TW201741775A - Alignment method of mask and workpiece in double-sided photolithography device and double-sided photolithography device enabling alignment between a first mask and a second mask and alignment of a first mask and a second mask with a workpiece without moving or rotating the workpiece - Google Patents

Abstract

This invention discloses an alignment method of a mask and a workpiece in a double-sided photolithography device and a double-sided photolithography device, which enable alignment between a first mask and a second mask and alignment of a first mask and a second mask with a workpiece without moving and rotating the workpiece, comprising a first mask table which makes the first mask movable along the xy plane and rotatable along the xy plane simultaneously, and a second mask table which makes the second mask movable along the xy plane and rotatable along the xy plane simultaneously. The second mask table is movable and rotatable along the xy plane separately from the first mask table and, when the first mask table moves and rotates along the xy plane, moves and rotates along the xy plane together with the first mask table.

Description

Double-sided lithography apparatus and method for aligning mask and workpiece in double-sided lithography apparatus

The present invention relates to a double lithography apparatus and a method of aligning a mask with a workpiece in a double lithography apparatus.

Conventionally, a double-sided lithography apparatus that performs photolithography on a first surface of a workpiece (a circuit board or the like) to be lithographically coated and a second surface opposite to the first surface has been widely used. In such a double-sided lithography apparatus, after the first mask disposed on the first surface side of the workpiece is aligned with the second mask disposed on the second surface side of the workpiece, the first mask is placed And when the second mask is aligned with the workpiece, the first mask and the second mask are aligned with the workpiece when the positional relationship between the first mask and the second mask remains unchanged.

In this way, as an alignment method for maintaining the alignment relationship between the first mask and the second mask and the workpiece while maintaining the positional relationship between the first mask and the second mask, an example of which is: After the mask is aligned with the second mask, the first mask is first moved and rotated by a predetermined amount to align the first mask with the workpiece, and then, according to the first mask The amount of movement or amount of rotation moves and rotates the second mask to align the second mask with the workpiece.

Alignment control like this, that is, software control, is realized by constructing a control software for performing alignment control in advance. However, in the software control process like this, even when the control data for performing the alignment control of the first mask and the workpiece is appropriately set, the first mask table sometimes occurs (Table). The physical deviation between the operation of the drive structure and the operation of the second mask stage drive structure.

Therefore, if the second mask is aligned with the workpiece according to the control data for performing the alignment control of the first mask and the workpiece, it is possible that the first mask and the first alignment have been completed. A positional shift occurs between the two masks, and as a result, the first mask and the second mask cannot be aligned with high precision.

On the other hand, it is also possible to complete the first mask and the second mask and the workpiece by using the mechanical operation to maintain the positional relationship between the first mask and the second mask without using the above-described software control. An aligned double-sided lithography apparatus is proposed (for example, refer to Patent Document 1).

The double-sided lithography apparatus described in Patent Document 1 is configured to align the first mask and the second mask that have been aligned with the workpiece after aligning the first mask and the second mask. On time, the first mask and the second mask are not moved and rotated, respectively, but one side of the workpiece is moved and rotated on a plane. By doing so, it is possible to align the aligned first mask and the second mask with the workpiece while maintaining the positional relationship of the first mask and the second mask unchanged.

Advanced technical literature

Patent Document 1: JP-A-2013-142778

However, as in the double-sided lithography apparatus described in Patent Document 1, when the first mask and the second mask are aligned with the workpiece, a method of moving the workpiece side is used, but this method is based on the type of the workpiece. Different, sometimes there will be unsatisfactory situations. For example, a workpiece such as a strip-like piece is advanced from a conveying roller to a winding roller, that is, in a double-sided lithography apparatus called a Roll to Roll method, if one side of the workpiece is to be on a flat surface When moving and rotating, since the structure for moving and rotating the workpiece on one side of the workpiece needs to be incorporated into the conveying structure of the workpiece, the conveying structure of the workpiece becomes complicated, and once the workpiece is The movement and rotation of the side on the plane may become a cause of wrinkles or distortion of the workpiece. Thus, there is a problem that high-quality double-sided lithography cannot be performed once the workpiece is wrinkled or twisted.

The present invention has been made in view of the above problems, and provides a double-sided lithography apparatus capable of aligning a first mask with a second mask, a first mask, and a second mask with a workpiece without moving and rotating the workpiece. And a method of aligning a mask with a workpiece in a double lithography apparatus.

(1) In the double lithography apparatus of the present invention, the first surface of the workpiece to be lithographically coated is photolithographically patterned by the first mask, and the second surface opposite to the first surface is etched by the second mask The lithography is characterized in that, when the surface parallel to the first surface and the second surface is defined as an xy plane including the vertically intersecting x-axis and the y-axis, the method includes: making the first mask along the xy plane a first mask stage that moves while moving along the xy plane; and a second mask stage that rotates along the xy plane while the second mask is movable along the xy plane, wherein the second mask stage is mounted on the first cover a cover table, and is rotatable along the xy plane while moving along the xy plane except the first mask stage on the first mask stage, and when the first mask stage moves along the xy plane, A masking table is moved by the same amount in the same direction on the xy plane. When the first masking table is rotated along the xy plane, the first masking table is rotated by the same amount in the same direction on the xy plane.

As such, the lithographic apparatus of the present invention has the second mask stage placed on the first mask stage, and is movable on the first mask stage along the xy plane except for the first mask stage. Rotating along the xy plane, when the first mask stage moves along the xy plane, the first mask stage moves in the same direction on the xy plane by the same amount, and when the first mask stage rotates along the xy plane, The first mask table is rotated by the same amount in the same direction on the xy plane.

Since the lithographic apparatus of the present invention has such a configuration as described above, the first mask and the second mask, the first mask, and the second mask and the workpiece can be performed without moving or rotating the workpiece. alignment. In this way, it is not necessary to fit the structure for moving and rotating on the plane of one side of the workpiece into the conveying structure of the workpiece, so that the conveying structure of the workpiece is not complicated, and since The workpiece is wrinkled or twisted, so high-quality double-sided lithography can be performed.

In addition, according to the lithographic apparatus of the present invention, not only after the first mask and the second mask are aligned, but also the first mask and the second mask position relationship remain unchanged, the first mask is performed. The hood and the alignment of the second mask and the workpiece are further capable of performing the first mask and the second after the first mask and the workpiece are aligned, and the first mask and the workpiece position relationship remain unchanged. The alignment of the mask.

(2) In the double lithography apparatus of the present invention, it is preferable to have a first mask mounting plate (Plate) which is provided on the first surface side of the workpiece and which is capable of freely attaching and detaching the first mask (Plate) And a second mask mounting plate disposed on the second side of the workpiece and capable of freely mounting and detaching the second mask, wherein the first mask mounting plate is vertically disposed on the first mask The support member on the table is thus fixed to the first mask table, and the second mask mounting plate is fixed to the second mask table by a support member vertically disposed on the second mask table.

Because of the above configuration, when the first mask table moves along the xy plane, the first mask mounting plate moves the same amount in the same direction on the xy plane along with the first mask table, when the first cover When the cover is rotated along the xy plane, the first mask mounting plate is rotated by the same amount in the same direction on the xy plane along with the first mask table. By doing so, it is possible to rotate the first mask while moving along the xy plane while moving along the xy plane. Similarly, when the second mask table moves along the xy plane, the second mask mounting plate moves the same amount in the same direction on the xy plane along with the second mask table, when the second mask table is along the xy plane. When rotated, the second mask mounting plate rotates the same amount in the same direction on the xy plane along with the second mask table. By doing so, it is possible to rotate the second mask while moving along the xy plane while moving along the xy plane.

(3) In the double-sided lithography apparatus of the present invention, the movement along the xy plane preferably means that it can move along the y-axis while moving along the x-axis; the rotation along the xy plane preferably means that The xy plane rotates around the z-axis perpendicular to the axis.

In this way, since the driving structure for driving the first mask stage and the second mask stage is set to be movable (reciprocating movement) to two axes (x-axis and y-axis) perpendicularly intersecting, and It is sufficient to rotate around the z-axis perpendicular to the xy plane (clockwise rotation and counterclockwise rotation), so that the drive structure can be simplified.

