JP2016522299A5 - - Google Patents

Download PDF

Info

Publication number
JP2016522299A5
JP2016522299A5 JP2016520460A JP2016520460A JP2016522299A5 JP 2016522299 A5 JP2016522299 A5 JP 2016522299A5 JP 2016520460 A JP2016520460 A JP 2016520460A JP 2016520460 A JP2016520460 A JP 2016520460A JP 2016522299 A5 JP2016522299 A5 JP 2016522299A5
Authority
JP
Japan
Prior art keywords
component
boron nitride
polymer
nitride compound
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016520460A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016522299A (ja
Filing date
Publication date
Priority claimed from EP13172868.5A external-priority patent/EP2816082B1/de
Application filed filed Critical
Publication of JP2016522299A publication Critical patent/JP2016522299A/ja
Publication of JP2016522299A5 publication Critical patent/JP2016522299A5/ja
Pending legal-status Critical Current

Links

JP2016520460A 2013-06-19 2014-06-18 ポリマー／窒化ホウ素化合物の熱可塑加工によって生成される構成部品、そのような構成部品を生成するためのポリマー／窒化ホウ素化合物、及びその使用 Pending JP2016522299A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP13172868.5A EP2816082B1 (de) 2013-06-19 2013-06-19 Durch thermoplastische Verarbeitung von Polymer-Bornitrid-Compounds hergestellte Bauteile, Polymer-Bornitrid-Compounds zur Herstellung solcher Bauteile sowie deren Verwendung
EP13172868.5 2013-06-19
PCT/EP2014/062800 WO2014202652A1 (en) 2013-06-19 2014-06-18 Component parts produced by thermoplastic processing of polymer/boron nitride compounds, polymer/boron nitride compounds for producing such component parts and use thereof

Publications (2)

Publication Number Publication Date
JP2016522299A JP2016522299A (ja) 2016-07-28
JP2016522299A5 true JP2016522299A5 (enExample) 2017-07-27

Family

ID=48628540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016520460A Pending JP2016522299A (ja) 2013-06-19 2014-06-18 ポリマー／窒化ホウ素化合物の熱可塑加工によって生成される構成部品、そのような構成部品を生成するためのポリマー／窒化ホウ素化合物、及びその使用

Country Status (6)

Country Link
US (1) US20160122502A1 (enExample)
EP (1) EP2816082B1 (enExample)
JP (1) JP2016522299A (enExample)
KR (1) KR20160022868A (enExample)
CN (1) CN105308111A (enExample)
WO (1) WO2014202652A1 (enExample)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PL2862894T3 (pl) * 2013-10-15 2018-06-29 Lanxess Deutschland Gmbh Termoplastyczne masy formierskie
EP2924062B1 (de) * 2014-03-27 2019-02-13 LANXESS Deutschland GmbH Flammwidrige Polyamidzusammensetzungen
KR102318231B1 (ko) * 2015-01-29 2021-10-27 엘지이노텍 주식회사 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판
WO2017014238A1 (ja) * 2015-07-21 2017-01-26 住友ベークライト株式会社 熱伝導性樹脂組成物、熱伝導性シートおよび半導体装置
KR102033328B1 (ko) * 2015-09-03 2019-10-17 쇼와 덴코 가부시키가이샤 육방정 질화붕소 분말, 그 제조 방법, 수지 조성물 및 수지 시트
CN108473308B (zh) * 2016-02-22 2021-10-29 昭和电工株式会社 六方晶氮化硼粉末、其制造方法、树脂组合物及树脂片
CN109844447A (zh) * 2016-07-12 2019-06-04 新度技术有限公司 一种纳米复合力传感材料
CN106366402B (zh) * 2016-08-26 2018-11-16 中国科学院宁波材料技术与工程研究所 一种高导热氮化硼增强聚合物基复合材料制备方法
JP6994229B2 (ja) * 2017-06-28 2022-01-14 河合石灰工業株式会社 表面改質窒化ホウ素の製造方法
EP3696140B1 (en) * 2017-10-13 2021-07-21 Denka Company Limited Boron nitride powder, method for producing same, and heat-dissipating member produced using same
DE102017221039B4 (de) * 2017-11-24 2020-09-03 Tesa Se Verfahren zur Herstellung einer Haftklebemasse auf Basis von Acrylnitril-Butadien-Kautschuk
CN109988409B (zh) * 2017-12-29 2021-10-19 广东生益科技股份有限公司 一种氮化硼团聚体、包含其的热固性树脂组合物及其用途
CN109280332A (zh) * 2018-08-03 2019-01-29 吉林大学 一种氮化硼/环氧树脂导热绝缘复合材料的制备方法
CN112521159A (zh) * 2020-03-20 2021-03-19 山东晶亿新材料有限公司 一种氮化硼复合陶瓷及其制备方法和应用
JP7796274B1 (ja) 2025-03-31 2026-01-08 デンカ株式会社 窒化ホウ素粉末、及び無機フィラー

