TW201514629A - Light exposure device and light exposure method - Google Patents
Light exposure device and light exposure method Download PDFInfo
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- TW201514629A TW201514629A TW103111034A TW103111034A TW201514629A TW 201514629 A TW201514629 A TW 201514629A TW 103111034 A TW103111034 A TW 103111034A TW 103111034 A TW103111034 A TW 103111034A TW 201514629 A TW201514629 A TW 201514629A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70791—Large workpieces, e.g. glass substrates for flat panel displays or solar panels
Abstract
Description
本發明，係關於使用曝光裝置之基板的曝光技術。 The present invention relates to an exposure technique using a substrate of an exposure apparatus.
以往，於表面，為了在具有感光層之基板的曝光面形成導電圖案等，而藉由重疊配置基板與描繪有圖案的光掩膜且通過光掩膜對基板照射光的方式，廣泛地進行將圖案轉印於基板表面之感光層的曝光方法。對此，提出一種不使用光掩膜可直接在基板形成預定圖案之無掩膜曝光(直接曝光)方式(例如，下述之專利文獻1)。根據該無掩膜曝光方式，由於不需光掩膜，故，有利於成本，又，可進行高精度曝光。 Conventionally, in order to form a conductive pattern or the like on an exposed surface of a substrate having a photosensitive layer, a substrate is formed by superimposing a substrate and a photomask on which a pattern is drawn, and the substrate is irradiated with light through a photomask. An exposure method of patterning a photosensitive layer on a surface of a substrate. In response to this, a maskless exposure (direct exposure) method in which a predetermined pattern is directly formed on a substrate without using a photomask is proposed (for example, Patent Document 1 below). According to the maskless exposure method, since the photomask is not required, it is advantageous in terms of cost and high-precision exposure.
[專利文獻1]日本特開2006-250982號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2006-250982
然而，基板，係因相對於厚度方向之不均勻或製造誤差或溫度、濕度變化、甚至曝光工程之熱歷程等所致之伸縮、翹曲等，導致曝光面大多具有非平坦形狀，且在該情況下，存在有難以在曝光面全區域進行成像，且在使用成像光學系統的無掩膜曝光方式中無法進行高精度曝光的情形。為了解決該問題，雖亦可導入具備有自動對焦功能的光學系統，但，控制複雜，又，裝置為高成本。從像這樣的情事，要求一種能夠以簡單的構成進而在曝光面全區域穩定地進行成像的曝光技術。又，基板為可撓性帶狀的情況下，基板容易撓曲，為了消解撓曲，或者為了使基板不撓曲地進行搬送，而必須使預定張力作用於基板其長邊方向。然而，過度使張力作用於基板時，基板將朝向長邊方向延伸，因此，以該狀態進行曝光時，則無法對與原本之基板形狀不同的基板進行曝光且無法精度良好地在基板形成圖案。從像這樣的情事，要求一種曝光技術，其係相對於可撓性帶狀基板，可藉由對原本之基板形狀進行曝光，進而精度良好地形成圖案。 However, the substrate is stretched, warped, etc. due to unevenness in thickness direction or manufacturing error or temperature, humidity change, or even heat history of exposure engineering, etc., so that the exposed surface mostly has a non-flat shape, and In the case, there is a case where it is difficult to perform imaging in the entire area of the exposure surface, and high-precision exposure cannot be performed in the maskless exposure method using the imaging optical system. In order to solve this problem, an optical system having an autofocus function can be introduced, but the control is complicated and the device is expensive. From such a situation, an exposure technique capable of stably imaging in the entire area of the exposure surface with a simple configuration is required. Further, when the substrate is in the form of a flexible strip, the substrate is easily deflected, and in order to eliminate the deflection or to convey the substrate without bending, a predetermined tension must be applied to the longitudinal direction of the substrate. However, when the tension is excessively applied to the substrate, the substrate extends in the longitudinal direction. Therefore, when the exposure is performed in this state, the substrate having a different shape from the original substrate cannot be exposed, and the substrate cannot be accurately patterned. From such a case, an exposure technique is required in which a pattern can be accurately formed by exposing the original substrate shape to the flexible strip substrate.
本發明，係為了解決上述課題之至少一部份所進行研究者，例如，可作為以下的形態予以實現。 The present invention has been made in order to solve at least a part of the above problems, and can be realized, for example, as follows.
本發明之第1形態，係提供作為對可撓性帶狀之基板進行曝光的曝光裝置。該曝光裝置，係具備有： 第1挾持部及第2挾持部，具有由光透性的構件所形成且具有平坦面的透過部，並可藉由各個平坦面來挾持基板；第1移動部，使第1挾持部及第2挾持部之至少一方朝向第1挾持部與第2挾持部靠近的方向及遠離的方向移動；第1曝光部，具有對第1方向照射光而成像於前述第1挾持部之前述平坦面上的成像光學系統；第2曝光部，與第1曝光部間隔配置，且具有對與第1方向相反的第2方向照射光而成像於前述第2挾持部之前述平坦面上的成像光學系統；及第2移動部，藉由以第1移動部使第1挾持部及第2挾持部之至少一方移動，在配置於第1挾持部及第2挾持部之各個平坦面之間的基板被挾持於各個平坦面的挾持狀態下，以使第1挾持部及第2挾持部通過第1曝光部及第2曝光部之間的方式，使第1挾持部及第2挾持部與第1曝光部及第2曝光部僅朝向1個方向相對移動。曝光裝置，係於挾持狀態下，將第1挾持部及第2挾持部之各個平坦面與第1曝光部及第2曝光部的距離保持固定且朝向1個方向相對移動的同時，從各個第1曝光部及第2曝光部照射光，並經由第1挾持部及第2挾持部的透過部，同時對基板的兩面進行曝光。第2移動部，係於挾持狀態下，使第1挾持部及第2挾持部移動，且藉由移動進而使基板被送至基板的長邊方向。 According to a first aspect of the present invention, an exposure apparatus for exposing a flexible strip-shaped substrate is provided. The exposure device is provided with: The first holding portion and the second holding portion have a transmissive portion formed of a light-transmitting member and having a flat surface, and the substrate can be held by each flat surface; and the first moving portion makes the first holding portion and the first holding portion At least one of the gripping portions moves toward a direction in which the first gripping portion and the second gripping portion are closer to each other, and the first exposing portion has a light that is irradiated with light in the first direction and is formed on the flat surface of the first gripping portion. The imaging optical system; the second exposure unit is disposed at an interval from the first exposure portion, and has an imaging optical system that irradiates light in a second direction opposite to the first direction and forms an image on the flat surface of the second clamping portion; In the second moving portion, at least one of the first holding portion and the second holding portion is moved by the first moving portion, and the substrate disposed between the flat surfaces of the first holding portion and the second holding portion is held by The first holding portion and the second holding portion and the first exposure portion are configured such that the first holding portion and the second holding portion pass between the first exposure portion and the second exposure portion in a state in which the respective flat surfaces are held. And the second exposure unit relatively moves in one direction. In the holding device, the distance between each flat surface of the first holding portion and the second holding portion and the first exposure portion and the second exposure portion is fixed and relatively moved in one direction, and The exposure portion and the second exposure portion irradiate light, and simultaneously expose both surfaces of the substrate through the transmission portions of the first holding portion and the second holding portion. In the second moving portion, the first holding portion and the second holding portion are moved in the gripping state, and the substrate is sent to the longitudinal direction of the substrate by the movement.
根據該曝光裝置，即使可撓性帶狀之基板以稍微撓曲之狀態予以設置，可撓性帶狀之基板之兩面的曝光面亦可藉由被挾持於第1挾持部及第2挾持部的方式被 平坦化。而且，第1挾持部，係在第1移動部使第1挾持部及第2挾持部之至少一方移動之方向上的位置被固定時，於挾持狀態下，第1挾持部之平坦面與第1曝光部之第1方向的距離係被保持固定。因此，第1曝光部，係可在與基板之曝光面接觸之第1挾持部的平坦面上穩定地進行成像。又，在該情況下，由於可撓性帶狀之基板通常其厚度較薄，因此，於挾持狀態下，即使針對第2挾持部之平坦面與第2曝光部之第2方向的距離，亦被保持固定。因此，第2曝光部，係即使不朝向靠近第1曝光部的方向或遠離的方向移動，亦可在與基板之曝光面接觸之第2挾持部的平坦面上穩定地進行成像。因此，能夠以簡單的構成來穩定地成像於基板之兩面的曝光面全區域。關於該觀點，第2挾持部，係在第1移動部使第1挾持部及第2挾持部之至少一方移動之方向上的位置被固定時，第1挾持部與第2挾持部雙方會進行移動，而在所事先決定之固定位置上挾持基板時，第1挾持部與第2挾持部雙方會進行移動，且，因應其移動量，第1曝光部及第2曝光部移動的情況亦相同。且，藉由被挾持於第1挾持部及第2挾持部的方式，曝光面會被平坦化，因此，為了進行平坦化，亦可不必對基板之長邊方向施加所需以上的張力。因此，不會有過剩的張力作用於基板，且曝光面在朝向長邊方向延伸之狀態下被曝光的情形。因此，可精度良好地在基板上形成圖案。 According to the exposure apparatus, even if the flexible strip-shaped substrate is provided in a slightly deflected state, the exposure surfaces on both sides of the flexible strip-shaped substrate can be held by the first holding portion and the second holding portion. Way flattened. In the first holding portion, when the position in the direction in which at least one of the first holding portion and the second holding portion is moved in the first moving portion is fixed, the flat surface of the first holding portion and the first portion are held in the gripping state. The distance of the first direction of the exposure portion is kept constant. Therefore, the first exposure unit can stably perform imaging on the flat surface of the first grip portion that is in contact with the exposure surface of the substrate. Further, in this case, since the flexible strip-shaped substrate is usually thin, the distance between the flat surface of the second holding portion and the second direction of the second exposure portion is also maintained in the held state. It is kept fixed. Therefore, the second exposure unit can stably perform imaging on the flat surface of the second grip portion that is in contact with the exposure surface of the substrate, even if it is not moved in the direction toward or away from the first exposure portion. Therefore, it is possible to stably image the entire exposed surface of both surfaces of the substrate with a simple configuration. In this case, when the first moving portion fixes the position in the direction in which at least one of the first holding portion and the second holding portion is moved, the first holding portion and the second holding portion perform both of the first holding portions and the second holding portion. When the substrate is held at a predetermined fixed position, both the first holding portion and the second holding portion move, and the first exposure portion and the second exposure portion move in the same manner depending on the amount of movement. . Further, since the exposure surface is flattened by being held by the first holding portion and the second holding portion, it is not necessary to apply a required tension or more to the longitudinal direction of the substrate in order to planarize. Therefore, there is no case where excessive tension acts on the substrate, and the exposure surface is exposed in a state of being extended toward the longitudinal direction. Therefore, a pattern can be formed on the substrate with high precision.