(4) In the double lithography apparatus of the present invention, preferably, the mask alignment marks (Mark) for aligning the first mask and the second mask are respectively disposed on the first mask and the And the workpiece alignment marks for the first mask and the second mask aligned with the workpiece are respectively disposed on the mask and the workpiece of at least one of the first mask and the second mask. .

By doing so, alignment of the first mask and the second mask with the workpiece can be performed while the first mask and the second mask are aligned.

(5) In the double-sided lithography apparatus of the present invention, preferably, further comprising: an image pickup device capable of capturing a mask alignment mark and a workpiece alignment mark; and having image data obtained by the image pickup device Controlling the second mask table so that the mask alignment marks respectively disposed at the first mask and the second mask are consistent, and simultaneously controlling the first mask table to be respectively disposed on the first mask and the second An alignment control device that functions at least one of the masks at the mask and the workpiece alignment mark at the workpiece.

By providing such an image pickup device and an alignment control device, the first mask and the second mask, the first mask, and the second mask and the workpiece can be performed without moving or rotating the workpiece. alignment. For example, the second mask can be aligned with the first mask with high precision, and at the same time, after the first mask and the second mask are aligned with high precision, the first mask is performed without moving the workpiece. High precision alignment of the cover and the second mask with the workpiece.

(6) In the double-sided lithography apparatus of the present invention, it is preferable to further have an imaging device movement control device capable of controlling a moving imaging device, and the imaging device movement control device is provided to control imaging at least during photolithography The device moves to position the camera at a location away from the area of the lithographic article on the workpiece.

In this way, since the image pickup device is located at a position away from the lithographic article region on the workpiece during photolithography, it is possible to prevent the image pickup device from blocking light from the light source during photolithography.

(7) In the double-sided lithography apparatus of the present invention, it is preferable that the mask alignment marks are provided at positions m (m is an integer of 2 or more) at predetermined positions spaced apart from each other on the first mask, And at a predetermined position on the second mask at a mutually spaced predetermined position corresponding to the mask alignment mark disposed at the first mask, where m is disposed; the workpiece alignment mark is at the first mask and the second mask n at a predetermined position on the mask of at least one of the covers (n is an integer greater than or equal to 2), and n workpieces disposed on the mask at predetermined positions spaced apart from each other on the workpiece The alignment mark is correspondingly set to n.

By providing the mask alignment marks on the first mask and the second mask as described above, the alignment of the first mask and the second mask can be performed with high precision. Further, since the workpiece alignment mark is provided on at least one of the first mask and the second mask as described above, the first mask and the second mask and the workpiece can be accurately performed. alignment.

(8) The method of aligning a mask with a workpiece in the double lithography apparatus of the present invention is to photolithography the first surface of the workpiece as a lithographic article by the first mask, and to be associated with the first surface In the double-sided lithography apparatus on which the second side of the opposite side is photolithographically patterned by the second mask, the first mask and the second mask are performed while the first mask and the second mask are aligned. The workpiece alignment is characterized in that, as the double-sided lithography apparatus, the double-sided lithography apparatus described in any one of (1) to (7) is used, and as the first mask and the second mask are aligned Simultaneously, the step of performing the first mask and the second mask to align with the workpiece comprises: a mask alignment step, by moving the second mask stage along the xy plane and rotating along the xy plane At least one of the first mask and the second mask is aligned; and the mask and the workpiece alignment step are performed by performing at least one of movement and rotation of the first mask table along the xy plane The alignment of the mask with the workpiece.

According to the double-sided lithography apparatus of the present invention, the double-sided lithography apparatus described in any one of (1) to (7) is used as the double-sided lithography apparatus. The same effects as those of the double-sided lithography apparatus described in (1) to (7) can be obtained.

(9) In the method of aligning a mask with a workpiece in the double lithography apparatus of the present invention, it is preferable to perform the step of aligning the mask with the workpiece after performing the mask alignment step.

The alignment with the workpiece is performed by aligning the first mask with the second mask (mask alignment step), and then aligning the first mask and the second mask with the workpiece (mask) In the step of aligning the workpiece with the step of aligning the mask, the step of masking and the step of aligning the workpiece, the relationship between the position of the first mask and the second mask can be maintained. The first mask and the second mask are aligned with the workpiece.

(10) In the double-sided lithography apparatus of the present invention, in the method of aligning the mask with the workpiece, the mask alignment step may be performed after the mask and the workpiece alignment step.

The method of aligning the mask with the workpiece is to first align the first mask with the workpiece (the step of aligning the mask with the workpiece), and then align the first mask with the second mask (mask pair) In the order of mask alignment step, mask and workpiece alignment step, the first mask and the first mask can be performed while the first mask and the workpiece position relationship remain unchanged The alignment of the two masks.

Hereinafter, embodiments of the present invention will be described.

Fig. 1 is a perspective view for explaining the double-sided lithography apparatus 10 according to the embodiment.

Fig. 2 is a front view for explaining the double-sided lithography apparatus 10 according to the embodiment. In addition, a part of Fig. 2 is shown as a sectional view.

As shown in FIGS. 1 and 2, the double-sided lithography apparatus 10 according to the embodiment lithographs the first surface Wa of the workpiece W as a lithography target by the first mask M1. The second surface Wb on the opposite side of the Wa side is photolithographically patterned by the second mask M2. Further, in the double lithography apparatus 10 according to the embodiment, the workpiece W is defined as a long sheet, and the long sheet-shaped workpiece W travels from a conveying roller (not shown) to the winding roller, that is, A roll-to-roll double lithography apparatus. Further, the workpiece W is, for example, a flexible circuit substrate or the like, and the first mask M1 and the second mask M2 are each composed of a transparent plate material (for example, a glass plate or the like) formed in a rectangular shape, and each of which is formed with a predetermined pattern (determined) For circuit graphics).

Further, in the embodiment, the plane parallel to the first surface Wa and the second surface Wb of the workpiece W is defined as a plane including two axes (x-axis and y-axis) perpendicularly intersecting, and the x-axis is defined as The y-axis is defined along the direction in which the workpiece W travels in a direction perpendicular to the traveling direction of the workpiece W.

Hereinafter, the double sided lithography apparatus 10 according to the embodiment will be described in detail.

The double-sided lithography apparatus 10 according to the embodiment includes: a first mask stage 100 that rotates along the xy plane while the first mask M1 is movable along the xy plane; and the second mask M2 is movable along the xy plane The second mask stage 200 that rotates along the xy plane at the same time, and the "movable along the xy plane" means that it can move along the y-axis while moving along the x-axis; "can be rotated along the xy plane" means that Rotate around the z-axis perpendicular to the xy plane.

In addition, the second mask stage 200 is placed on the first mask stage 100, and can be rotated along the xy plane while moving along the xy plane except the first mask stage 100 on the first mask stage 100. . In addition, when the first mask stage 100 moves along the xy plane, the second mask stage 200 moves the same amount in the same direction on the xy plane along with the first mask stage 100, when the first mask stage 100 is along When the xy plane is rotated, the second mask stage 200 is rotated by the same amount in the same direction on the xy plane as the first mask stage 100.

Specifically, when the first mask stage 100 is moved by a predetermined amount in one direction of the x-axis, the second mask stage 200 is also moved by the same amount in one direction of the x-axis; when the first mask stage 100 is along the x When the axial direction moves by a predetermined amount in the other direction, the second mask stage 200 is also moved by the same amount in the other direction of the x-axis. In addition, the same is true when the first mask stage 100 is moved along the y-axis. That is, when the first mask stage 100 is moved by a predetermined amount in one direction of the y-axis, the second mask stage 200 is also moved by the same amount in one direction of the y-axis; when the first mask stage 100 is along the y-axis When the other direction is moved by a prescribed amount, the second mask stage 200 is also moved by the same amount in the other direction of the y-axis.

In addition, when the first mask stage 100 is rotated clockwise by a predetermined amount around the y-axis, the second mask stage 200 is also rotated clockwise by the same amount around the y-axis; when the first mask stage 100 is around the y-axis When the predetermined amount is rotated counterclockwise, the second mask table 200 is also rotated counterclockwise by the same amount around the y-axis.

