; A driving mechanism that moves the substrate holder in a direction orthogonal to the holding surface; and The substrate pressing member is arranged so as not to be displaced in a direction orthogonal to the holding surface. When the substrate held by the substrate holder is pressed against the substrate pressing member by the drive mechanism, it avoids the difference between the substrate and the substrate. The position of the exposure area is in contact with the aforementioned substrate. 如請求項1所述之曝光裝置,其中, 前述基板按壓構件,構成為可在與前述保持面平行的方向移動。The exposure device according to claim 1, wherein: The substrate pressing member is configured to be movable in a direction parallel to the holding surface. 如請求項2所述之曝光裝置,其中, 前述基板按壓構件,構成為在位置固定的導引軌道上滑動。The exposure device according to claim 2, wherein: The aforementioned substrate pressing member is configured to slide on a guide rail having a fixed position. 如請求項1所述之曝光裝置,其中, 前述基板按壓構件的位置固定。The exposure device according to claim 1, wherein: The position of the aforementioned substrate pressing member is fixed. 如請求項1至請求項4中任一項所述之曝光裝置,其中, 前述基板按壓構件,具有與前述基板抵接的平坦面。The exposure device according to any one of claim 1 to claim 4, wherein: The substrate pressing member has a flat surface in contact with the substrate. 如請求項1至請求項4中任一項所述之曝光裝置,其中, 前述基板按壓構件,配置成與前述基板之互相對向的兩個邊緣部分抵接。The exposure device according to any one of claim 1 to claim 4, wherein: The substrate pressing member is arranged so as to abut against two opposite edge portions of the substrate. 如請求項1至請求項4中任一項所述之曝光裝置,其中, 前述基板按壓構件,是使與設在前述基板的複數個曝光區域對應的區域開口的格子狀構件。The exposure device according to any one of claim 1 to claim 4, wherein: The substrate pressing member is a lattice-shaped member that opens regions corresponding to a plurality of exposure regions provided on the substrate. 如請求項1至請求項4中任一項所述之曝光裝置,其中, 前述驅動機構,構成為對前述基板固定器之外周部的複數個位置施加力。The exposure device according to any one of claim 1 to claim 4, wherein: The drive mechanism is configured to apply force to a plurality of positions on the outer periphery of the substrate holder. 如請求項1至請求項4中任一項所述之曝光裝置,其中, 其進一步具備:第1基板搬運部,其在保持於前述基板固定器的前述基板被前述驅動機構給按壓於前述基板按壓構件的狀態下,將前述基板搬運至曝光部;以及 第2基板搬運部,其與前述第1基板搬運部並排配置,在保持於前述基板固定器的前述基板被前述驅動機構給按壓於前述基板按壓構件的狀態下,將前述基板搬運至前述曝光部, 一個前述曝光部,是使被前述第1基板搬運部給搬運的前述基板、被前述第2基板搬運部給搬運的前述基板交互地曝光。The exposure device according to any one of claim 1 to claim 4, wherein: It further includes: a first substrate conveying section that conveys the substrate to the exposure section in a state where the substrate held by the substrate holder is pressed by the substrate pressing member by the drive mechanism; and The second substrate conveying section is arranged side by side with the first substrate conveying section, and conveys the substrate to the exposure section in a state where the substrate held by the substrate holder is pressed by the substrate pressing member by the drive mechanism , One said exposure part is to alternately expose the said board|substrate conveyed by the said 1st board|substrate conveyance part, and the said board|substrate conveyed by the said 2nd board|substrate conveyance part. 一種曝光方法,使用曝光裝置來曝光基板,具備: 準備請求項1至請求項4中任1項所述之曝光裝置的步驟、 藉由前述基板固定器來吸引吸附前述基板的步驟、 藉由前述驅動機構來將保持在前述基板固定器的前述基板按壓於前述基板按壓構件的步驟、 藉由前述曝光部進行曝光的步驟。An exposure method that uses an exposure device to expose a substrate and includes: The steps of preparing the exposure device described in any one of claim 1 to 4, The step of attracting and adsorbing the aforementioned substrate by the aforementioned substrate holder, The step of pressing the substrate held in the substrate holder to the substrate pressing member by the drive mechanism, The step of exposing is performed by the aforementioned exposing part.
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