作為本發明之第2形態，於第1形態中，第1 挾持部，係亦可在第1移動部使第1挾持部及第2挾持部之至少一方移動之方向上的位置被固定。第2挾持部，係亦可構成為藉由第1移動部而使位置能夠移動。根據該形態，只要構成為能夠僅移動第2挾持部即可，因此，構成變得簡單。基板被配置為位於第1挾持部與第2挾持部之間，而不與第1挾持部及第2挾持部接觸的情況下，亦只要以不會對基板之長邊方向產生所需以上之張力的狀態配置基板，則基板就能夠朝向第1移動部使第2挾持部移動的方向彎曲。因此，第2挾持部會將基板推壓至第1挾持部側，進而可輕易挾持基板。而且，由於第1挾持部係在使第2挾持部移動之方向上的位置被固定，因此，於挾持狀態下，第1挾持部之平坦面與第1曝光部之第1方向的距離係被保持固定。因此，第1曝光部，係能夠在第1挾持部之平坦面上穩定地進行成像。又，由於可撓性帶狀之基板通常其厚度較薄，因此，於挾持狀態下，即使針對第2挾持部之平坦面與第2曝光部之第2方向的距離，亦被保持固定。因此，第2曝光部，係即使不朝向靠近第1曝光部的方向或遠離的方向移動，亦可在第2挾持部的平坦面上穩定地進行成像。因此，能夠以簡單的構成來穩定地成像於基板之兩面的曝光面全區域。 According to the second aspect of the present invention, in the first aspect, the first aspect The gripping portion may be fixed at a position in which the first moving portion moves at least one of the first grip portion and the second grip portion. The second gripping portion may be configured to be movable by the first moving portion. According to this aspect, it is only necessary to move only the second gripping portion, and therefore, the configuration is simplified. When the substrate is disposed between the first holding portion and the second holding portion, and is not in contact with the first holding portion and the second holding portion, the substrate may not be required to be longer than the longitudinal direction of the substrate. When the substrate is placed in a state of tension, the substrate can be bent in a direction in which the second moving portion moves in the first moving portion. Therefore, the second holding portion pushes the substrate to the side of the first holding portion, and the substrate can be easily held. Further, since the first gripping portion is fixed in the direction in which the second gripping portion is moved, the distance between the flat surface of the first gripping portion and the first exposing portion in the first direction is in the gripping state. Keep it fixed. Therefore, the first exposure unit can stably perform imaging on the flat surface of the first holding portion. Further, since the flexible strip-shaped substrate is generally thin, the distance between the flat surface of the second holding portion and the second direction of the second exposure portion is kept constant in the held state. Therefore, the second exposure unit can stably perform imaging on the flat surface of the second holding portion without moving in the direction toward or away from the first exposure portion. Therefore, it is possible to stably image the entire exposed surface of both surfaces of the substrate with a simple configuration.
作為本發明之第3形態，於第1形態中，曝光裝置，係亦可具備：第3移動部，使第2曝光部直線地朝向靠近第1曝光部的方向及遠離的方向移動；第4移動部，使第1曝光部直線地朝向靠近第2曝光部的方向及遠 離的方向移動；及檢測部，檢測挾持狀態之基板的位置及形狀之至少一方。第2曝光部，係亦可藉由第3移動部被固定於可移動的第1支撐構件，並進行因應檢測部所致之檢測結果的曝光。第1曝光部，係亦可藉由第4移動部被固定於可移動的第2支撐構件，並進行因應檢測部所致之檢測結果的曝光。檢測部，係亦可被固定於與第2曝光部共通的第1支撐構件及與第1曝光部共通的第2支撐構件之至少一方。根據該形態，由於在挾持狀態下亦即以與曝光時相同的狀態，檢測基板之位置及形狀的至少一方，因此，能夠在正確的位置進行曝光。且，在為了成像於第1挾持部的平坦面，因應於第1挾持部的位置使第1曝光部移動，且為了成像於第2挾持部的平坦面，因應於第2挾持部的位置使第2曝光部移動時，檢測部亦僅以同一距離同時朝向與第1曝光部及第2曝光部之至少一方相同的方向移動。因此，檢測部，亦可在第1挾持部及第2挾持部的平坦面進行成像。亦即，即使未在檢測部設置自動對焦等其他裝置或其他機構，亦可因應挾持第1挾持部及第2挾持部之基板的位置，予以成像於經常與基板之曝光面接觸之第1挾持部及第2挾持部的平坦面，且裝置構成亦變得簡單。 According to a third aspect of the present invention, in the first aspect, the exposure apparatus may include: a third moving unit that linearly moves the second exposure unit in a direction toward and away from the first exposure unit; The moving portion causes the first exposure portion to linearly face the direction and the distance toward the second exposure portion The direction of departure is moved; and the detecting unit detects at least one of a position and a shape of the substrate in the held state. The second exposure unit may be fixed to the movable first support member by the third moving portion, and may be exposed to the detection result by the detection unit. The first exposure unit may be fixed to the movable second support member by the fourth moving unit, and may be exposed by the detection result by the detection unit. The detecting unit may be fixed to at least one of the first supporting member that is common to the second exposure unit and the second supporting member that is common to the first exposure unit. According to this aspect, at least one of the position and the shape of the substrate is detected in the gripping state, that is, in the same state as in the exposure, so that the exposure can be performed at the correct position. In order to form a flat surface of the first gripping portion, the first exposing portion is moved in accordance with the position of the first gripping portion, and the flat surface of the second gripping portion is formed in accordance with the position of the second gripping portion. When the second exposure unit is moved, the detection unit moves toward the same direction as at least one of the first exposure unit and the second exposure unit at the same distance. Therefore, the detecting unit can perform imaging on the flat surfaces of the first holding portion and the second holding portion. In other words, even if another device or other mechanism such as autofocus is not provided in the detecting unit, the position of the substrate holding the first holding portion and the second holding portion can be imaged and the first holding member that is in contact with the exposure surface of the substrate can be imaged. The flat surface of the second portion and the second holding portion is also simple.
本發明之第4形態，係提供作為對基板進行曝光的曝光裝置。該曝光裝置，係具備有：第1挾持部及第2挾持部，具有以光透性的構件所形成且具有平坦面的透過部，並可藉由各個平坦面來挾持基板；第1移動部， 使第2挾持部朝向靠近第1挾持部的方向及遠離的方向移動；第1曝光部，以位置被固定於第1挾持部的狀態予以配置，且具有對第1方向照射光而成像於第1挾持部之平坦面上的成像光學系統；第2曝光部，於第2挾持部之側，與第1曝光部間隔配置，且具有對與第1方向相反的第2方向照射光而成像於第2挾持部之平坦面上的成像光學系統；第2移動部，藉由以第1移動部使第2挾持部移動，在配置於第1挾持部及第2挾持部之各個平坦面之間的基板被挾持於各個平坦面的挾持狀態下，以使第1挾持部及第2挾持部通過第1曝光部及第2曝光部之間的方式，使第1挾持部及第2挾持部與第1曝光部及第2曝光部僅朝向1個方向相對移動；及第3移動部，使第2曝光部直線地朝向靠近第1曝光部的方向及遠離的方向移動。第1挾持部，係在第1移動部使第2挾持部移動之方向上的位置被固定。曝光裝置，係於挾持狀態下，將第1挾持部及第2挾持部之各個平坦面與第1曝光部及第2曝光部的距離保持固定且朝向1個方向相對移動之同時，從各個第1曝光部及第2曝光部照射光，經由第1挾持部及第2挾持部的透過部，同時對基板的兩面進行曝光。 According to a fourth aspect of the present invention, an exposure apparatus for exposing a substrate is provided. The exposure apparatus includes a first holding portion and a second holding portion, and has a transmissive portion formed of a light transmissive member and having a flat surface, and the substrate can be held by each flat surface; the first moving portion , The second holding portion is moved in a direction away from the first holding portion and away from the first holding portion. The first exposure portion is disposed in a state in which the position is fixed to the first holding portion, and is formed by irradiating light to the first direction. An imaging optical system on a flat surface of the holding portion; the second exposure portion is disposed at a distance from the first exposure portion on the side of the second holding portion, and has a second direction opposite to the first direction to emit light and is imaged The imaging optical system on the flat surface of the second holding portion; the second moving portion moves between the flat surfaces of the first holding portion and the second holding portion by moving the second holding portion by the first moving portion The substrate is held in a holding state of each flat surface, so that the first holding portion and the second holding portion pass between the first exposure portion and the second exposure portion, so that the first holding portion and the second holding portion are The first exposure unit and the second exposure unit relatively move in one direction, and the third movement unit linearly moves the second exposure unit in a direction toward and away from the first exposure unit. The first gripping portion is fixed at a position in the direction in which the second gripping portion moves in the first moving portion. In the holding device, the distance between each flat surface of the first holding portion and the second holding portion and the first exposure portion and the second exposure portion is fixed and relatively moved in one direction, and The exposure portion and the second exposure portion irradiate light, and both surfaces of the substrate are exposed through the transmission portions of the first holding portion and the second holding portion.
根據該曝光裝置，即使基板之曝光面具有非平坦形狀時，亦藉由基板被挾持於第1挾持部與第2挾持部的方式，使基板之曝光面被推壓至第1挾持部之平坦面與第2挾持部之平坦面且追隨該些平坦面，因此，該非平坦形狀會減少。又，由於第1挾持部係在第1移動部使第 2挾持部移動之方向上的位置被固定，因此，於挾持狀態下，接觸於第1挾持部之平坦面之基板的曝光面與第1曝光部的第1方向之距離係被保持固定。因此，可在與第1挾持部之平坦面接觸之基板的曝光面全區域上穩定地進行成像。且，於挾持狀態下，與第2挾持部之平坦面接觸之基板之曝光面之第2方向的位置，係依據基板的厚度而變化，基板之曝光面的非平坦形狀係如上述而減少。因此，只要藉由第3移動部使第2曝光部直線地移動與接觸於第2挾持部之平坦面之基板之曝光面的變化量(起因於不同基板厚度所致之變化量)相同的量，則即使不使用自動對焦功能，亦能夠不依存於基板厚度而使接觸於第2挾持部之平坦面之基板的曝光面與第2曝光部之第2方向的距離保持固定。其結果，可在與第2挾持部之平坦面接觸之基板的曝光面全區域上穩定地進行成像。因此，能夠以簡單的裝置構成來穩定地成像於基板的兩面。 According to the exposure apparatus, even when the exposure surface of the substrate has a non-flat shape, the exposure surface of the substrate is pressed to the flattening of the first holding portion by the substrate being held by the first holding portion and the second holding portion. Since the surface and the flat surface of the second holding portion follow the flat surfaces, the uneven shape is reduced. In addition, since the first holding unit is in the first moving unit, Since the position in the direction in which the grip portion moves is fixed, the distance between the exposure surface of the substrate contacting the flat surface of the first grip portion and the first direction of the first exposing portion is kept constant in the gripping state. Therefore, imaging can be stably performed over the entire area of the exposure surface of the substrate that is in contact with the flat surface of the first holding portion. Further, in the held state, the position of the exposure surface of the substrate in contact with the flat surface of the second holding portion changes in accordance with the thickness of the substrate, and the uneven shape of the exposure surface of the substrate is reduced as described above. Therefore, the amount of change in the exposure surface of the substrate that is in contact with the flat surface of the second holding portion (the amount of change due to the thickness of the different substrate) is linearly moved by the third moving portion by linearly moving the second exposure portion. Further, even if the autofocus function is not used, the distance between the exposure surface of the substrate that is in contact with the flat surface of the second holding portion and the second direction of the second exposure portion can be kept constant regardless of the thickness of the substrate. As a result, imaging can be stably performed over the entire area of the exposure surface of the substrate that is in contact with the flat surface of the second holding portion. Therefore, it can be stably imaged on both sides of the substrate with a simple device configuration.