In this manner, the second mask stage 200 can move along the xy plane and rotate along the xy plane except for the first mask stage 100, and when the first mask stage 100 moves along the xy plane, it will follow the first The mask stage 100 is moved by the same amount in the same direction on the xy plane. When the first mask stage 100 is rotated along the xy plane, the first mask stage 100 rotates in the same direction on the xy plane in the same direction. the amount. In addition, in FIG. 1 and FIG. 2, illustration of the drive structure for driving the first mask stage 100 and the second mask stage 200 is omitted.

Next, the first mask stage 100 and the second mask stage 200 will be further described. First, the first mask stage 100 will be described. The planar shape of the first mask stage 100 is substantially rectangular, and a space portion 101 for transmitting light from the first light source 310 is formed at almost the center portion of the first mask stage 100.

At the four corners of the first mask stage 100, pillars 111 as support members are vertically disposed, and a front end portion of each pillar 111 is fixed with a first mask mounting plate that can freely attach and detach the first mask M1. 120. The first mask mounting plate 120 is disposed on the first face side of the workpiece W. Further, a space portion 121 for transmitting light from the second light source 320 is formed at a substantially central portion of the first mask mounting plate 120, and the first mask M1 is detachably attached to the space portion 121 to cover the space portion 121. Space portion 121.

Since the first mask mounting plate 120 is fixed to the first mask table 100 as such, the first mask mounting plate 120 can follow the first mask when the first mask table 100 moves along the xy plane The stage 100 is moved by the same amount in the same direction on the xy plane, and when the first mask stage 100 is rotated along the xy plane, the first mask table 100 is rotated by the same amount in the same direction on the xy plane. By this, the movement of the first mask M1 along the xy plane and the rotation along the xy plane are performed by the movement of the first mask stage 100 along the xy plane and the rotation along the xy plane.

Further, the first mask mounting plate 120 is reciprocally movable in the z-axis direction (upward and downward directions in the first drawing and the second drawing) by a driving structure (not shown). Therefore, the interval between the first mask M1 and the workpiece W can be adjusted.

Next, the second mask stage 200 will be described. The second mask stage 200 is also substantially rectangular in plan shape like the first mask stage 100, but is smaller in size than the first mask stage 100, and The second mask stage 200 is placed on the first mask stage with a predetermined interval between the four edge portions (edges) and the edge portions (edges) corresponding to the first mask stage 100, respectively. 100 on. Further, a space portion 201 for transmitting light from the first light source 310 is formed at almost the center portion of the second mask stage 200.

At the four corners of the second mask stage 200, pillars 211 as support members are vertically disposed, and a front end portion of each pillar 211 is fixed with a second mask mounting plate that can freely attach and detach the second mask M2. 220. The second mask mounting plate 220 is disposed on the second face side of the workpiece W. Further, a space portion 221 for transmitting light from the first light source 310 is formed at a substantially central portion of the second mask mounting plate 320, and the second mask M2 is detachably attached to the space portion 221 to cover the space portion 221 Space portion 221.

However, in the double lithography apparatus according to the embodiment, the space portion 121 provided on the first mask mounting plate 120 and the space portion 221 provided on the second mask mounting plate 220 are respectively positioned. Same size.

Since the second mask mounting plate 220 is fixed to the second mask table 200 as such, the second mask mounting plate 220 can follow the second mask when the second mask table 200 moves along the xy plane The stage 200 is moved by the same amount in the same direction on the xy plane, and when the second mask stage 200 is rotated along the xy plane, the second mask stage 200 is rotated by the same amount in the same direction on the xy plane. By this, the movement of the second mask M2 along the xy plane and the rotation along the xy plane are performed by the movement of the second mask table 200 along the xy plane and the rotation along the xy plane.

Further, the second mask mounting plate 220 can be reciprocated in the z-axis direction (the vertical direction in the first drawing and the second drawing) by a driving structure (not shown). Therefore, the interval between the second mask M2 and the workpiece W can be adjusted.

However, a predetermined interval is provided between the first mask mounting plate 120 and the second mask mounting plate 220, and a workpiece W is further interposed between the first mask mounting plate 120 and the second mask mounting plate 220. .

In addition, among the first light source 310 and the second light source 320, the first light source 310 is disposed on the side of the first mask stage 100, and the optical axis L1 of the first light source 310 is in the horizontal direction. Moreover, after the light from the first light source 310 is refracted by the mirror 330 for 90 degrees, the second mask M2 is irradiated, so that the circuit pattern formed on the second mask M2 is on the workpiece W. Imaging on the second side Wb. On the other hand, the second light source 320 is disposed on the side of the first mask mounting plate 120, and the optical axis L2 of the second light source 320 is in the horizontal direction. Moreover, after the light from the second light source 320 is refracted by the mirror 340 by 90 degrees, the first mask M1 is irradiated, so that the circuit pattern formed on the first mask M1 is on the first side of the workpiece W. Imaging on Wa.

Further, the method of arranging the first light source 310 and the second light source 320 on the side of the first mask mounting plate 120 and the second mask mounting plate 220 is not particularly limited as long as it can be formed in the first cover. The circuit pattern on the cover M1 and the second mask M2 is suitably formed on the first surface Wa and the second surface Wb of the workpiece W.

In addition, although not shown in FIGS. 1 and 2, the alignment marks (that is, the mask alignment marks) for aligning the first mask M1 and the second mask M2 are respectively disposed on The first mask M1 and the second mask M2, at the same time, the alignment marks (ie, the workpiece alignment marks) for aligning the first mask M1 and the second mask M2 with the workpiece W are respectively set at the first A mask (at the first mask M1 in the double lithography apparatus 10 according to the embodiment) of at least one of the mask M1 and the second mask M2 is placed on the workpiece W. These mask alignment marks and workpiece alignment marks will be described later based on Fig. 4 .

Further, although not shown in FIGS. 1 and 2, an image pickup device that can image the mask alignment mark and the workpiece alignment mark is provided, and image data obtained by the image pickup device are provided. Thereby, the alignment control device that controls the second mask stage 200 while controlling the first mask stage 100. These imaging devices and alignment control devices will be described later based on FIGS. 4 and 5 .

Figure 3 is an explanatory view of the first mask stage 100 moving along the xy plane and rotating along the xy plane. In addition, since the drive structure for moving the first mask stage 100 along the xy plane and rotating along the xy plane can use a well-known technique, in FIG. 3, illustration of components other than the motor and the illustration are omitted. Description, and marked with a pattern. Further, although the first mask stage 100 will be described in the third diagram, the second mask stage 200 can be implemented in almost the same manner.

As shown in FIG. 3, three or four motors (three in the double-sided lithography apparatus according to the embodiment) for supplying the driving force to the first mask stage 100 are set as servo motors. (Servo motors)) Sx11, Sx12, and Sy13 are respectively disposed near three corners of the four corners of the first mask stage 100 by selectively operating the three motors Sx11, Sx12, and Sy13 The first mask table 100 can be rotated along the xy plane (clockwise or counterclockwise around the z-axis) while reciprocating along the xy plane (reciprocating along the x-axis and reciprocating along the y-axis).

Specifically, by rotating the motor Sx11 or the motor Sx12 in the forward direction, the first mask stage 100 can be moved in one direction (the left direction (x' direction) in FIG. 3) in the x-axis direction; When the motor Sx11 or the motor Sx12 rotates in the opposite direction, the first mask stage 100 can be moved in the other direction (the right direction (x direction) in FIG. 3) illustrated in the x-axis direction.

Further, by rotating the motor Sy13 in the forward direction, the first mask stage 100 can be moved in one direction (the lower direction (y' direction) in FIG. 3) in the y-axis direction; by rotating the motor Sy13 in the reverse direction The first mask stage 100 can be moved in the other direction (upward direction (y direction) in FIG. 3) illustrated in the y-axis direction.

Further, by rotating the motors Sx11, Sx12, and Sy13 in the same direction in the same direction, the first mask stage 100 can be made the center (the center of the space portion 101) not shown in the first mask stage 100. The assumed rotation axis is rotated counterclockwise (a' direction) around the z-axis; by rotating the motors Sx11, Sx12, and Sy13 in the opposite directions at the same time, the first mask table 100 can be made The center (the center of the space portion 101) not shown in the mask stage 100 is a hypothetical rotation axis, and rotates clockwise (a direction) around the z axis along the xy plane.

