JP2020181917A5 - - Google Patents

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Publication number
JP2020181917A5
JP2020181917A5 JP2019084802A JP2019084802A JP2020181917A5 JP 2020181917 A5 JP2020181917 A5 JP 2020181917A5 JP 2019084802 A JP2019084802 A JP 2019084802A JP 2019084802 A JP2019084802 A JP 2019084802A JP 2020181917 A5 JP2020181917 A5 JP 2020181917A5
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JP
Japan
Prior art keywords
semiconductor device
mold resin
thermal conductivity
heat dissipation
insulating sheet
Prior art date
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Application number
JP2019084802A
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English (en)
Japanese (ja)
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JP7134131B2 (ja
JP2020181917A (ja
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Publication date
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Priority to JP2019084802A priority Critical patent/JP7134131B2/ja
Priority claimed from JP2019084802A external-priority patent/JP7134131B2/ja
Priority to US16/736,501 priority patent/US11164812B2/en
Priority to DE102020110616.5A priority patent/DE102020110616A1/de
Priority to CN202010316092.XA priority patent/CN111863742B/zh
Publication of JP2020181917A publication Critical patent/JP2020181917A/ja
Publication of JP2020181917A5 publication Critical patent/JP2020181917A5/ja
Application granted granted Critical
Publication of JP7134131B2 publication Critical patent/JP7134131B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019084802A 2019-04-26 2019-04-26 半導体装置 Active JP7134131B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019084802A JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置
US16/736,501 US11164812B2 (en) 2019-04-26 2020-01-07 Semiconductor device
DE102020110616.5A DE102020110616A1 (de) 2019-04-26 2020-04-20 Halbleitervorrichtung
CN202010316092.XA CN111863742B (zh) 2019-04-26 2020-04-21 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019084802A JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2020181917A JP2020181917A (ja) 2020-11-05
JP2020181917A5 true JP2020181917A5 (enExample) 2021-07-26
JP7134131B2 JP7134131B2 (ja) 2022-09-09

Family

ID=72840145

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019084802A Active JP7134131B2 (ja) 2019-04-26 2019-04-26 半導体装置

Country Status (4)

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US (1) US11164812B2 (enExample)
JP (1) JP7134131B2 (enExample)
CN (1) CN111863742B (enExample)
DE (1) DE102020110616A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7649171B2 (ja) * 2021-03-17 2025-03-19 ローム株式会社 半導体装置
JP7594950B2 (ja) * 2021-03-17 2024-12-05 ローム株式会社 半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536745A (ja) 1991-08-01 1993-02-12 Shinko Electric Ind Co Ltd 封止金型及び封止方法
JPH0595014A (ja) 1991-10-02 1993-04-16 Hitachi Ltd 封止体形成方法
JP3345241B2 (ja) * 1995-11-30 2002-11-18 三菱電機株式会社 半導体装置
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
JP3390661B2 (ja) * 1997-11-13 2003-03-24 三菱電機株式会社 パワーモジュール
KR100723454B1 (ko) * 2004-08-21 2007-05-30 페어차일드코리아반도체 주식회사 높은 열 방출 능력을 구비한 전력용 모듈 패키지 및 그제조방법
JP2004063688A (ja) * 2002-07-26 2004-02-26 Mitsubishi Electric Corp 半導体装置及び半導体アセンブリモジュール
JP4089636B2 (ja) 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
JP5272191B2 (ja) * 2007-08-31 2013-08-28 三菱電機株式会社 半導体装置および半導体装置の製造方法
KR101204564B1 (ko) * 2011-09-30 2012-11-23 삼성전기주식회사 전력 모듈 패키지 및 그 제조 방법
JP5863599B2 (ja) 2012-08-21 2016-02-16 三菱電機株式会社 パワーモジュール
DE112014006142B4 (de) 2014-01-10 2024-01-18 Mitsubishi Electric Corporation Leistungshalbleiteranordnung
JP6797002B2 (ja) * 2016-11-18 2020-12-09 三菱電機株式会社 半導体装置および半導体装置の製造方法

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