作為本發明之第5形態，在第4形態中，亦可進一步具備檢測挾持狀態之基板的位置及形狀之至少一方的檢測部。第2曝光部，係亦可藉由第3移動部被固定於可移動的支撐構件，並進行因應檢測部所致之檢測結果的曝光。檢測部，係亦可被固定於與第2曝光部共通的支撐構件。根據該形態，由於在挾持狀態下亦即以與曝光時相同的狀態，檢測基板之位置及形狀的至少一方，因此，能夠在正確的位置進行曝光。且，為了成像於與基板之曝光面接觸之第2挾持部的平坦面，因應於基板的厚度使第 2曝光部移動時，檢測部亦僅以同一距離同時朝向與第2曝光部相同之方向移動。因此，檢測部，亦可在與基板之曝光面接觸之第2挾持部的平坦面進行成像。亦即，即使未在檢測部設置自動對焦等其他裝置或其他機構，亦可因應基板的厚度，予以成像於經常與基板之曝光面接觸之第2挾持部的平坦面，且裝置構成亦變得簡單。 According to a fifth aspect of the invention, the fourth aspect of the invention may further include a detecting unit that detects at least one of a position and a shape of the substrate in the gripping state. The second exposure unit may be fixed to the movable supporting member by the third moving unit, and may be exposed to the detection result by the detecting unit. The detecting unit may be fixed to a supporting member that is common to the second exposure unit. According to this aspect, at least one of the position and the shape of the substrate is detected in the gripping state, that is, in the same state as in the exposure, so that the exposure can be performed at the correct position. Moreover, in order to form a flat surface of the second holding portion that is in contact with the exposure surface of the substrate, the thickness of the substrate is made When the exposure unit moves, the detection unit also moves toward the same direction as the second exposure unit at the same distance. Therefore, the detecting unit can perform imaging on the flat surface of the second holding portion that is in contact with the exposure surface of the substrate. In other words, even if another device or other mechanism such as autofocus is not provided in the detecting unit, the flat surface of the second holding portion that is often in contact with the exposure surface of the substrate can be imaged in accordance with the thickness of the substrate, and the device configuration becomes simple.
作為本發明之第6形態，第4或第5形態的曝光裝置，係亦可進一步具備：密封部，藉由彈性構件形成於第1挾持部及第2挾持部之一方的密封部，在抵接於第1挾持部及第2挾持部的另一方時，包圍配置於各個平坦面之間之基板的周圍，且密封基板周圍；及減壓部，以密封部抵接於另一方之平坦面的狀態，對密封部之內側的空間進行減壓。根據該形態，藉由對密封部之內側的空間進行減壓，密封部會被壓扁，且第2挾持部會被移動至第1挾持部側，進而使第1挾持部及第2挾持部能夠以更強大的力挾持基板。其結果，即使為非平坦之基板亦即相對於厚度方向不均勻的基板或翹曲較大的基板，亦可確實地使該基板追隨第1挾持部及第2挾持部的平坦面，因此，可進行高精度之曝光。 According to a sixth aspect of the present invention, in the exposure apparatus of the fourth aspect or the fifth aspect, the sealing portion may further include a sealing portion formed in the sealing portion of the first holding portion and the second holding portion by the elastic member. When it is connected to the other of the first holding portion and the second holding portion, it surrounds the periphery of the substrate disposed between the flat surfaces, and seals the periphery of the substrate; and the pressure reducing portion abuts against the other flat surface with the sealing portion In the state, the space inside the sealing portion is decompressed. According to this aspect, when the space inside the sealing portion is depressurized, the sealing portion is crushed, and the second grip portion is moved to the first grip portion side, and the first grip portion and the second grip portion are further moved. The substrate can be held with greater force. As a result, even if it is a non-flat substrate, that is, a substrate having a non-uniform thickness in the thickness direction or a substrate having a large warpage, the substrate can surely follow the flat surface of the first holding portion and the second holding portion. High precision exposure is possible.
作為本發明之第7形態，在第1~第6之任一形態中，第1挾持部及第2挾持部的平坦面，係亦可對向予以設置。第1移動部，係亦可使第1挾持部及第2挾持部之至少一方朝向與平坦面正交之方向移動。根據該形態，由於僅使第1挾持部及第2挾持部之至少一方只朝向 1個方向移動就能夠挾持基板，因此，裝置構成變得簡單。 According to a seventh aspect of the present invention, in any one of the first to sixth aspects, the flat surfaces of the first holding portion and the second holding portion may be provided to face each other. In the first moving portion, at least one of the first holding portion and the second holding portion may be moved in a direction orthogonal to the flat surface. According to this aspect, only at least one of the first gripping portion and the second gripping portion is oriented only Since the substrate can be held by moving in one direction, the device configuration is simplified.
本發明，係亦可實現來作為藉由曝光裝置對可撓性帶狀基板進行曝光的曝光方法、藉由曝光裝置對基板進行曝光的曝光方法等。 The present invention can also be realized as an exposure method for exposing a flexible strip substrate by an exposure device, an exposure method for exposing a substrate by an exposure device, and the like.
10、210、310‧‧‧曝光裝置 10, 210, 310‧‧‧ exposure device
15‧‧‧基底構件 15‧‧‧Base member
16、17‧‧‧支撐構件 16, 17‧‧‧Support members
18‧‧‧支撐板 18‧‧‧Support board
20‧‧‧挾持部 20‧‧‧ Department of Maintenance
20a‧‧‧第1挾持部 20a‧‧‧1st Maintenance Department
20b‧‧‧第2挾持部 20b‧‧‧2nd Maintenance Department
21a‧‧‧透過部(下側玻璃板) 21a‧‧‧Transmission Department (lower glass plate)
21b‧‧‧透過部(上側玻璃板) 21b‧‧‧Transmission Department (upper glass panel)
22a、22b‧‧‧支撐部 22a, 22b‧‧‧Support
23a、23b‧‧‧平坦面 23a, 23b‧‧‧ flat surface
30‧‧‧第1曝光部 30‧‧‧1st exposure department
31、32‧‧‧曝光單元 31, 32‧‧‧ exposure unit
40‧‧‧第2曝光部 40‧‧‧2nd exposure department
41、42‧‧‧曝光單元 41, 42‧‧‧ exposure unit
50‧‧‧第1移動部 50‧‧‧1st mobile department
51‧‧‧導引軸 51‧‧‧Guide axis
60‧‧‧第2移動部 60‧‧‧2nd Moving Department
61‧‧‧線性馬達 61‧‧‧Linear motor
62‧‧‧導引件 62‧‧‧Guide
63‧‧‧導引軌 63‧‧‧ Guide rail
70‧‧‧第3移動部 70‧‧‧3rd Ministry of Movement
71‧‧‧導引件 71‧‧‧ Guides
72‧‧‧導引軌 72‧‧‧ Guide track
81~84‧‧‧檢測部 81~84‧‧‧Detection Department
281‧‧‧密封部 281‧‧‧ Sealing Department
285‧‧‧貫通孔 285‧‧‧through holes
290‧‧‧減壓部 290‧‧‧Decompression Department
381‧‧‧運送裝置 381‧‧‧Transportation device
382、383、385、386‧‧‧滾筒 382, 383, 385, 386‧‧‧ Roller
384‧‧‧捲取裝置 384‧‧‧Winding device
387‧‧‧捲取裝置 387‧‧‧Winding device
S‧‧‧基板 S‧‧‧Substrate
[圖1]表示作為本發明之一實施例之曝光裝置之概略構成的說明圖。 Fig. 1 is an explanatory view showing a schematic configuration of an exposure apparatus according to an embodiment of the present invention.
[圖2]圖1所示之曝光裝置之A-A箭頭視圖。 FIG. 2 is an A-A arrow view of the exposure apparatus shown in FIG. 1. FIG.
[圖3]圖2所示之曝光裝置之B-B箭頭視圖。 Fig. 3 is a B-B arrow view of the exposure apparatus shown in Fig. 2.
[圖4]表示曝光裝置之動作之流程的流程圖。 Fig. 4 is a flow chart showing the flow of the operation of the exposure apparatus.
[圖5]表示圖4所示之流程圖之各工程中之曝光裝置之狀態的說明圖。 Fig. 5 is an explanatory view showing a state of an exposure apparatus in each of the processes of the flowchart shown in Fig. 4;
[圖6]表示作為第2實施例之曝光裝置之概略構成的說明圖。 Fig. 6 is an explanatory view showing a schematic configuration of an exposure apparatus as a second embodiment.
[圖7]表示作為第3實施例之曝光裝置之概略構成的說明圖。 Fig. 7 is an explanatory view showing a schematic configuration of an exposure apparatus as a third embodiment.
[圖8]圖7所示之曝光裝置之C-C箭頭視圖。 Fig. 8 is a C-C arrow view of the exposure apparatus shown in Fig. 7.
圖1~圖3，係表示作為本發明之一實施例之曝光裝置10的概略構成。圖2係圖1所示之曝光裝置10之A-A箭頭視圖，圖3係圖2所示之曝光裝置10之B-B箭頭視圖。曝光裝置10，係基於表示電路等之二維圖案的曝光資料，對於在表面具有感光層之基板的曝光面進行曝光，藉此，在基板上形成該圖案。曝光裝置10，係不使用光掩膜而形成圖案於基板的兩面。如圖1所示，曝光裝置10，係被設置於基底構件15上，且具備有第1挾持部20a、第2挾持部20b、第1曝光部30、第2曝光部40、第1移動部50、第2移動部60、第3移動部70及檢測部81~84。在下述之說明，亦將第1挾持部20a及第2挾持部20b稱為挾持部20。 1 to 3 show a schematic configuration of an exposure apparatus 10 as an embodiment of the present invention. 2 is an A-A arrow view of the exposure apparatus 10 shown in FIG. 1, and FIG. 3 is a B-B arrow view of the exposure apparatus 10 shown in FIG. 2. The exposure device 10 exposes an exposure surface of a substrate having a photosensitive layer on its surface based on exposure data indicating a two-dimensional pattern of a circuit or the like, thereby forming the pattern on the substrate. The exposure device 10 is formed on both sides of the substrate without using a photomask. As shown in FIG. 1 , the exposure device 10 is provided on the base member 15 and includes a first holding portion 20 a , a second holding portion 20 b , a first exposure unit 30 , a second exposure unit 40 , and a first moving unit. 50. The second moving unit 60, the third moving unit 70, and the detecting units 81 to 84. In the following description, the first holding portion 20a and the second holding portion 20b are also referred to as the holding portion 20.