Further, when the first mask stage 100 is moved along the xy plane of the first mask stage, and the first mask stage 100 is rotated by a predetermined amount along the xy plane, the first mask stage 100 is maintained. The amount of movement along the xy plane is rotated by a prescribed amount along the xy plane. In addition, when the first mask stage 100 is rotated by a predetermined amount along the xy plane, and the first mask stage 100 is moved by a predetermined amount along the xy plane, the first mask stage 100 is maintained along the xy plane. The predetermined amount is moved along the xy plane in the state of the amount of rotation.

In addition, the movement along the xy plane is the range of movement (reciprocating range) when moving in the x-axis direction or in the y-axis direction and the amount of rotation when rotating in the xy plane (clockwise or counterclockwise rotation angle) In the double-sided lithography apparatus 10 according to the embodiment, the reciprocating range is, for example, about 0 to 10 mm, and the rotation angle range is, for example, about 0 to 10 degrees. However, the range of the reciprocating movement and the range of the angle of rotation are not limited.

In the third drawing, although three motors are taken as an example, the motors may be provided in the vicinity of the four corners of the first mask stage 100.

In addition, the second mask table 200 is also provided with three or four (three) motors (servo motors) for supplying the driving force to the second mask table 200. Omitted, but Sx21, Sx22, and Sy23) are disposed in the vicinity of the three corners of the four corners of the second mask stage 200, respectively, by selectively operating the three. Motors Sx21, Sx22, and Sy23 enable the second mask table 200 to rotate along the xy plane while moving back and forth along the xy plane (reciprocating along the x-axis and reciprocating along the y-axis) (around the z-axis) Hour hand or counterclockwise).

Next, the alignment of the first mask M1 and the second mask M2 and the alignment of the first mask M1 and the second mask M2 with the workpiece W will be described.

4 is an explanatory view of the alignment of the first mask M1 and the second mask M2 and the alignment of the first mask M1 and the workpiece W. In Fig. 4, only the constituent elements necessary for the explanation of the alignment are indicated and graphically illustrated. 4(a) is a perspective view, and FIG. 4(b) is a plan view of the first mask M1 overlooking the z-axis from above.

In addition, in FIG. 4, the area A1 surrounded by the rectangular broken line on the first mask M1 corresponds to the space portion 121 (see FIG. 1 and FIG. 2) provided on the first mask mounting plate 120. In the region, the region A2 surrounded by the rectangular dotted line on the second mask M2 is a region corresponding to the space portion 221 (see FIGS. 1 and 2) provided on the second mask mounting plate 220.

A mask alignment mark for alignment of the first mask M1 and the second mask M2 is respectively disposed on the first mask M1 and the second mask M2. The mask alignment marks are provided at positions m (m is an integer of 2 or more) at predetermined positions spaced apart from each other on the first mask M1. At a predetermined position spaced apart from each other on the second mask M2, m is disposed corresponding to the mask alignment mark at m provided on the first mask M1.

In the double sided lithography apparatus 10 according to the embodiment, description will be made with m=2. Therefore, the two mask alignment marks provided on the first mask M1 are defined as "mask alignment marks P1, P2"; the two mask alignment marks set on the second mask M2 are defined as " The mask is aligned with the marks P3, P4".

Specifically, on the side of the first mask M1, for example, a mask alignment mark P1 is provided inside the corners of one of the two corners of the diagonal of the first mask M1; A mask alignment mark P2 is provided on the inner side of the corner. Further, on the second mask M2 side, one of the two corner portions of the diagonal of the second mask M2 is provided with a corner portion of the mask alignment mark P1 corresponding to the first mask M1. The inside of the corner portion is provided with a mask alignment mark P3; and the other corner portion (corresponding to a corner portion of the corner portion of the first mask M1 on which the mask alignment mark P2 is provided) is provided with a mask pair Pre-marked P4.

When the mask alignment mark P1 of the first mask M1 coincides with the mask alignment mark P3 of the second mask M2, and when the mask of the first mask M1 is aligned with the mark P2 and the second mask M2 When the mask alignment marks P4 coincide, it is determined that the first mask M1 and the second mask M2 are properly aligned.

The mask alignment marks P1, P2 are disposed in the area A1 (the area corresponding to the space portion 121) surrounded by the dotted rectangular frame on the first mask M1, and are present on the first side Wa of the workpiece W. Photolithographic object area (area B1 marked in gray in Fig. 4(b)). On the other hand, the mask alignment marks P3, P4 are disposed in the area A2 (the area corresponding to the space portion 221) surrounded by the dotted rectangular frame on the second mask M2, and are the second side away from the workpiece W. The current lithographic object area on Wb (the second side Wb is also the area B1 marked in gray in Fig. 4(b)). Further, in the double-sided lithography apparatus 10 according to the embodiment, the "position away from the lithographic article region" is defined such that when the workpiece W is mounted as shown in FIGS. 1 and 2, the separation is performed. The position of the workpiece W in the width direction.

Further, workpiece alignment marks for the first mask M1 and the second mask M2 aligned with the workpiece W are respectively disposed on the first mask M1 and the workpiece W. The workpiece alignment marks are provided at n spaced apart predetermined positions on the first mask M1 (n is an integer greater than or equal to 2), and are spaced apart from the first mask at predetermined positions on the workpiece The workpiece alignment marks at n set on M1 are correspondingly set at n places.

In the double sided lithography apparatus 10 according to the embodiment, description will be made with n=2. Therefore, the two workpiece alignment marks set on the first mask M1 are defined as "workpiece alignment marks P5, P6"; the two workpiece alignment marks set on the second mask M2 are defined as "workpiece alignment" Mark P7, P8".

When the workpiece alignment mark P5 of the first mask M1 coincides with the workpiece alignment mark P7 of the workpiece W, and when the workpiece alignment mark P6 of the first mask M1 coincides with the workpiece alignment mark P8 of the workpiece W, The first mask M1 and the workpiece W are suitably aligned. Further, these workpiece alignment marks P5 and P6 are provided in the area A1 (the area corresponding to the space portion 121) surrounded by the dotted rectangular frame on the first mask M1.

However, whether the positions of the first mask M1 and the second mask M2 coincide with each other and whether the positions of the first mask M1 and the workpiece W are identical are based on the respective alignment marks of the image pickup device (mask alignment marks P1 to P4). And the image data obtained after the workpiece alignment marks P5 to P8 are imaged to determine.

In the double lithography apparatus 10 according to the embodiment, the imaging apparatus C includes imaging means C1 for imaging the mask alignment marks P1, P3 and the workpiece alignment marks P5, P7 with a time difference; An imaging device C2 for capturing the mask alignment marks P2 and P4 and the workpiece alignment marks P6 and P8 with a time difference.

Specifically, the camera C1 (also referred to as a camera C1) is for aligning the mask alignment mark P1 disposed on the first mask M1 with the mask disposed on the second mask M2. While the image P3 is being imaged, the workpiece alignment mark P5 provided on the first mask M1 and the workpiece alignment mark P7 provided on the workpiece W are imaged; the image pickup device C2 (also referred to as the camera C2) is For photographing the mask alignment mark P2 disposed on the first mask M1 and the mask alignment mark P4 disposed on the second mask M2, the workpiece disposed on the first mask M1 A device for imaging the alignment mark P6 and the workpiece alignment mark P8 provided on the workpiece W.

Further, the camera C1 has a time difference to the mask alignment mark P1 and the mask alignment mark P3, and images the workpiece alignment mark P5 and the workpiece alignment mark P7; the camera C2 has a time difference to the mask alignment mark P2 and the mask are aligned with the mark P4, and the workpiece alignment mark P6 and the workpiece alignment mark P8 are imaged. Therefore, the cameras C1, C2 can move along the xy plane, rotate around the z-axis, and move up and down along the z-axis. The driving structure for moving the cameras C1 and C2 along the xy plane, rotating around the z-axis, and moving up and down along the z-axis can be realized by a known technique, and thus the illustration and description are omitted.