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7976941B2 (en) * 1999-08-31 2011-07-12 Momentive Performance Materials Inc. Boron nitride particles of spherical geometry and process for making thereof
US6794435B2 (en) * 2000-05-18 2004-09-21 Saint Gobain Ceramics & Plastics, Inc. Agglomerated hexagonal boron nitride powders, method of making, and uses thereof
US20070259211A1 (en) * 2006-05-06 2007-11-08 Ning Wang Heat spread sheet with anisotropic thermal conductivity
KR101252332B1 (ko) * 2006-06-12 2013-04-08 스미또모 덴꼬오 하드메탈 가부시끼가이샤 복합 소결체
DE112008002566B4 (de) * 2007-09-26 2014-08-28 Mitsubishi Electric Corp. Wärmeleitfähige Lage und Verfahren zum Herstellen derselben, und Leistungsmodul
JP2010001402A (ja) * 2008-06-20 2010-01-07 Kaneka Corp 高熱伝導性樹脂成形体
JP5038257B2 (ja) * 2008-08-22 2012-10-03 株式会社カネカ 六方晶窒化ホウ素及びその製造方法
WO2011125545A1 (ja) * 2010-04-07 2011-10-13 電気化学工業株式会社 Ｌｅｄ照明筐体用の放熱性樹脂組成物及びそのｌｅｄ照明用放熱性筐体
DE102010050900A1 (de) * 2010-11-10 2012-05-10 Esk Ceramics Gmbh & Co. Kg Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung
DE102011114413A1 (de) * 2011-09-26 2013-03-28 Esk Ceramics Gmbh & Co. Kg Hydrodynamisches Axiallager
US8946333B2 (en) * 2012-09-19 2015-02-03 Momentive Performance Materials Inc. Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics
US20140080954A1 (en) * 2012-09-19 2014-03-20 Chandrashekar Raman Methods for making thermally conductve compositions containing boron nitride

Similar Documents

Publication Publication Date Title
JP2016522299A5 (enExample)
JP2016530134A5 (enExample)
EP3422400A4 (en) THERMALLY CONDUCTIVE FOIL, MANUFACTURING METHOD AND HEAT EXTRACTION DEVICE
WO2015093903A8 (ko) 방열성이 우수한 금속 봉지재, 그 제조방법 및 상기 금속 봉지재로 봉지된 유연전자소자
PH12017501469A1 (en) Mold release film
EP3305856A4 (en) RESIN COMPOSITION, RESIN FOIL, PREPREG, ISOLATOR, CURED RESIN FOIL PRODUCT AND HEAT EXTRACTER
JP2015186128A5 (enExample)
EP2975640A3 (en) Electronic device assembly
JP2016186582A5 (enExample)
JP2017106422A5 (enExample)
HUE058162T2 (hu) Hõvezetõ anyagösszetétel, félvezetõ eszköz, eljárás a félvezetõ eszköz elõállítására, és eljárás hõnyelõ lemez rögzítésére
EP3514188A4 (en) RESIN COMPOSITION, HEAT-CONDUCTING FLEXIBLE FILM THEREFORE AND HEAT DISCHARGE STRUCTURE
EP3653574A4 (en) SURFACE-MODIFIED INORGANIC NITRIDE, COMPOSITION, THERMAL CONDUCTIVE MATERIAL, AND DEVICE HAVING A LAYER OF THERMAL CONDUCTIVE MATERIAL
JP2014196484A5 (enExample)
JP2014141656A5 (enExample)
JP2016036764A5 (enExample)
WO2016061006A3 (en) Carbon nanotubes as a thermal interface material
JP2015158139A5 (enExample)
JP2014179568A5 (enExample)
JP2015187314A5 (enExample)
JP2016093899A5 (ja) 部材同士の取り付け構造およびそれを備えた電子機器
CN302550726S (zh) 车门护板（t1a5e）
CN302488524S (zh) 工程机械报警装置
CN302533089S (zh) 模具
CN302457941S (zh) 风扇扇叶