第1挾持部20a，係具備有透過部21a與支撐部22a。透過部21a，係由光透性的構件所形成。在本實施例中，透過部21a，係由玻璃所形成。但是，亦可使用丙烯酸等取代玻璃。又，在本實施例中，透過部21a係具有矩形平板形狀，其上面係形成為平坦的平坦面23a。亦將透過部21a稱為下側玻璃板21a。 The first grip portion 20a includes a transmissive portion 21a and a support portion 22a. The transmissive portion 21a is formed of a light transmissive member. In the present embodiment, the transmitting portion 21a is formed of glass. However, it is also possible to use acrylic or the like instead of glass. Further, in the present embodiment, the transmissive portion 21a has a rectangular flat plate shape, and the upper surface thereof is formed into a flat flat surface 23a. The transmission portion 21a is also referred to as a lower glass plate 21a.
支撐部22a，係包圍透過部21a的周圍，並支撐透過部21a。具體而言，支撐部22a係具有在矩形之平板的中央形成貫通孔的框狀形狀。支撐部22a之貫通孔，係具有組合第1貫通孔與第2貫通孔之形狀，該第1貫通孔係具有相對於小的矩形形狀，該第2貫通孔係具有相對大的矩形形狀。第1貫通孔係被形成於下側，第2貫通孔 係被形成於上側。且，在第2貫通孔嵌入有透過部21a。透過部21a的外緣部，係利用上述2個貫通孔的不同大小，連接於支撐部22a。 The support portion 22a surrounds the periphery of the transmissive portion 21a and supports the transmissive portion 21a. Specifically, the support portion 22a has a frame shape in which a through hole is formed in the center of a rectangular flat plate. The through hole of the support portion 22a has a shape in which the first through hole and the second through hole are combined, and the first through hole has a relatively small rectangular shape, and the second through hole has a relatively large rectangular shape. The first through hole is formed on the lower side, and the second through hole is formed It is formed on the upper side. Further, the transmissive portion 21a is fitted in the second through hole. The outer edge portion of the transmission portion 21a is connected to the support portion 22a by the different sizes of the two through holes.
第2挾持部20b，係具備有透過部21b與支撐部22b。透過部21b及支撐部22b，係具有與透過部21a及支撐部22a相同的構成。但是，透過部21b及支撐部22b，係相較於透過部21a及支撐部22a，上下是相反配置。透過部21b之下面，係形成為平坦的平坦面23b。亦將透過部21b稱為上側玻璃板21b。 The second grip portion 20b includes a transmissive portion 21b and a support portion 22b. The transmission portion 21b and the support portion 22b have the same configuration as the transmission portion 21a and the support portion 22a. However, the transmission portion 21b and the support portion 22b are arranged opposite to each other in comparison with the transmission portion 21a and the support portion 22a. The lower surface of the transmissive portion 21b is formed into a flat flat surface 23b. The transmission portion 21b is also referred to as an upper glass plate 21b.
在本實施例中，第1挾持部20a與第2挾持部20b，係在垂直方向對向配置。藉此，平坦面23a與平坦面23b亦對向。第1挾持部20a，係垂直方向的位置被固定。另一方面，第2挾持部20b，係藉由第1移動部50構成為可朝向垂直方向，換言之，朝向第1挾持部20a及第2挾持部20b靠近的方向及遠離的方向移動。以將基板S載置於下側玻璃板21a之平坦面23a的狀態，使第2挾持部20b朝向下方移動，藉此，基板S，係被挾持於平坦面23a與平坦面23b之間。如此一來，亦將基板S被挾持的狀態稱為挾持狀態。另外，平坦面23a與平坦面23b，係不一定要對向配置，亦可為下述構成：第1挾持部20及第2挾持部20b之至少一方係構成為可朝向水平方向及垂直方向移動，且藉由朝向該兩方向的移動，使基板S被挾持。 In the present embodiment, the first grip portion 20a and the second grip portion 20b are arranged to face each other in the vertical direction. Thereby, the flat surface 23a and the flat surface 23b are also opposed. The position of the first grip portion 20a in the vertical direction is fixed. On the other hand, the second holding portion 20b is configured such that the first moving portion 50 is configured to be movable in the vertical direction, in other words, in the direction in which the first holding portion 20a and the second holding portion 20b approach and in the direction away from each other. In a state where the substrate S is placed on the flat surface 23a of the lower glass plate 21a, the second holding portion 20b is moved downward, whereby the substrate S is held between the flat surface 23a and the flat surface 23b. In this way, the state in which the substrate S is held is also referred to as the holding state. Further, the flat surface 23a and the flat surface 23b are not necessarily arranged to face each other, and at least one of the first holding portion 20 and the second holding portion 20b may be configured to be movable in the horizontal direction and the vertical direction. And the substrate S is held by the movement in both directions.
第1移動部50，係具備有導引軸51。導引軸 51，係在第1挾持部20a及第2挾持部20b的4個角落，以使第1挾持部20a及第2挾持部20b沿垂直方向貫穿的方式予以配置。第1移動部50，係藉由致動器(省略圖示)，使第2挾持部20b沿著導引軸51在垂直方向上往返移動。 The first moving unit 50 is provided with a guide shaft 51. Guide axis 51 is disposed at four corners of the first holding portion 20a and the second holding portion 20b so as to penetrate the first holding portion 20a and the second holding portion 20b in the vertical direction. In the first moving unit 50, the second holding unit 20b is reciprocated in the vertical direction along the guide shaft 51 by an actuator (not shown).
第2移動部60，係具備有線性馬達61、2個導引件62及2個導引軌63。2個導引軌63係平行配置，且在與垂直方向正交的預定方向直線狀地延伸而形成。2個導引件62之一方，係被固定於線性馬達61的可動件。又，在2個導引件62，係固定有第1挾持部20a之支撐部22a。驅動線性馬達61時，則第1挾持部20a與經由導引軸51而連接於第1挾持部20a的第2挾持部20b係經由2個導引件62在導引軌63上進行移動。藉由該構成，第2移動部60，係以通過後述之第1曝光部30與第2曝光部40之間的方式，使挾持狀態的挾持部20(被挾持於挾持部20的基板S)進行移動。 The second moving unit 60 includes a linear motor 61, two guides 62, and two guide rails 63. The two guide rails 63 are arranged in parallel and linearly arranged in a predetermined direction orthogonal to the vertical direction. Extended to form. One of the two guide members 62 is fixed to the movable member of the linear motor 61. Moreover, the support portion 22a of the first grip portion 20a is fixed to the two guides 62. When the linear motor 61 is driven, the first gripping portion 20a and the second gripping portion 20b connected to the first gripping portion 20a via the guide shaft 51 are moved on the guide rail 63 via the two guides 62. With this configuration, the second moving unit 60 is configured to hold the holding unit 20 in the gripping state (the substrate S held by the holding unit 20) so as to pass between the first exposure unit 30 and the second exposure unit 40, which will be described later. Move.
第1曝光部30，係對第1方向照射光。第1曝光部30，係被配置於第1挾持部20a及第2挾持部20b中的第1挾持部20a側亦即下方側。第1方向，在本實施例中，係從下方側朝向上方的方向。在本實施例中，第1曝光部30，係如圖2所示，具備有2個曝光單元31、32。曝光單元31、32，係各別具備有光源(在此，係雷射光源)與對光束進行偏向掃描的多面鏡。曝光單元31、32，係被排列於第2移動部60使基板S移動的方 向。該曝光單元31、32，係被固定於設置在基底構件15上的支撐構件16上。 The first exposure unit 30 illuminates the light in the first direction. The first exposure unit 30 is disposed on the lower side of the first grip portion 20a side of the first grip portion 20a and the second grip portion 20b. In the first embodiment, the first direction is a direction from the lower side toward the upper side. In the present embodiment, the first exposure unit 30 is provided with two exposure units 31 and 32 as shown in FIG. 2 . The exposure units 31 and 32 are each provided with a light source (here, a laser light source) and a polygon mirror that scans the light beam. The exposure units 31 and 32 are arranged in the second moving unit 60 to move the substrate S. to. The exposure units 31, 32 are fixed to the support member 16 provided on the base member 15.
第2曝光部40，係與第1曝光部30間隔配置於比第1曝光部30更上方(第2挾持部20b側)處，且對與第1方向相反的第2方向亦即從上方朝向下方的方向照射光。第2曝光部40，係具備有2個曝光單元41、42。在本實施例中，曝光單元41、42，係具有與曝光單元31、32相同的構成，且在垂直方向上被設置於與曝光單元31、32對向的位置。曝光單元41、42，係被固定於設置在其上方的支撐構件17。 The second exposure unit 40 is disposed above the first exposure unit 30 (on the second holding unit 20b side) at intervals from the first exposure unit 30, and is oriented in the second direction opposite to the first direction. The light is illuminated in the direction below. The second exposure unit 40 includes two exposure units 41 and 42. In the present embodiment, the exposure units 41, 42 have the same configuration as the exposure units 31, 32, and are disposed at positions facing the exposure units 31, 32 in the vertical direction. The exposure units 41, 42 are fixed to the support member 17 provided above them.
第1曝光部30及第2曝光部40的構成，係只要隔著基板S移動的區域且間隔設置於垂直方向，則不限於上述例子，可構成為任意構成。例如，雷射光源，係亦可被設置於曝光單元31、32的外部，且經由光纖對曝光單元31、32供給光。或者，亦可採用DMD(Digital Mirror Device)取代多面鏡。或者，第1曝光部30及第2曝光部40，係亦可分別僅以單一單元來予以構成。或者，亦可在與第2移動部60使基板S移動之方向正交的方向，排列2以上的單元。或是，第1曝光部30及第2曝光部40，係亦可具有不同的構成。 The configuration of the first exposure unit 30 and the second exposure unit 40 is not limited to the above example, and may be configured in any manner as long as the area in which the substrate S moves is spaced apart from each other in the vertical direction. For example, a laser light source may be provided outside the exposure units 31, 32, and the exposure units 31, 32 are supplied with light via an optical fiber. Alternatively, a DMD (Digital Mirror Device) may be used instead of the polygon mirror. Alternatively, the first exposure unit 30 and the second exposure unit 40 may be configured by only a single unit. Alternatively, two or more units may be arranged in a direction orthogonal to the direction in which the second moving unit 60 moves the substrate S. Alternatively, the first exposure unit 30 and the second exposure unit 40 may have different configurations.