FIG. 5 is an explanatory diagram of the alignment control device 500 and the imaging device movement control device 600 in the double-sided lithography apparatus 10 according to the embodiment. As shown in FIG. 5, the alignment control device 500 includes a first mask stage drive control unit 510 that controls the first mask stage 100 by controlling the motors Sx11, Sx12, and Sy13 of the first mask stage 100. Driving; the second mask stage driving control unit 520 drives the second mask stage 200 by controlling motors (Sx21, Sx22, and Sy23 (not shown) of the second mask stage 200; and the control unit 530 The control data is supplied to at least one of the first mask stage drive control unit 510 and the second mask stage drive control unit 520 based on the imaging data from the imaging device C (cameras C1 and C2).

The alignment control device 500 configured as described above has a function of controlling the second mask table 200 so as to be disposed in the first mask M1 and the second mask, respectively, based on the obtained image data from the cameras C1, C2. While the mask alignment marks on M2 are identical (the mask alignment marks P1 and P3 coincide, and the mask alignment marks P2 coincide with P4), the first mask stage 100 is controlled so as to be respectively disposed in the first mask M1 is aligned with the workpiece alignment mark on the workpiece W (the workpiece alignment marks P5 coincide with P7, and the workpiece alignment marks P6 coincide with P8).

Specifically, after the image data obtained by the cameras C1 and C2 is supplied to the control unit 530, the control unit 530 supplies the control data to the second mask stage drive control unit 520 based on the image data to make the mask alignment mark P1. Consistent with P3, and the mask alignment marks P2 coincide with P4. The second mask stage drive control unit 520 selectively drives the motors Sx21, Sx22, and Sy23 based on the control data. By doing so, alignment of the first mask M1 and the second mask M2 can be performed.

The mask alignment marks P1 and P3 coincide with each other, and after the mask alignment marks P2 and P4 coincide, the cameras C1 and C2 are moved, the workpiece alignment mark P5 and the workpiece alignment mark P7 are imaged, and the workpiece alignment marks are aligned. P6 and the workpiece alignment mark P8 perform imaging. At this time, after the image data obtained by the cameras C1 and C2 is supplied to the control unit 530, the control unit 530 supplies the control data to the first mask stage drive control unit 510 based on the image data so that the workpiece alignment mark P5 and P7 is identical and the workpiece alignment marks P6 coincide with P8. The first mask stage drive control unit 510 selectively drives the motors Sx11, Sx12, and Sy13 based on the control data from the control unit 530. By doing so, alignment of the first mask M1 with the workpiece W can be performed.

With such an alignment control device 500, the first mask M1 and the second mask M2 can be aligned, and the first mask M1 and the workpiece W can be aligned. Further, when the alignment of the first mask M1 and the workpiece W is performed, since the second mask M2 is also moved and rotated by the same amount in the same direction as the first mask M1, the first mask M1 and the second When the mask M2 is aligned, the alignment of the first mask M1 and the workpiece W is performed, and the second mask M2 maintains the positional relationship between the first mask M1 and the second mask M2. In this case, it is aligned with the workpiece W.

This is because of the result of the configuration in which the second mask stage 200 is placed on the first mask stage 100, and the first mask stage 100 can be removed from the first mask stage 100. When the first mask stage 100 moves along the xy plane while moving along the xy plane, the second mask stage 200 moves in the same direction on the xy plane along with the first mask stage 100. The same amount, when the first mask stage 100 is rotated along the xy plane, the second mask stage 200 is rotated by the same amount in the same direction on the xy plane as the first mask stage 100.

Next, the imaging device movement control device 600 will be described. The imaging device movement control device 600 includes a movement structure unit 610 for moving the cameras C1 and C2, and a movement control unit 620 for controlling the movement structure unit 610. The image pickup device movement control device 600 further has a function of controlling the movement of the cameras C1, C2 at least during photolithography so that the positions of the cameras C1, C2 are located away from the position of the lithographic article region B1 on the workpiece W. Thus, since the positions of the cameras C1, C2 are located away from the lithographic article area B1 on the workpiece W, it is possible to prevent the cameras C1, C2 from blocking the light from the light sources 310, 320 during photolithography.

Further, in the double lithography apparatus 10 according to the embodiment, when the cameras C1 and C2 are located at positions where the mask alignment marks P1 and P2 can be imaged, the cameras C1 and C2 are located. Leaving the position of the lithography object area B1. Therefore, the cameras C1 and C2 can be moved in the direction of the arrow y-y' in advance. During the photolithography, the control cameras C1 and C2 are moved in the y' direction, and then moved to the mask alignment marks P1 and P2. The location where the camera is taken.

As described above, in the double sided lithography apparatus 10 according to the embodiment, the second mask stage 200 is placed on the first mask stage 100, and the first mask stage 100 can be removed from the first mask stage 100. The mask stage 100 rotates along the xy plane while moving along the xy plane. When the first mask stage 100 moves along the xy plane, the second mask stage 200 is along with the first mask stage 100 on the xy plane. Moving the same amount in the same direction, when the first mask stage 100 is rotated along the xy plane, the second mask stage 200 is rotated by the same amount in the same direction on the xy plane as the first mask stage 100.

Since the double-sided lithography apparatus 10 according to the embodiment has such a configuration, the first mask M1 disposed on the first surface Wa side of the workpiece W and the second mask M2 disposed on the second surface Wb side are completed. After the alignment, when the first mask M1 and the second mask M2 are aligned with the workpiece W, the first mask M1 and the second mask M2 can be positioned without moving and rotating the workpiece W. When the relationship remains unchanged, the alignment of the first mask M1 and the second mask M2 with the workpiece W is performed. In this way, it is not necessary to fit the structure for moving and rotating on the plane of the workpiece W into the conveying structure of the workpiece, so that the conveying structure of the workpiece is not complicated, and since The workpiece W is wrinkled or twisted, so that high-quality double-sided lithography can be realized.

Next, a method of aligning the mask and the workpiece in the double lithography apparatus 10 according to the embodiment will be described.

Fig. 6 is a flow explanatory diagram of each step when the mask is aligned with the workpiece. First, while the first mask M1 is attached to the first mask mounting plate 120, the second mask M2 is attached to the second mask mounting plate 220 (step S1).

And, on the first mask stage 100, the first mask M1 and the second mask M2 are aligned by performing at least one of moving along the xy plane and rotating along the xy plane of the second mask stage 200. The mask alignment step (step S2). In the method of aligning the mask and the workpiece in the double lithography apparatus 10 according to the embodiment, the workpiece W is not disposed in the first mask M1 and the second mask M2 in the mask alignment step. between. However, even in a state where the workpiece W is disposed between the first mask M1 and the second mask M2, the mask alignment step can be performed.

The control at the time of performing the mask alignment step is performed by the alignment control device 500 based on the image data from the cameras C1 and C2. At this time, the cameras C1 and C2 image at positions where the mask alignment marks P1 and P2 can be imaged. Further, since the alignment control by the alignment control device 500 is as described above, the description thereof is omitted here. By performing the mask alignment step, the first mask M1 is aligned with the second mask M2.

Next, the mask and workpiece alignment step of the first mask M1 and the workpiece W is performed by performing at least one of moving along the xy plane and rotating along the xy plane of the first mask stage 100 (step S3) ). When the mask and workpiece alignment step is performed, the workpiece W is placed in a state between the first mask M1 and the second mask M2. In addition, the cameras C1, C2 have moved to a position where the mask alignment marks P5, P6 can be imaged.

Further, the control in the step of aligning the mask with the workpiece is performed by the alignment control device 500 based on the image data from the cameras C1 and C2 as in the mask alignment step. Since the alignment control of the first mask M1 and the workpiece W by the alignment control device 500 is as described above, the description thereof is omitted here. By performing the mask and workpiece alignment step, the first mask M1 is aligned with the workpiece W.

By sequentially performing the above-described mask alignment step and the mask and workpiece alignment step, the first mask M1 and the second mask M2 are aligned while the first mask and the second mask are in positional relationship The first mask M1 and the workpiece W and the second mask M2 and the workpiece W are respectively aligned while remaining unchanged.

Moreover, by lighting the light sources 310, 320 at a prescribed time point, the circuit pattern formed on the first mask M1 is photolithographically applied at a suitable position on the first side Wa of the workpiece W; the second mask M2 The circuit pattern formed thereon is photolithographically placed at a suitable location on the second side Wb of the workpiece W. Further, during photolithography, the cameras C1, C2 are controlled by the camera movement control device 600 to be located away from the lithographic article region B1 (on the workpiece W, at a position away from B1, and implemented In the double lithography apparatus 10 according to the aspect, the mask alignment marks P1 and P2 can be imaged.