該第1曝光部30及第2曝光部40的動作，係藉由處理曝光資料的畫像處理單元(省略圖示)來控制。該畫像處理單元，係因應後述檢測部81~84的檢測結果，加以控制來自第1曝光部30及第2曝光部40之光的 照射。 The operations of the first exposure unit 30 and the second exposure unit 40 are controlled by an image processing unit (not shown) that processes exposure data. The image processing unit controls the light from the first exposure unit 30 and the second exposure unit 40 in response to the detection results of the detection units 81 to 84 to be described later. Irradiation.
第3移動部70，係具備有導引件71與導引軸72。導引軌72，係在垂直方向直線狀地延伸而形成。導引件71，係經由支撐板18被固定於支撐構件17。又，支撐構件17，係被連結於致動器(省略圖示)，且藉由驅動致動器，沿著導引軌72而在導引軌72上滑動。藉由該支撐構件17的移動，而被固定於支撐構件17的曝光單元41、42將直線地朝向垂直方向，換言之，朝向靠近第1曝光部30的方向及遠離的方向移動。致動器並不特定限定，例如可使用馬達及滾珠螺桿。 The third moving unit 70 is provided with a guide 71 and a guide shaft 72. The guide rail 72 is formed to extend linearly in the vertical direction. The guide 71 is fixed to the support member 17 via the support plate 18. Further, the support member 17 is coupled to an actuator (not shown), and is slid along the guide rail 72 along the guide rail 72 by driving the actuator. The exposure units 41 and 42 fixed to the support member 17 by the movement of the support member 17 linearly move in the vertical direction, in other words, in the direction toward and away from the first exposure unit 30. The actuator is not particularly limited, and for example, a motor and a ball screw can be used.
檢測部81~84，係各別具有攝像機。該些攝像機，係於挾持狀態下，藉由光學性讀取預先附加於基板S上之預定位置的對位標記或圖案(以下，皆僅稱為標記)，基於所讀取之標記的座標位置，檢測挾持狀態之基板S的位置及形狀。檢測部81、82係檢測基板S之上面(第2曝光部40進行曝光之側)的位置及形狀，檢測部83、84係檢測基板S之下面(第1曝光部30進行曝光之側)的位置及形狀。另外，檢測部81~84，係亦可為僅檢測基板S之位置及形狀中之一方者。 The detecting units 81 to 84 each have a camera. The cameras are in a holding state, and optically read the alignment marks or patterns (hereinafter, simply referred to as marks) attached to predetermined positions on the substrate S, based on the coordinate positions of the read marks. The position and shape of the substrate S in the held state are detected. The detecting units 81 and 82 detect the position and shape of the upper surface of the substrate S (the side on which the second exposure unit 40 is exposed), and the detecting portions 83 and 84 detect the lower surface of the substrate S (the side on which the first exposure unit 30 performs exposure). Location and shape. Further, the detecting units 81 to 84 may detect only one of the position and shape of the substrate S.
該檢測部81~84，係被配置於比第1曝光部30及第2曝光部40更往基板S朝向第1曝光部30及第2曝光部40移動時的上流側。檢測部81、82，係被固定於支撐第2曝光部40的支撐構件17。亦即，檢測部81、82，係被固定於與第2曝光部40共通的支撐構件17。因 此，第3移動部70，係可藉由簡單的構成，使第2曝光部40與檢測部81、82僅以同一距離同時朝向同一方向移動。另外，檢測部的個數並不特別限定，亦可分別對基板S之各個面設置僅1個以上之任意的個數。又，檢測部，係亦可僅設置於基板S之一方的面側。 The detection units 81 to 84 are disposed on the upstream side when the substrate S is moved toward the first exposure unit 30 and the second exposure unit 40 than the first exposure unit 30 and the second exposure unit 40. The detecting portions 81 and 82 are fixed to the support member 17 that supports the second exposure unit 40. In other words, the detecting portions 81 and 82 are fixed to the support member 17 common to the second exposure unit 40. because In the third moving unit 70, the second exposure unit 40 and the detecting units 81 and 82 can be simultaneously moved in the same direction at the same distance by a simple configuration. Further, the number of the detecting portions is not particularly limited, and an arbitrary number of one or more of the respective surfaces of the substrate S may be provided. Further, the detecting portion may be provided only on the surface side of one of the substrates S.
說明該曝光裝置10的曝光動作。圖4，係表示基板S之曝光處理的流程。圖5，係表示圖4所示之各工程中之曝光裝置10的狀態。在基板的曝光處理中，首先，如圖5(a)所示，基板S被投入至第1挾持部20a與第2挾持部20b之間，且基板S被載置於下側玻璃板21a的平坦面23a(步驟S110)。該動作，係例如可藉由吸附保持基板S的夾持裝置(省略圖示)予以進行。 The exposure operation of the exposure device 10 will be described. 4 is a flow chart showing the exposure processing of the substrate S. Fig. 5 shows the state of the exposure device 10 in each of the works shown in Fig. 4. In the exposure processing of the substrate, first, as shown in FIG. 5(a), the substrate S is placed between the first holding portion 20a and the second holding portion 20b, and the substrate S is placed on the lower glass plate 21a. The flat surface 23a (step S110). This operation can be performed, for example, by a holding device (not shown) that adsorbs and holds the substrate S.
載置基板S時，接下來，曝光裝置10，係藉由第1移動部50使第2挾持部20b下降，並在上側玻璃板21b的平坦面23b與下側玻璃板21a的平坦面23a之間，挾持基板S(步驟S120)。此時，由於基板S會被上側玻璃板21b推壓至下側玻璃板21a側，因此，即使基板S之曝光面具有非平坦形狀，亦可減少該非平坦形狀。 When the substrate S is placed, the exposure device 10 lowers the second holding portion 20b by the first moving portion 50, and is on the flat surface 23b of the upper glass plate 21b and the flat surface 23a of the lower glass plate 21a. During the holding, the substrate S is held (step S120). At this time, since the substrate S is pressed against the lower glass plate 21a side by the upper glass plate 21b, even if the exposure surface of the substrate S has a non-flat shape, the uneven shape can be reduced.
挾持基板S時，接下來，曝光裝置10，係藉由第2移動部60使基板S朝向第1曝光部30及第2曝光部40側前進，並藉由檢測部81~84，讀取挾持狀態之基板S之兩面的標記(步驟S130)。在本實施例中，標記係被附加於基板S之兩面的四角隅附近。首先，如圖5(c)所示，讀取挾持狀態之基板S之一端側(第1曝光 部30及第2曝光部40側)的2個標記。且，使基板S更前進後，如圖5(d)所示，讀取挾持狀態之基板S之另一端側的2個標記。在本實施例中，由於以與曝光時相同的狀態亦即以挾持狀態進行標記的讀取，因此，可精度良好地進行曝光。 When the substrate S is held, the exposure device 10 advances the substrate S toward the first exposure unit 30 and the second exposure unit 40 by the second moving unit 60, and reads the holders by the detecting units 81 to 84. The mark on both sides of the substrate S in the state (step S130). In the present embodiment, the marks are attached to the vicinity of the square corners on both sides of the substrate S. First, as shown in FIG. 5(c), one end side of the substrate S in the held state is read (first exposure) Two marks on the side of the portion 30 and the second exposure portion 40). After the substrate S is further advanced, as shown in FIG. 5(d), two marks on the other end side of the substrate S in the held state are read. In the present embodiment, since the reading of the mark is performed in the same state as in the exposure, that is, in the held state, the exposure can be performed with high precision.
讀取標記時，接下來，曝光裝置10，係從檢測部81~84的讀取結果辨識基板S的位置及形狀，且因應其辨識結果，修正曝光資料(步驟S140)。接下來，曝光裝置10，係如圖5(e)所示，使基板S更前進的同時，從第1曝光部30及第2曝光部40對挾持狀態之基板S的兩面照射光，並同時對基板S的兩面進行曝光(步驟S150)。光的照射時間點，係因應檢測部81~84的讀取結果亦即基板S的位置、形狀、傾斜等來控制。由於基板S係被挾持於下側玻璃板21a及上側玻璃板21b，因此，從第1曝光部30及第2曝光部40所照射的光將透過下側玻璃板21a或上側玻璃板21b進而到達基板S。 When the mark is read, the exposure apparatus 10 recognizes the position and shape of the substrate S from the reading results of the detecting units 81 to 84, and corrects the exposure data in accordance with the recognition result (step S140). Next, as shown in FIG. 5(e), the exposure apparatus 10 irradiates the both sides of the substrate S in the held state from the first exposure unit 30 and the second exposure unit 40 while the substrate S is further advanced. Both sides of the substrate S are exposed (step S150). The irradiation time of the light is controlled in accordance with the reading result of the detecting portions 81 to 84, that is, the position, shape, inclination, and the like of the substrate S. Since the substrate S is held by the lower glass plate 21a and the upper glass plate 21b, the light irradiated from the first exposure unit 30 and the second exposure unit 40 passes through the lower glass plate 21a or the upper glass plate 21b. Substrate S.
如此一來，在進行曝光期間，第1挾持部20a及第2挾持部20b，係不改變垂直方向的位置而朝向水平方向移動，因此，平坦面23a(亦即，基板S之下面側的曝光面)與第1曝光部30之光的照射方向之距離(垂直方向的距離)及平坦面23b(亦即，基板S之上面側的曝光面)與第2曝光部40之光的照射方向之距離，皆被保持固定。特別是，由於第1挾持部20a其位置被固定，因此，不依存於基板S之厚度且平坦面23a與第1曝光部 30的距離會被一直保持固定。 In this manner, during the exposure period, the first holding portion 20a and the second holding portion 20b are moved in the horizontal direction without changing the position in the vertical direction. Therefore, the flat surface 23a (that is, the exposure on the lower surface side of the substrate S) The distance from the irradiation direction of the light of the first exposure unit 30 (the distance in the vertical direction) and the flat surface 23b (that is, the exposure surface on the upper surface side of the substrate S) and the irradiation direction of the light of the second exposure unit 40 The distance is kept fixed. In particular, since the position of the first holding portion 20a is fixed, it does not depend on the thickness of the substrate S, and the flat surface 23a and the first exposure portion are not affected. The distance of 30 will remain fixed.
圖5(f)，係表示基板S更向前進，且對於基板S之全部所需之曝光區域結束曝光的狀態。如此一來，曝光結束時，接下來，曝光裝置10，係藉由第2移動部60使挾持狀態之基板S後退至起始位置(參閱圖5(b))(步驟S160)。且，曝光裝置10，係藉由第1移動部50使第2挾持部20b上升進而解除挾持狀態，並排出已曝光結束的基板S(步驟S170)。在本實施例中，基板S的排出，係藉由上述夾持裝置來進行。藉由重複該步驟S110~S170的周期，使複數個基板S被連續曝光。 Fig. 5(f) shows a state in which the substrate S is further advanced, and the exposure is completed for all of the required exposure regions of the substrate S. In this way, when the exposure is completed, the exposure apparatus 10 next moves the substrate S in the held state to the home position by the second moving unit 60 (see FIG. 5(b)) (step S160). In the exposure apparatus 10, the second holding unit 20b is raised by the first moving unit 50 to release the gripping state, and the exposed substrate S is discharged (step S170). In the present embodiment, the discharge of the substrate S is performed by the above-described holding device. A plurality of substrates S are continuously exposed by repeating the periods of steps S110 to S170.