The double-sided lithography apparatus 10 according to the embodiment is exemplified by a case where double-sided lithography is performed in a process in which a long sheet-like workpiece W travels in one direction in a roll-to-roll manner. Therefore, each of the plurality of lithographic article regions set along the length direction of the workpiece W traveling in one direction is sequentially located with the first mask M1 and the second mask of the double lithography apparatus 10 M2 is in the opposite position.

At this time, after photolithography of a certain lithography article, whenever the next lithography article is located opposite to the first mask M1 and the second mask M2, whenever the first mask M1 and the second mask When the cover M2 is aligned and the first mask M1 is aligned with the workpiece W, in the flow shown in FIG. 6, once the step S3 is completed, the return step is performed as indicated by the broken line R1 in FIG. Processing of S2. By doing so, alignment of the first mask M1 with the second mask M2 and alignment of the first mask M1 with the workpiece W can be performed on each of the lithographic article regions.

In addition, as long as the positional relationship between the first mask M1 and the second mask M2 obtained by the alignment of the first mask M1 and the second mask M2 (step S2) is fixed, it is possible to In the case where the first mask M1 and the second mask M2 are aligned, in the flow shown in FIG. 6, steps are repeated for each of the lithographic object regions as indicated by a broken line R2 in FIG. S3. By doing so, alignment of the first mask M1 with the workpiece W can be performed on each of the lithographic article regions while the positional relationship of the first mask M1 and the second mask M2 remains unchanged.

In the double-sided lithography apparatus 10 according to the embodiment, in the method of aligning the mask with the workpiece, since the double-sided lithography apparatus 10 according to the embodiment is used as the double-sided lithography apparatus, it can be obtained and implemented. The double lithography apparatus 10 according to the aspect has the same effect.

Further, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit and scope of the invention. For example, the following modifications can be implemented.

(1) In the above embodiment, the cameras C1 and C2 for capturing the mask alignment mark and the workpiece alignment mark are described as being provided on the first mask M1 side, but may be The cameras C1 and C2 are disposed on the second mask M2 side. In addition, a camera may be disposed on both the first mask M1 side and the second mask M2 side to perform the first mask M1 and the second mask M2 based on the captured image data obtained from the cameras of the respective places. At the same time of alignment, the first mask M1 and the second mask M2 are aligned with the workpiece W.

(2) In the above embodiment, the alignment of the first mask M1 and the second mask M2, and the alignment of the first mask M1 and the workpiece W are performed with time difference using the same cameras C1 and C2. The imaging is described as an example, but the two mask alignment marks P1 and P2 (the mask alignment marks P3 and P4 on the second mask M2) may be respectively set corresponding to the first mask M1. Two cameras are simultaneously provided with two cameras corresponding to the two workpiece alignment marks P5 and P6 (the workpiece alignment marks P7 and P8 on the workpiece W) corresponding to the first mask M1, thereby The camera data obtained by the camera at the location performs alignment of the first mask M1 with the second mask M2, and alignment of the first mask M1 with the workpiece W. In this case, each camera is controlled to evade at the position away from the lithography object area during lithography.

(3) In the above embodiment, the workpiece alignment marks P5 and P6 for aligning the first mask M1 and the second mask M2 with the workpiece W are disposed on the first mask M1 on the mask side. Upper, but it may be provided on the second mask M2, or may be provided on both the first mask M1 and the second mask M2. Further, even when the workpiece alignment marks P5, P6 for aligning the first mask M1 and the second mask M2 with the workpiece W are disposed on the second mask M2, between the workpiece W and the workpiece W In alignment, alignment of the first mask M1 and the second mask M2 with the workpiece W is also performed by the movement of the first mask table 100.

(4) In the above embodiment, the mask alignment marks for aligning the first mask M1 with the second mask M2 are respectively provided at two places on the first mask M1 and the second mask M2. However, it is not limited to two places, and may be three or more. Similarly, the workpiece alignment marks for aligning the first mask M1 with the workpiece W are respectively provided at two places on the first mask M1 and the workpiece W, but are not limited to two places, and may be three or more. .

(5) In the above embodiment, the double-sided lithography apparatus having the following configuration is exemplified: the workpiece W placed in the horizontal direction is irradiated with light from the vertical direction to lithography the workpiece. However, the present invention is not limited thereto. For example, the double-sided lithography apparatus may be configured such that the workpiece W placed in the vertical direction is irradiated with light from the left and right directions to lithography the workpiece.

(6) The configuration of the double-sided lithography apparatus 10 shown in FIG. 1 and FIG. 2 is merely an example, and the configuration is not limited to the configuration shown in FIG. 1 and FIG. 2, and may be, for example, FIG. The composition shown.

Fig. 7 is an explanatory diagram of a modification of the double photographic lithography apparatus 10 according to the embodiment. In addition, Fig. 7 is a front view showing a modification (designed as double-sided lithography apparatus 10') of the double-sided lithography apparatus 10 according to the embodiment, and is a view corresponding to the second drawing. The same components in Fig. 7 as those in Fig. 1 are denoted by the same reference numerals. Further, in Fig. 7, when the workpiece W is attached to the double lithography apparatus 10', the lower surface side of the workpiece W is defined as the first surface Wa, and the upper side of the workpiece W is shown. It is designated as the second side Wb.

The double-sided lithography apparatus 10' basically has substantially the same configuration as the double-sided lithography apparatus 10 according to the embodiment, but as shown in FIG. 7, the positions of the first mask M1 and the second mask M2 are implemented. The double lithography apparatus 10 according to the aspect has the reverse configuration. As described above, in Fig. 7, the lower surface side of the workpiece W is defined as the first surface Wa, and the upper surface side of the workpiece W is defined as the second surface Wb, so the first mask M1 and The position of the second mask M2 is opposite to that of the double lithography apparatus 10 according to the embodiment, but the first mask M1 is still located on the first surface Wa side of the workpiece W, and the second mask M2 is still located on the workpiece W. The second side is on the Wb side.

With such a configuration, the space portion 201 of the second mask stage 200 obtained in the double-sided lithography apparatus 10' is compared to the second mask in the double-sided lithography apparatus 10 according to the embodiment. The space portion 201 of the stage 200 is sufficiently large, and the pillar 111 is vertically disposed at a predetermined position of the first mask table 100 so as to penetrate the space portion 201, and the first mask mounting plate is fixed to the front end portion of the pillar 111. 120. Further, the first mask mounting plate 120 is disposed on the first face Wa side of the workpiece W, and the first mask M1 is mounted on the first mask mounting plate 120.

On the other hand, a pillar 211 is vertically disposed at a corner portion of the second mask stage 200, and a second mask mounting plate 220 is fixed to a front end portion of the pillar 211. Further, the second mask mounting plate 220 is disposed on the second face Wb side of the workpiece W, and the second mask M2 is mounted on the second mask mounting plate 220.

As shown in Fig. 7, the double-sided lithography apparatus 10' is configured such that the first mask M1 is located on the first surface Wa side of the workpiece W, and the second mask M2 is located on the second surface Wb side of the workpiece W. As such, in the double-sided lithography apparatus 10', although the positions of the first mask M1 and the second mask M2 are opposite to those of the double-sided lithography apparatus 10 according to the embodiment, they are used for the first mask M1. The alignment with the second mask M2 and the alignment of the first mask M1 and the second mask M2 with the workpiece W can be performed in the same manner as the double-sided lithography apparatus 10 according to the embodiment. Thus, the same effects as those of the double-sided lithography apparatus 10 according to the embodiment can be obtained.

(7) In the above embodiment, as the order in which the mask and the workpiece are aligned, as shown in Fig. 6, the mask alignment in which the first mask M1 and the second mask M2 are aligned is performed first. Step (step S2), and then the mask and workpiece alignment step of the first mask M1 and the workpiece W are performed (step S3), but the order is not limited thereto, and the order of the steps may be replaced. That is, the step of aligning the first mask M1 with the workpiece W (the mask and the workpiece alignment step) may be performed before the first mask M1 and the second mask M2 are aligned. Cover alignment step).