在本實施例中，該曝光裝置10，係具有：位置設定部，因應基板S的厚度，藉由第3移動部70，使第2曝光部40的位置事先移動至預定位置。具體而言，依基板S的厚度，處於挾持狀態之第2挾持部20b之平坦面23b(基板S的曝光面)之垂直方向的位置會改變，因此，位置設定部係因應可指定處於挾持狀態之第2挾持部20b(平坦面23b)之垂直方向之位置的資訊(以下，皆稱為位置資訊)，使第2曝光部40朝向垂直方向移動至成像於平坦面23b上的位置。該位置設定部，係包含於控制曝光裝置10之全體動作的控制裝置。在本實施例中，位置設定部，係接受使用者所輸入之位置資訊，使第2曝光部40移動至因應其輸入值的位置。位置資訊，係例如可設定成基板S的厚度(例如，基板S的設計尺寸)。根據該構成，即使處理對象之基板S的厚度不同時，亦可穩 定地成像於基板S之曝光面。 In the present embodiment, the exposure apparatus 10 includes a position setting unit that moves the position of the second exposure unit 40 to a predetermined position in advance by the third moving unit 70 in response to the thickness of the substrate S. Specifically, depending on the thickness of the substrate S, the position in the vertical direction of the flat surface 23b (the exposure surface of the substrate S) of the second holding portion 20b in the held state is changed. Therefore, the position setting unit can be designated to be in a holding state. The information of the position of the second grip portion 20b (flat surface 23b) in the vertical direction (hereinafter referred to as position information) causes the second exposure portion 40 to move in the vertical direction to a position formed on the flat surface 23b. The position setting unit is included in a control device that controls the overall operation of the exposure device 10. In the present embodiment, the position setting unit receives the position information input by the user and moves the second exposure unit 40 to a position corresponding to the input value. The position information can be set, for example, to the thickness of the substrate S (for example, the design size of the substrate S). According to this configuration, even if the thickness of the substrate S to be processed is different, it is stable. The image is imaged on the exposure surface of the substrate S.
因應於基板S之種類的厚度不同，通常最多是數mm左右。因此，第3移動部70之第2曝光部40的可動範圍，係亦可為數mm左右。但是，在本實施例中，第2曝光部40，係為了成像於平坦面23b上，進而確保比所需之可動範圍更寬廣的可動範圍(例如，數10cm)。以該構成，在進行第1曝光部30及第2曝光部40之維修時，能夠藉由使第2曝光部40移動至遠離第1曝光部30之方向的方式，輕易地進行維修作業。 Depending on the thickness of the type of the substrate S, it is usually at most several mm. Therefore, the movable range of the second exposure unit 40 of the third moving unit 70 may be about several mm. However, in the present embodiment, the second exposure unit 40 is formed on the flat surface 23b to ensure a wider movable range (for example, 10 cm) than the required movable range. With this configuration, when the first exposure unit 30 and the second exposure unit 40 are repaired, the maintenance operation can be easily performed by moving the second exposure unit 40 in a direction away from the first exposure unit 30.
且，曝光裝置10，係亦可具備：測定部，測定第2曝光部40與挾持狀態之基板S之曝光面(上面)的距離。在該情況下，位置設定部，係亦可將測定部之測定結果作為位置資訊而接收，且因應測定部的測定結果，改變第2曝光部40的位置。測定部，例如亦可為雷射測距儀。測定部，係亦可被固定於支撐構件17。在該情況下，由於測定部與第2曝光部40皆被固定於支撐構件17，因此，兩者之距離經常為固定。因此，能夠對由測定部所計算之測定部與曝光面的距離，將測定部與第2曝光部40的距離相加或相減，進而輕易地計算出第2曝光部40與基板S之曝光面(上面)的距離。只要設成為該些構成，則不需要上述之使用者的輸入，進而提高使用者的便利性。該測定部之測定，係亦可針對每片基板S進行，且亦可針對曝光裝置10所處理之每種基板S進行。 Further, the exposure device 10 may include a measuring unit that measures the distance between the second exposure unit 40 and the exposure surface (upper surface) of the substrate S in the held state. In this case, the position setting unit may receive the measurement result of the measurement unit as the position information, and change the position of the second exposure unit 40 in accordance with the measurement result of the measurement unit. The measuring unit may be, for example, a laser range finder. The measuring unit may be fixed to the support member 17. In this case, since both the measurement unit and the second exposure unit 40 are fixed to the support member 17, the distance between the two is often fixed. Therefore, the distance between the measurement unit and the exposure surface calculated by the measurement unit can be added or subtracted from the distance between the measurement unit and the second exposure unit 40, and the exposure of the second exposure unit 40 and the substrate S can be easily calculated. The distance from the face (top). As long as these configurations are provided, the input of the user described above is not required, and the convenience of the user is improved. The measurement of the measurement unit may be performed for each of the substrates S, and may be performed for each of the substrates S processed by the exposure apparatus 10.
根據上述之曝光裝置10，即使基板S為具有 非平坦形狀的情況下，亦藉由基板S被挾持於挾持部20的方式，使基板S被推壓至垂直於曝光面的方向，進而減少非平坦形狀。亦即，基板S的非平坦形狀，係以近似平坦形狀的方式予以修正。又，由於第1挾持部20a係在第1移動部50使第2挾持部20b移動之方向上的位置被固定，因此，於挾持狀態下，接觸於第1挾持部20a之平坦面23a之基板S的曝光面與第1曝光部30的垂直方向之距離係被保持固定。因此，可在與平坦面23a接觸之基板S的曝光面全區域上穩定地進行成像。且，於挾持狀態下，與第2挾持部20b之平坦面23b接觸之基板S之曝光面之垂直方向的位置，係依據基板S的厚度而變化，基板之曝光面的非平坦形狀係藉由被挾持之方式而減少。因此，只要藉由第3移動部70使第2曝光部40直線地僅移動與接觸於第2挾持部20b之平坦面23b之基板S之曝光面的位置依基板之厚度而變化的量相同的量，則即使不使用自動對焦功能，亦能夠使接觸於第2挾持部20b之平坦面23b之基板S的曝光面與第2曝光部40之垂直方向(光的照射方向)的距離，不會因基板S之厚度改變仍保持固定。其結果，可在與第2挾持部20b之平坦面23b接觸之基板S的曝光面全區域上穩定地進行成像。因此，能夠以簡單的裝置構成來穩定地成像於基板S的兩面。 According to the exposure apparatus 10 described above, even if the substrate S has In the case of a non-flat shape, the substrate S is pressed against the direction perpendicular to the exposure surface by the substrate S being held by the holding portion 20, thereby reducing the uneven shape. That is, the non-flat shape of the substrate S is corrected in such a manner as to be approximately flat. In addition, since the first holding portion 20a is fixed in the direction in which the first moving portion 50 moves the second holding portion 20b, the substrate that is in contact with the flat surface 23a of the first holding portion 20a is held in the held state. The distance between the exposure surface of S and the vertical direction of the first exposure portion 30 is kept constant. Therefore, imaging can be stably performed over the entire area of the exposure surface of the substrate S that is in contact with the flat surface 23a. Further, in the held state, the position in the vertical direction of the exposure surface of the substrate S that is in contact with the flat surface 23b of the second holding portion 20b changes depending on the thickness of the substrate S, and the uneven shape of the exposure surface of the substrate is caused by Reduced by the way of holding. Therefore, the third moving unit 70 linearly moves only the position of the exposure surface of the substrate S contacting the flat surface 23b of the second holding portion 20b linearly by the thickness of the substrate. The amount of distance between the exposure surface of the substrate S contacting the flat surface 23b of the second holding portion 20b and the vertical direction of the second exposure portion 40 (light irradiation direction) can be prevented without using the autofocus function. It remains fixed due to the change in the thickness of the substrate S. As a result, imaging can be stably performed over the entire area of the exposure surface of the substrate S that is in contact with the flat surface 23b of the second holding portion 20b. Therefore, it can be stably imaged on both sides of the substrate S with a simple device configuration.
又，根據曝光裝置10，檢測部81、82係被固定於與第2曝光部40共通的支撐構件亦即支撐構件17。因此，第3移動部70，係可藉由簡單的構成，使第2曝 光部40與檢測部81、82僅以同一距離同時朝向同一方向移動。因此，只要位於使原本第2曝光部40及檢測部81、82進行成像於基板S之第2挾持部20b側之曝光面的位置，則因應基板S的厚度使第2曝光部40移動時，檢測部81、82將僅以同一距離朝向與其移動相同的方向移動，因此，亦可不需再調整檢測部81、82的位置。因此，提升使用者的便利性。或者，即使在檢測部81、82中不導入自動對焦功能，亦可穩定地成像於基板S之第2挾持部20b側的曝光面，因此，可使裝置構成變得簡單。而且，使第2曝光部40與檢測部81、82移動的致動器，係僅需1個即可，在該觀點亦可使裝置構成變得簡單。且，第2曝光部40與檢測部81、82分別為可獨立移動之構成的情況下，使第2曝光部40及檢測部81、82移動時，有因構件之固定精度而造成第2移動部60所致之挾持部20(基板S)的移動方向中之檢測部81、82與第2曝光部40的相對位置偏差之虞，根據本實施例之構成，第2曝光部40與檢測部81、82皆係經由支撐構件17一體成型，因此，也不會產生像這樣的風險。 Moreover, according to the exposure apparatus 10, the detection parts 81 and 82 are fixed to the support member 17 which is a support member common to the 2nd exposure part 40. Therefore, the third moving unit 70 can make the second exposure by a simple configuration. The light unit 40 and the detecting units 81 and 82 move simultaneously in the same direction at the same distance. Therefore, when the second exposure unit 40 is moved in accordance with the thickness of the substrate S as long as the original second exposure unit 40 and the detection units 81 and 82 are imaged on the exposure surface of the second holding unit 20b side of the substrate S, Since the detecting units 81 and 82 move only in the same direction as the movement of the same distance, it is not necessary to adjust the positions of the detecting units 81 and 82. Therefore, the convenience of the user is improved. Alternatively, even if the autofocus function is not introduced into the detecting portions 81 and 82, the exposure surface on the second grip portion 20b side of the substrate S can be stably imaged. Therefore, the device configuration can be simplified. Further, only one actuator for moving the second exposure unit 40 and the detecting units 81 and 82 is required, and in this view, the device configuration can be simplified. When the second exposure unit 40 and the detection units 81 and 82 are configured to be independently movable, when the second exposure unit 40 and the detection units 81 and 82 are moved, the second movement is caused by the fixing accuracy of the member. In the moving direction of the holding portion 20 (substrate S) by the portion 60, the relative positional deviation between the detecting portions 81 and 82 and the second exposure portion 40 is the second exposure portion 40 and the detecting portion according to the configuration of the present embodiment. Both 81 and 82 are integrally molded via the support member 17, and therefore, there is no risk like this.