Fig. 8 is a flow explanatory diagram in which the steps are sequentially replaced when the mask is aligned with the workpiece. As shown in FIG. 8, the step of mounting the second mask M2 onto the second mask mounting plate 220 while the first mask M1 is mounted on the first mask mounting plate 120 is performed as step S11, The mask-to-workpiece alignment step in which the first mask M1 is aligned with the workpiece W is performed as step S12, and then the mask alignment step of aligning the first mask M1 with the second mask M2 is performed as step S13. Even in such a sequence, the same effect as in the sixth drawing can be obtained. Further, the respective alignment control in the mask-to-workpiece alignment step (step S12) and the mask alignment step (step S13) as shown in Fig. 8 can basically be described as described in the above embodiment. Alignment control is also implemented.

Even when alignment is performed in the order shown in Fig. 8, in the case where double-sided lithography is performed in a process of moving the long sheet-like workpiece W in one direction in a roll-to-roll manner, each lithography The object area will be located at a position opposite to the first mask M1 and the second mask M2 in this case. In this case, in the flowchart shown in FIG. 8, when the step S13 is finished, the line R1 will be as shown in FIG. Returning to step S12 as shown, processing is performed. By doing so, alignment of the first mask M1 with the workpiece W and alignment of the first mask M1 with the second mask M2 can be performed on each of the lithographic article regions.

In addition, as long as the positional relationship between the first mask M1 and the workpiece W obtained by the alignment of the first mask M1 and the workpiece W (step S12) is fixed, it is possible to eliminate the need for the first mask M1 every time. In the case of alignment with the workpiece W, in the flow shown in Fig. 8, step S13 is repeated for each of the lithographic article regions as indicated by a broken line R2 in Fig. 8. By doing so, alignment of the first mask M1 and the second mask M2 can be performed on each of the lithographic article regions while the positional relationship between the first mask M1 and the workpiece W remains unchanged.

(8) In the above embodiment, the shapes of the mask alignment mark and the workpiece alignment mark are respectively exemplified as the dot shape, but the shape of the dot is not limited to the dot shape, and a polygon such as a triangle or a quadrangle may be implemented. Various deformations such as stars.

(9) In the above embodiment, the first mask M1 and the second mask are provided while the mask alignment marks for the alignment of the first mask M1 and the second mask M2 are provided. M2 is aligned with the workpiece W by the workpiece alignment mark, so that the alignment of the first mask M1 and the second mask M2 is performed, and the alignment of the first mask M1 and the second mask M2 with the workpiece W is performed. For example, a part of the alignment marks of each alignment mark can also be shared when the alignment between the masks is performed and when the mask is aligned with the workpiece.

Fig. 9 is an explanatory view showing a case where a part of the alignment marks of the respective alignment marks are shared when the masks are aligned with each other when the masks are aligned with the workpiece. Here, in the ninth diagram (a), for example, when the first mask M1, the second mask M2, and the workpiece W are arranged as shown in FIG. 4, the first mask M1, the second mask M2, and the workpiece are placed. A cross-sectional view of each of W is cut along the x-axis, and FIG. 9(b) is a plan view when the ninth figure (a) is viewed from the first mask M1 side.

Further, in Fig. 9, the first mask M1, the second mask M2, the workpiece W, the alignment marks, and the like are marked and exaggerated. Further, in the above embodiment, the mark for aligning the first mask M1 and the second mask M2 is defined as "mask alignment alignment mark"; it will be used for the first mask M1 and the The mark in which the two masks M2 are aligned with the workpiece W is defined as "workpiece alignment alignment mark", but in Fig. 9, these are collectively referred to as "alignment marks".

As shown in FIG. 9, the alignment mark P11 disposed on the first mask M1 is defined as a dot mark, for example, and the alignment mark P21 disposed on the second mask M2 is set to be included in the first mask. The frame shape of the alignment mark P11 on M1 (circular in FIG. 9) is marked, and the inner side of the alignment mark P31 provided on the workpiece W is hollow (hole). The alignment marks P11, P21, and P31 as described above are respectively provided at a plurality of positions (for example, two places) at predetermined positions on the first mask M1, the second mask M2, and the workpiece W.

Here, for example, when the first mask M1 and the second mask M2 are aligned, the alignment control is performed such that the alignment mark P11 disposed on the first mask M1 and the alignment disposed on the second mask M2 are aligned. The mark P21 is identical (the alignment mark P11 is located at the center of the alignment mark P21). Then, in a state in which the first mask M1 and the second mask M2 are aligned, when the alignment of the first mask M1 and the workpiece W is performed, alignment control is performed to make the pair disposed on the first mask M1. The alignment mark P11 coincides with the alignment mark P31 provided on the workpiece W (the alignment mark P11 is located at the center of the alignment mark P31). Fig. 9(b) shows a state in which the first mask M1 and the second mask M2 are aligned, and the first mask M1 is aligned with the workpiece W.

Further, the alignment control when the heat-provisioning mark shown in Fig. 9 is used can be performed by the alignment control device 500 shown in Fig. 5. That is, the second mask table 200 is controlled so as to be respectively disposed in the first mask, based on the image data obtained by imaging the respective cameras C1 and C2 with the alignment marks P11, P21, and P31 provided at two places respectively. While the alignment marks P11 and P21 on the second mask M2 coincide with each other, the first mask stage 100 is controlled so that the alignment marks P11 and P31 respectively disposed on the first mask M1 and the workpiece W coincide.

Even in the case where the alignment mark shown in FIG. 9 is employed, the first mask and the second mask, the first mask, and the second mask can be moved without moving or rotating the workpiece. The cover is aligned with the workpiece.

By using the alignment marks P11, P21, and P31 shown in Fig. 9, it is possible to share a part of the alignment marks in the alignment marks when the alignment is performed between the masks and when the masks are aligned with the workpieces. . For example, in the above embodiment, the mask alignment mark P1 of the first mask M1 corresponds to the alignment mark P11 in FIG. 9, and similarly, the mask alignment mark P3 of the second mask M2 is equivalent to The alignment mark P21 in Fig. 9. Further, in the above embodiment, the workpiece alignment mark P5 of the first mask M1 corresponds to the alignment mark P11 in FIG. 9, and similarly, the workpiece alignment mark P7 of the workpiece W corresponds to FIG. Alignment mark P31. As described above, the alignment mark P11 shown in Fig. 9 functions as a common alignment mark when the masks are aligned between the masks and when the masks are aligned with the workpieces.

In this case, the alignment marks P11, P21, and P31 are disposed on the first mask M1, the second mask M2, and the workpiece W, and the alignment masks P11, P21, and P31 can be used to the first mask M1. The position is aligned with the second mask M2, the second mask M2, and the second mask M2 and the workpiece W.

Even when the alignment mark shown in FIG. 9 is employed, there is an imaging device movement control device 600 (refer to FIG. 5) that can control the movement of the imaging device C (cameras C1, C2), and the imaging device movement control The apparatus 600 controls the movement of the imaging apparatus C (cameras C1, C2) at least during photolithography so that the imaging apparatus C (cameras C1, C2) is located away from the lithographic object area B on the workpiece W. In addition, even in the case where the alignment mark shown in FIG. 9 is employed, the mask alignment step of aligning the first mask M1 with the second mask M2 and the first mask M1 and the workpiece W are performed. The order of the workpiece alignment may be performed in the order shown in Fig. 6, or in the order shown in Fig. 8.

(10) In the above embodiment, the double-sided lithography is sequentially performed while the long sheet-like workpiece W is traveling in one direction, that is, the double-sided lithography apparatus of the roll-to-roll type is used. For example, the present invention is not limited to such a double-sided lithography apparatus, and may be a double-sided lithography apparatus that performs lithography on a sheet-like workpiece W one by one.

(11) In the above embodiment, when the imaging device (cameras C1, C2) is placed at a position away from the lithographic area, the imaging device (cameras C1, C2) is moved to be located in the mask. The position at which the alignment marks P1, P2 are imaged is exemplified, but as long as it is located away from the lithographic article B1, it is not necessarily required to be located at a position where the mask alignment marks P1, P2 can be imaged. For example, the imaging device can be moved to an arbitrary position outside the lithographic article area B1 as long as the imaging device is mounted on a robot arm or the like and can be freely moved.