圖6，係表示作為第2實施例之曝光裝置210的概略構成。圖6，係對應於第1實施例的圖2。在圖6中，針對與第1實施例相同的構成要素賦予與圖2相同的符號並省略說明。如圖6所示，曝光裝置210，係除了作為第1 實施例之曝光裝置10的構成，亦具備有密封部281與減壓部290。密封部281係由彈性構件所形成，且以包圍下側玻璃板21a的方式，被安裝於支撐部22a的上面。密封部281的高度，係形成為大於基板S的厚度。在下側玻璃板21a係形成有貫通孔285，在貫通孔285係經由配管連接有減壓部290。減壓部290，係例如可設成為真空泵。 Fig. 6 shows a schematic configuration of an exposure apparatus 210 as a second embodiment. Fig. 6 corresponds to Fig. 2 of the first embodiment. In FIG. 6, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIG. 2, and description thereof will be omitted. As shown in FIG. 6, the exposure device 210 is in addition to being the first The configuration of the exposure apparatus 10 of the embodiment also includes a sealing portion 281 and a pressure reducing portion 290. The sealing portion 281 is formed of an elastic member and is attached to the upper surface of the support portion 22a so as to surround the lower glass plate 21a. The height of the sealing portion 281 is formed to be larger than the thickness of the substrate S. A through hole 285 is formed in the lower glass plate 21a, and a pressure reducing portion 290 is connected to the through hole 285 via a pipe. The pressure reducing portion 290 can be, for example, a vacuum pump.
在該曝光裝置210中，以將基板S載置於下側玻璃板21a的狀態，使第2挾持部20b時，首先，密封部281與支撐部22b之下面將抵接基板S的周圍，基板S的周圍將形成為被密封部281密封的狀態。此時，在基板S與平坦面23b之間形成有空隙，或是，基板S與平坦面23b會大致接觸。在該狀態下，驅動減壓部290，進而對密封部281之內部的空間進行減壓。藉此，隨著密封部281朝向垂直方向作擠壓，第2挾持部20b將更向下方移動。其結果，平坦面方向23b將與基板S抵接，進而以非常強大的力將基板S推壓至下方。如此一來，在曝光裝置210中，可得到挾持狀態。 In the exposure apparatus 210, in the state in which the substrate S is placed on the lower glass plate 21a, when the second holding portion 20b is used, first, the sealing portion 281 and the lower surface of the supporting portion 22b abut against the periphery of the substrate S, and the substrate The periphery of S will be formed in a state of being sealed by the sealing portion 281. At this time, a gap is formed between the substrate S and the flat surface 23b, or the substrate S and the flat surface 23b are substantially in contact with each other. In this state, the pressure reducing portion 290 is driven, and the space inside the sealing portion 281 is further decompressed. Thereby, as the seal portion 281 is pressed in the vertical direction, the second grip portion 20b is moved further downward. As a result, the flat surface direction 23b abuts against the substrate S, and the substrate S is pressed to the lower side with a very strong force. As a result, in the exposure device 210, the holding state can be obtained.
根據該構成，由於基板S會被更強大的力挾持，因此，在基板S具有非平坦形狀時，能夠更減少非平坦形狀。其結果，可穩定地成像於基板S的曝光面。另外，貫通孔285，係亦可被形成於支撐部22a。又，密封部281，係亦可被形成於下側玻璃板21a上。且，密封部281及貫通孔285，係亦可被形成於第2挾持部20b。 According to this configuration, since the substrate S is held by a stronger force, when the substrate S has a non-flat shape, the uneven shape can be further reduced. As a result, it can be stably imaged on the exposure surface of the substrate S. Further, the through hole 285 may be formed in the support portion 22a. Further, the sealing portion 281 may be formed on the lower glass plate 21a. Further, the sealing portion 281 and the through hole 285 may be formed in the second holding portion 20b.
圖7，係表示作為第3實施例之曝光裝置310的概略構成。圖8，係圖7所示之曝光裝置310之C-C箭頭視圖。圖7係對應於第1實施例的圖2，圖8係對應於圖3。在圖7、8中，針對與第1實施例相同的構成要素賦予與圖2、3相同的符號並省略說明。在該曝光裝置310中，係使用可撓性帶狀來作為基板S。 Fig. 7 shows a schematic configuration of an exposure apparatus 310 as a third embodiment. Figure 8 is a C-C arrow view of the exposure apparatus 310 shown in Figure 7. Fig. 7 corresponds to Fig. 2 of the first embodiment, and Fig. 8 corresponds to Fig. 3. In FIGS. 7 and 8, the same components as those in the first embodiment are denoted by the same reference numerals as those in FIGS. 2 and 3, and description thereof will be omitted. In the exposure apparatus 310, a flexible strip shape is used as the substrate S.
如圖7、8所示，曝光裝置310，係具備有：運送裝置381；滾筒382、383、385、386；搬送裝置384；及捲取裝置387。運送裝置381，係使安裝有形成為曝光處理對象之捲筒狀基板S的滾筒(捲筒)旋轉，進而運送基板S。從運送裝置381被運送的基板S，係經由滾筒382上，通過第1挾持部20a與第2挾持部20b之間，且進一步通過第1曝光部30與第2曝光部40之間，經由滾筒383上、搬送裝置384、滾筒385、386上，被捲取於捲取裝置387。捲取裝置387，係使滾筒旋轉，進而使被曝光的基板S捲取於滾筒上。搬送裝置384，係在運送裝置381與捲取裝置387之間，將基板S從運送裝置381朝向捲取裝置387的方向及從捲取裝置387朝向運送裝置381的方向搬送。在本實施例中，搬送裝置384係軋輥。運送裝置381與捲取裝置387之間的基板S，係以儘可能不使長邊方向之張力作為於基板S的方式，進行張力調整。該張力調整，係以基板S不會與第1挾持部20a接觸的程度來進行為較佳。如此一來，以挾持部20不挾持基 板S的狀態，使挾持部20移動時，基板S不會在第1挾持部a上滑動，因此，可抑制基板S損傷。 As shown in FIGS. 7 and 8, the exposure device 310 includes a transport device 381, rollers 382, 383, 385, and 386, a transport device 384, and a winding device 387. The transport device 381 rotates a drum (reel) to which the roll substrate S formed as an exposure processing target is attached, and transports the substrate S. The substrate S transported from the transport device 381 passes between the first gripping portion 20a and the second gripping portion 20b via the roller 382, and further passes between the first exposing portion 30 and the second exposing portion 40 via the roller. The 383 upper, the conveying device 384, and the rollers 385 and 386 are taken up by the winding device 387. The winding device 387 rotates the drum to wind the exposed substrate S onto the drum. The transport device 384 transports the substrate S from the transport device 381 toward the take-up device 387 and from the take-up device 387 toward the transport device 381 between the transport device 381 and the take-up device 387. In the present embodiment, the conveying device 384 is a roll. The substrate S between the transport device 381 and the winding device 387 is tension-adjusted so that the tension in the longitudinal direction is not applied to the substrate S as much as possible. This tension adjustment is preferably performed so that the substrate S does not come into contact with the first holding portion 20a. In this way, the maintenance department 20 does not hold the base. In the state of the board S, when the grip portion 20 is moved, the substrate S does not slide on the first grip portion a, so that damage to the substrate S can be suppressed.
該曝光裝置310，係例如以下述般進行動作。首先，曝光裝置310，係如圖7所示，在滾筒382與檢測部81~84之間的位置，使第2挾持部20b下降，並藉由平坦面23a與平坦面23b來挾持基板S之預定的曝光區域。接下來，曝光裝置310，係藉由使以維持挾持狀態的挾持部20朝向第1曝光部30及第2曝光部40的方向移動，進而將基板S送至其長邊方向(從運送裝置381朝向捲取裝置387的方向)。此時，運送裝置381及捲取裝置387，係以在基板S儘可能不產生張力的範圍，使滾筒旋轉。亦即，運送裝置381及捲取裝置387只不過是進行基板S的送出或捲取動作，並非使所需的力在基板S的送出時作用於基板S。相同地，此時，搬送裝置384亦不會有助於基板S的搬送動作。 The exposure device 310 operates as follows, for example. First, as shown in FIG. 7, the exposure device 310 lowers the second holding portion 20b at a position between the drum 382 and the detecting portions 81 to 84, and holds the substrate S by the flat surface 23a and the flat surface 23b. The predetermined exposure area. Next, the exposure device 310 moves the substrate S in the direction in which the first exposure unit 30 and the second exposure unit 40 are moved toward the first exposure unit 30 and the second exposure unit 40, and further sends the substrate S to the longitudinal direction thereof (from the transport device 381). The direction toward the take-up device 387). At this time, the transport device 381 and the winding device 387 rotate the drum in a range in which the substrate S does not generate tension as much as possible. That is, the transport device 381 and the winding device 387 merely perform the feeding or winding operation of the substrate S, and do not apply the required force to the substrate S when the substrate S is fed. Similarly, at this time, the conveying device 384 does not contribute to the conveyance operation of the substrate S.
基板S被送至預定位置時，曝光裝置310將藉由檢測部81~84檢測出預定的曝光區域或被設置於其附近之基板S上的標記。且，曝光裝置310，係傳送基板S的同時，因應其檢測結果並藉由第1曝光部30及第2曝光部40，對挾持狀態之基板S的預定曝光區域進行曝光。預定之曝光區域的曝光結束時，曝光裝置310將使第2挾持部20b上升，進而解除挾持狀態。解除挾持狀態時，曝光裝置310，係藉由搬送裝置384使基板S朝向反方向亦即從捲取裝置387朝向運送裝置381的方向移動。 此時，運送裝置381及捲取裝置387，係以在基板S儘可能不產生張力的範圍，使滾筒反向旋轉。基板S朝向該反方向之移動，係一直進行到其次應進行曝光之曝光區域返回至滾筒382與檢測部81~84之間的預定位置。 When the substrate S is sent to the predetermined position, the exposure device 310 detects the predetermined exposure region or the mark on the substrate S provided in the vicinity thereof by the detecting portions 81 to 84. Further, the exposure device 310 transmits the substrate S while exposing the predetermined exposure region of the substrate S in the held state by the first exposure unit 30 and the second exposure unit 40 in response to the detection result. When the exposure of the predetermined exposure region is completed, the exposure device 310 raises the second grip portion 20b and releases the grip state. When the gripping state is released, the exposure device 310 moves the substrate S in the opposite direction, that is, from the winding device 387 toward the transport device 381 by the transport device 384. At this time, the transporting device 381 and the winding device 387 rotate the drum in the reverse direction so that the substrate S does not generate tension as much as possible. The movement of the substrate S in the opposite direction is continued until the exposure region to be exposed next is returned to a predetermined position between the roller 382 and the detecting portions 81 to 84.