(12) In the above embodiment, the first mask M1 is attached to the upper side of the first mask mounting plate 120 as shown in Figs. 1 and 2, and the second mask M2 is 1 and FIG. 2 are exemplified by the configuration of the lower side of the second mask mounting plate 220. However, the present invention is not limited thereto, and the first mask M1 may be mounted on the first mask. At the lower side of the plate 120, at the same time, the second mask M2 is mounted on the upper side of the second mask mounting plate 220. This case is also the same in the modification (double-sided lithography apparatus 10') of the double-sided lithography apparatus shown in Fig. 7. That is, in the double-sided lithography apparatus 10', the first mask M1 may be mounted on the upper side of the first mask mounting plate 120, and the second mask M2 may be mounted on the second mask mounting plate 220. The composition of the lower side.

10, 10'‧‧‧Double-sided lithography apparatus
100‧‧‧First masking station
101, 121, 201, 221‧‧‧ Space Department
111, 211‧‧ ‧ pillar
120‧‧‧First mask mounting plate
200‧‧‧Second masking station
220‧‧‧Second mask mounting plate
310‧‧‧First light source
320‧‧‧Second light source
330, 340‧‧‧ mirror
500‧‧‧Alignment control device
510‧‧‧First Masking Drive Control Department
520‧‧‧Second mask station drive control unit
530‧‧‧Control Department
C, C1, C2, C3, C4‧‧‧ camera (camera)
L1, L2‧‧‧ optical axis
M1‧‧‧ first mask
M2‧‧‧ second mask
P1, P2, P3, P4‧‧‧ mask alignment marks
P11, P21, P31‧‧ Alignment marks
P5, P6, P7, P8‧‧‧ workpiece alignment marks
Steps S1 to S3, S11 to S13‧‧
Sx11, Sx12, Sy13, Sx21, Sx22, Sy23‧‧‧ motor (servo motor)
W‧‧‧Workpiece
The first side of the Wa‧‧‧ workpiece
Wb‧‧‧ second side of the workpiece

Fig. 1 is a perspective view for explaining the double-sided lithography apparatus 10 according to the embodiment. Fig. 2 is a front view for explaining the double-sided lithography apparatus 10 according to the embodiment. Figure 3 is an explanatory view of the first mask stage 100 moving along the xy plane and rotating along the xy plane. 4 is an explanatory view of the alignment of the first mask M1 and the second mask M2 and the alignment of the first mask M1 and the workpiece W. FIG. 5 is an explanatory diagram of the alignment control device 500 and the imaging device movement control device 600 in the double-sided lithography apparatus 10 according to the embodiment. Fig. 6 is a flow explanatory diagram of each step when the mask is aligned with the workpiece. Fig. 7 is an explanatory diagram of a modification of the double photographic lithography apparatus 10 according to the embodiment. Fig. 8 is a flow explanatory diagram in which the steps are sequentially replaced when the mask is aligned with the workpiece. Fig. 9 is an explanatory view showing a case where a part of the alignment marks of the respective alignment marks are shared when the masks are aligned with each other when the masks are aligned with the workpiece.

10‧‧‧Double-sided lithography apparatus

100‧‧‧First masking station

101, 121, 201, 221‧‧‧ Space Department

111, 211‧‧ ‧ pillar

120‧‧‧First mask mounting plate

200‧‧‧Second masking station

220‧‧‧Second mask mounting plate

310‧‧‧First light source

320‧‧‧Second light source

330, 340‧‧‧ mirror

L1, L2‧‧‧ optical axis

M1‧‧‧ first mask

M2‧‧‧ second mask

W‧‧‧Workpiece

The first side of the Wa‧‧‧ workpiece

Claims (10)

A double-sided lithography apparatus, wherein a first surface of a workpiece as a lithography object is photolithographically patterned by a first mask, and a second surface opposite to the first surface is photolithographically patterned by a second mask Wherein when the surface parallel to the first surface and the second surface is defined as an xy plane including a vertically intersecting x-axis and a y-axis, the double-sided lithography apparatus comprises: a first mask stage, such that the surface a mask is rotatable along the xy plane while moving along the xy plane; and a second masking station is rotatable along the xy plane while the second mask is movable along the xy plane; wherein the a second mask stage mounted on the first mask stage and capable of rotating along the xy plane while moving along the xy plane except the first mask stage on the first mask stage, when the first When the mask table moves along the xy plane, the first mask table moves in the same direction on the xy plane by the same amount, and when the first mask table rotates along the xy plane, the first mask The hood is rotated by the same amount in the same direction on the xy plane. The double-sided lithography apparatus according to claim 1, further comprising: a first mask mounting plate disposed on the first surface side of the workpiece, and capable of freely mounting the first mask And removing; and a second mask mounting plate disposed on the second side of the workpiece and capable of freely mounting and detaching the second mask; wherein the first mask mounting plate is a support member vertically disposed on the first mask table is thereby fixed on the first mask table, and the second mask mounting plate is fixed by a support member vertically disposed on the second mask table On the second mask stand. The double-sided lithography apparatus according to claim 1 or 2, wherein the movable along the xy plane means that the y-axis can be moved along the y-axis while the movement along the xy-plane is movable along the xy-plane. It is rotatable about the z-axis perpendicular to the xy plane. The double-sided lithographic apparatus according to any one of claims 1 to 3, wherein the mask alignment marks for aligning the first mask and the second mask are respectively disposed on And the first mask and the second mask, and the workpiece alignment marks for the first mask and the second mask aligned with the workpiece are respectively disposed on the first mask and the first mask At least one of the two masks is on the mask and on the workpiece. The double-sided lithography apparatus according to claim 4, further comprising: an image pickup device capable of capturing the mask alignment mark and the workpiece alignment mark; and an alignment control device having The image data obtained by the camera device controls the second mask table to match the mask alignment marks respectively disposed at the first mask and the second mask, and simultaneously controls the first mask table And a function of aligning the workpiece alignment marks at the workpiece with the masks respectively disposed at at least one of the first mask and the second mask. The double-sided lithography apparatus according to claim 5, further comprising an image pickup device movement control device capable of controlling the image pickup device, wherein the image pickup device movement control device is provided to control the image pickup device at least during photolithography Moving to thereby position the camera device at a position away from the area of the lithographic article on the workpiece. The double-sided lithographic apparatus according to any one of claims 4 to 6, wherein the mask alignment mark is provided at m at a predetermined position spaced apart from each other on the first mask, m is an integer greater than or equal to 2, and is disposed at a position corresponding to the mask alignment mark at the m provided on the first mask at a predetermined position on the second mask at a distance from each other, the workpiece The alignment mark is provided at n at a predetermined position on the mask of at least one of the first mask and the second mask, n is an integer greater than or equal to 2, and mutual on the workpiece The spaced apart predetermined positions are provided with n corresponding to the workpiece alignment marks of n disposed on the mask. A method for aligning a mask and a workpiece in a double-sided lithography apparatus, wherein a first surface of a workpiece as a lithographic article is photolithographically patterned by a first mask, and a second surface opposite to the first surface is formed In the double-sided lithography apparatus for performing photolithography by the second mask, the first mask and the second mask and the workpiece are performed while the first mask and the second mask are aligned Alignment, the method of aligning the mask with the workpiece in the double-sided lithography apparatus, using the double-sided lithography apparatus according to any one of claims 1 to 7 as the double-sided lithography apparatus, And performing the step of aligning the first mask and the second mask with the workpiece while performing the alignment of the first mask and the second mask, comprising: a mask alignment step, by The second masking station performs at least one of movement along the xy plane and rotation along the xy plane to perform alignment of the first mask and the second mask; and a step of aligning the mask with the workpiece, Performing the first mask by performing at least one of movement and rotation of the first mask table along the xy plane Alignment with the workpiece. The method of aligning a mask with a workpiece in the double lithography apparatus of claim 8, wherein the masking and workpiece alignment step is performed after the mask alignment step. The method of aligning a mask with a workpiece in the double lithography apparatus of claim 8, wherein the mask alignment step is performed after the mask workpiece alignment step is performed.