且，於下個曝光區域返回至預定位置的時間點，曝光裝置310，係以第2挾持部20b上升的狀態亦即以非挾持的狀態，使挾持部20移動至可挾持下個曝光區域的位置。且，曝光裝置310，係再次使第2挾持部20b下降，並挾持基板S的下個曝光區域。然後，重複進行上述之曝光周期。 When the next exposure region returns to the predetermined position, the exposure device 310 moves the grip portion 20 to the position capable of holding the next exposure region in a state in which the second grip portion 20b is raised, that is, in a non-clamped state. position. Further, the exposure device 310 lowers the second grip portion 20b again and grips the next exposure region of the substrate S. Then, the above exposure period is repeated.
根據該曝光裝置310，即使是在基板S上產生稍微撓曲時，基板S亦被挾持於平坦面23a與平坦面23b，因此，將以非常平坦的狀態予以挾持。而且，於挾持狀態下，接觸於第1挾持部20a之平坦面23a之基板S的曝光面與第1曝光部30的垂直方向之距離，係與第1實施例相同，被保持固定。又，由於可撓性帶狀之基板S通常其厚度較薄，因此，於挾持狀態下，即使針對接觸於第2挾持部20b之平坦面23a之基板S的曝光面與第2曝光部40的垂直方向之距離，亦被保持固定。因此，能夠以簡單的構成來穩定地成像於基板S之兩面的曝光面。 According to the exposure apparatus 310, even when the substrate S is slightly deflected, the substrate S is held by the flat surface 23a and the flat surface 23b, and therefore, the substrate S is held in a very flat state. In the holding state, the distance between the exposure surface of the substrate S contacting the flat surface 23a of the first holding portion 20a and the vertical direction of the first exposure portion 30 is kept constant as in the first embodiment. Further, since the flexible strip-shaped substrate S is generally thin, even in the held state, the exposure surface of the substrate S contacting the flat surface 23a of the second holding portion 20b and the second exposure portion 40 are The distance in the vertical direction is also kept fixed. Therefore, the exposure surface on both surfaces of the substrate S can be stably imaged with a simple configuration.
又，根據曝光裝置310，傳送基板S時，亦即在進行曝光中，不會在基板S的曝光面產生過剩之長邊方向的張力。亦即，不會有過剩的張力作用於基板S且曝光面在朝向長邊方向延伸之狀態下被曝光的情形。因此，可 精度良好地在基板S上形成圖案。 Further, when the substrate S is transferred by the exposure device 310, that is, during exposure, excessive tension in the longitudinal direction is not generated on the exposure surface of the substrate S. That is, there is no case where excessive tension acts on the substrate S and the exposure surface is exposed in a state of extending toward the longitudinal direction. Therefore, A pattern is formed on the substrate S with high precision.
又，由於曝光裝置310係具備有搬送裝置384，因此，在更換基板S時，可藉由搬送裝置384將新安裝於運送裝置381的基板S送出至捲取裝置387的方向，進而捲繞於捲取裝置387。又，可輕易地進行基板S之張力調整。另外，搬送裝置384，亦可省略。在該情況下，基板S朝反方向的移動，係亦可藉由第1挾持部20a及第2挾持部20b來進行。 Further, since the exposure device 310 includes the transport device 384, when the substrate S is replaced, the substrate S newly attached to the transport device 381 can be sent to the winding device 387 by the transport device 384, and then wound around Winding device 387. Moreover, the tension adjustment of the substrate S can be easily performed. Further, the transport device 384 may be omitted. In this case, the movement of the substrate S in the reverse direction can be performed by the first holding portion 20a and the second holding portion 20b.
在上述的實施例中，雖藉由僅使第2挾持部20b移動的方式，例示了挾持基板S的構成，但用於挾持基板S的態樣並不限於上述例子。例如，亦可僅使第1挾持部20a移動，亦可使第1挾持部20a及第2挾持部20b兩者移動。 In the above-described embodiment, the configuration in which the substrate S is held is exemplified by merely moving the second holding portion 20b. However, the aspect for holding the substrate S is not limited to the above example. For example, only the first gripping portion 20a may be moved, or both the first gripping portion 20a and the second gripping portion 20b may be moved.
在上述之第3實施例中，在構成為第1挾持部20a及第2挾持部20b兩者可移動的情況下，曝光裝置310，係亦可為下述構成：藉由第1挾持部20a及第2挾持部20b，而在事先所決定之固定的位置挾持基板S。或是，曝光裝置310，係除了第3移動部70之外，亦具備有第4移動部，該第3移動部70係使第2曝光部40直線地朝向靠近第1曝光部30的方向及遠離的方向移動，該第4移動部使第1曝光部30直線地朝向靠近第2曝光部 40的方向及遠離的方向移動。第1曝光部30，係亦可藉由第4移動部被固定於可移動的支撐構件(亦稱為第2支撐構件)。檢測部83、84，係亦可被固定於第2支撐構件。第4移動部，係可設成為與第3移動部相同的構成。藉由該些構成，亦能夠穩定地成像於基板S之兩面的曝光面全區域。 In the third embodiment described above, when both the first holding portion 20a and the second holding portion 20b are movable, the exposure device 310 may be configured by the first holding portion 20a. And the second holding portion 20b holds the substrate S at a fixed position determined in advance. Alternatively, the exposure device 310 includes a fourth moving portion in addition to the third moving portion 70, and the third moving portion 70 linearly faces the first exposure portion 30 and Moving away from the direction, the fourth moving unit linearly faces the first exposure unit 30 toward the second exposure unit Move in the direction of 40 and away from it. The first exposure unit 30 may be fixed to the movable supporting member (also referred to as a second supporting member) by the fourth moving portion. The detecting portions 83 and 84 may be fixed to the second supporting member. The fourth moving unit can be configured to have the same configuration as the third moving unit. With such a configuration, it is also possible to stably image the entire area of the exposure surface on both surfaces of the substrate S.
在上述實施例中，透過部21a、21b，雖係藉由支撐部22a、22b來支撐，但，支撐部22a、22b亦可省略。例如，透過部21a、21b，係亦可有組合上述透過部21a、21b及支撐部22a、22b的形狀。 In the above embodiment, the transmitting portions 21a and 21b are supported by the supporting portions 22a and 22b, but the supporting portions 22a and 22b may be omitted. For example, the transmissive portions 21a and 21b may have shapes in which the transmissive portions 21a and 21b and the support portions 22a and 22b are combined.
以上，根據幾個實施例來說明有關本發明的實施形態，但上述發明的實施形態是為了容易理解本發明，而不是限定本發明者。當然本發明可不脫離其主旨來實施變更、改良，且本發明為該等價物所包含。又，在可解決上述課題的至少一部分的範圍或取得效果的至少一部分的範圍中，可組合或省略申請專利範圍及說明書中所記載的各構成要素。 The embodiments of the present invention have been described above on the basis of a few embodiments, but the embodiments of the invention described above are intended to facilitate the understanding of the invention and not to limit the invention. It is a matter of course that the invention can be modified or modified without departing from the spirit and scope of the invention. Further, in the range in which at least a part of the above-described problems or at least a part of the effects can be solved, the respective components described in the claims and the description can be combined or omitted.
10‧‧‧曝光裝置 10‧‧‧Exposure device
15‧‧‧基底構件 15‧‧‧Base member
16、17‧‧‧支撐構件 16, 17‧‧‧Support members
20a‧‧‧第1挾持部 20a‧‧‧1st Maintenance Department
20b‧‧‧第2挾持部 20b‧‧‧2nd Maintenance Department
21a‧‧‧透過部(下側玻璃板) 21a‧‧‧Transmission Department (lower glass plate)
21b‧‧‧透過部(上側玻璃板) 21b‧‧‧Transmission Department (upper glass panel)
22a、22b‧‧‧支撐部 22a, 22b‧‧‧Support
23a、23b‧‧‧平坦面 23a, 23b‧‧‧ flat surface
30‧‧‧第1曝光部 30‧‧‧1st exposure department
31‧‧‧曝光單元 31‧‧‧Exposure unit
40‧‧‧第2曝光部 40‧‧‧2nd exposure department
41‧‧‧曝光單元 41‧‧‧Exposure unit
50‧‧‧第1移動部 50‧‧‧1st mobile department
51‧‧‧導引軸 51‧‧‧Guide axis
60‧‧‧第2移動部 60‧‧‧2nd Moving Department
61‧‧‧線性馬達 61‧‧‧Linear motor
62‧‧‧導引件 62‧‧‧Guide
63‧‧‧導引軌 63‧‧‧ Guide rail
70‧‧‧第3移動部 70‧‧‧3rd Ministry of Movement
71‧‧‧導引件 71‧‧‧ Guides
72‧‧‧導引軌 72‧‧‧ Guide track
81~84‧‧‧檢測部 81~84‧‧‧Detection Department
S‧‧‧基板 S‧‧‧Substrate
Claims (9)
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| KR (1) | KR102102939B1 (en) |
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| JPH05265220A (en) * | 1992-03-19 | 1993-10-15 | Orc Mfg Co Ltd | Exposure device for inclined substrate |
| US5337151A (en) | 1992-07-28 | 1994-08-09 | Optical Radiation Corporation | Double-sided circuit board exposure machine and method with optical registration and material variation compensation |
| JP2810909B2 (en) * | 1994-02-28 | 1998-10-15 | セイコープレシジョン株式会社 | Exposure equipment |
| FR2748887B1 (en) * | 1996-05-15 | 1998-08-21 | Automa Tech Sa | INSTALLATION FOR THE EXPOSURE TO THE LIGHT OF A DOUBLE-SIDED PRINTED CIRCUIT PLATE THROUGH SHEETS |
| JP3417313B2 (en) * | 1998-09-28 | 2003-06-16 | ウシオ電機株式会社 | Exposure equipment for strip-shaped workpieces |
| JP2000235267A (en) * | 1999-02-15 | 2000-08-29 | Asahi Optical Co Ltd | Scanning type plotting device |
| JP2002099095A (en) * | 2000-09-25 | 2002-04-05 | Orc Mfg Co Ltd | Automatic both-side exposing device and method of using the same |
| JP2005326550A (en) * | 2004-05-13 | 2005-11-24 | Sanee Giken Kk | Exposure device |
| JP4491311B2 (en) * | 2004-09-30 | 2010-06-30 | 富士フイルム株式会社 | Image recording apparatus and image recording method |
| JP4472560B2 (en) | 2005-03-08 | 2010-06-02 | 日立ビアメカニクス株式会社 | MASKLESS EXPOSURE APPARATUS, ITS EXPOSURE METHOD, AND WIRING BOARD MANUFACTURING METHOD |
| JP4984631B2 (en) * | 2006-04-28 | 2012-07-25 | 株式会社ニコン | EXPOSURE APPARATUS AND METHOD, EXPOSURE MASK, AND DEVICE MANUFACTURING METHOD |
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| JP2014190987A (en) | 2014-10-06 |
| CN105190444A (en) | 2015-12-23 |
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| KR20150135380A (en) | 2015-12-02 |
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