JP2016522299A5 - - Google Patents
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- Publication number
- JP2016522299A5 JP2016522299A5 JP2016520460A JP2016520460A JP2016522299A5 JP 2016522299 A5 JP2016522299 A5 JP 2016522299A5 JP 2016520460 A JP2016520460 A JP 2016520460A JP 2016520460 A JP2016520460 A JP 2016520460A JP 2016522299 A5 JP2016522299 A5 JP 2016522299A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- boron nitride
- polymer
- nitride compound
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052582 BN Inorganic materials 0.000 claims 6
- -1 boron nitride compound Chemical class 0.000 claims 4
- 229920000642 polymer Polymers 0.000 claims 4
- PZNSFCLAULLKQX-UHFFFAOYSA-N N#B Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 2
- 239000011231 conductive filler Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 239000002861 polymer material Substances 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
Claims (3)
- 構成部品の少なくとも一部分上に最大３ｍｍの壁厚を有する構成部品であって、前記構成部品が、ポリマー／窒化ホウ素化合物の熱可塑加工によって生成され、前記ポリマー／窒化ホウ素化合物が、熱可塑的に加工可能なポリマー材料及び熱伝導充填剤を含み、前記充填剤が、窒化ホウ素凝集体を含む、構成部品。
- 請求項１に記載の構成部品を生成するためのポリマー／窒化ホウ素化合物であって、熱可塑的に加工可能なポリマー材料及び熱伝導性充填剤を含み、前記充填剤が、窒化ホウ素凝集体を含む、ポリマー／窒化ホウ素化合物。
- 冷却される構成部品又はアセンブリから、好ましくは電子構成部品又はアセンブリから放熱するための、請求項１に記載の構成部品の使用。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13172868.5 | 2013-06-19 | ||
| EP13172868.5A EP2816082B1 (de) | 2013-06-19 | 2013-06-19 | Durch thermoplastische Verarbeitung von Polymer-Bornitrid-Compounds hergestellte Bauteile, Polymer-Bornitrid-Compounds zur Herstellung solcher Bauteile sowie deren Verwendung |
| PCT/EP2014/062800 WO2014202652A1 (en) | 2013-06-19 | 2014-06-18 | Component parts produced by thermoplastic processing of polymer/boron nitride compounds, polymer/boron nitride compounds for producing such component parts and use thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016522299A JP2016522299A (ja) | 2016-07-28 |
| JP2016522299A5 true JP2016522299A5 (ja) | 2017-07-27 |
Family
ID=48628540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016520460A Pending JP2016522299A (ja) | 2013-06-19 | 2014-06-18 | ポリマー／窒化ホウ素化合物の熱可塑加工によって生成される構成部品、そのような構成部品を生成するためのポリマー／窒化ホウ素化合物、及びその使用 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160122502A1 (ja) |
| EP (1) | EP2816082B1 (ja) |
| JP (1) | JP2016522299A (ja) |
| KR (1) | KR20160022868A (ja) |
| CN (1) | CN105308111A (ja) |
| WO (1) | WO2014202652A1 (ja) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ES2662019T3 (es) * | 2013-10-15 | 2018-04-05 | Lanxess Deutschland Gmbh | Masas de moldeo termoplásticas |
| HUE043312T2 (hu) * | 2014-03-27 | 2019-08-28 | Lanxess Deutschland Gmbh | Égésgátló poliamid kompozíciók |
| KR102318231B1 (ko) * | 2015-01-29 | 2021-10-27 | 엘지이노텍 주식회사 | 무기충전재, 이를 포함하는 수지 조성물, 그리고 이를 이용한 방열 기판 |
| US20180208820A1 (en) * | 2015-07-21 | 2018-07-26 | Sumitomo Bakelite Co., Ltd. | Thermal conductive resin composition, thermal conductive sheet, and semiconductor device |
| EP3345865B1 (en) * | 2015-09-03 | 2021-11-24 | Showa Denko K.K. | Powder of hexagonal boron nitride, process for producing same, resin composition, and resin sheet |
| WO2017145869A1 (ja) * | 2016-02-22 | 2017-08-31 | 昭和電工株式会社 | 六方晶窒化ホウ素粉末、その製造方法、樹脂組成物及び樹脂シート |
| US10379654B2 (en) * | 2016-07-12 | 2019-08-13 | Advense Technology Inc. | Nanocomposite sensing material |
| CN106366402B (zh) * | 2016-08-26 | 2018-11-16 | 中国科学院宁波材料技术与工程研究所 | 一种高导热氮化硼增强聚合物基复合材料制备方法 |
| JP6994229B2 (ja) * | 2017-06-28 | 2022-01-14 | 河合石灰工業株式会社 | 表面改質窒化ホウ素の製造方法 |
| KR102619752B1 (ko) * | 2017-10-13 | 2023-12-29 | 덴카 주식회사 | 질화붕소 분말, 그 제조 방법 및 그것을 사용한 방열 부재 |
| DE102017221039B4 (de) * | 2017-11-24 | 2020-09-03 | Tesa Se | Verfahren zur Herstellung einer Haftklebemasse auf Basis von Acrylnitril-Butadien-Kautschuk |
| CN109988409B (zh) | 2017-12-29 | 2021-10-19 | 广东生益科技股份有限公司 | 一种氮化硼团聚体、包含其的热固性树脂组合物及其用途 |
| CN109280332A (zh) * | 2018-08-03 | 2019-01-29 | 吉林大学 | 一种氮化硼/环氧树脂导热绝缘复合材料的制备方法 |
| CN112521159A (zh) * | 2020-03-20 | 2021-03-19 | 山东晶亿新材料有限公司 | 一种氮化硼复合陶瓷及其制备方法和应用 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7976941B2 (en) * | 1999-08-31 | 2011-07-12 | Momentive Performance Materials Inc. | Boron nitride particles of spherical geometry and process for making thereof |
| US6794435B2 (en) * | 2000-05-18 | 2004-09-21 | Saint Gobain Ceramics & Plastics, Inc. | Agglomerated hexagonal boron nitride powders, method of making, and uses thereof |
| US20070259211A1 (en) * | 2006-05-06 | 2007-11-08 | Ning Wang | Heat spread sheet with anisotropic thermal conductivity |
| EP2039667B1 (en) * | 2006-06-12 | 2011-10-12 | Sumitomo Electric Hardmetal Corp. | Composite sintered body |
| US8193633B2 (en) * | 2007-09-26 | 2012-06-05 | Mitsubishi Electric Corporation | Heat conductive sheet and method for producing same, and powder module |
| JP2010001402A (ja) * | 2008-06-20 | 2010-01-07 | Kaneka Corp | 高熱伝導性樹脂成形体 |
| JP5038257B2 (ja) * | 2008-08-22 | 2012-10-03 | 株式会社カネカ | 六方晶窒化ホウ素及びその製造方法 |
| CN102822279B (zh) * | 2010-04-07 | 2014-08-13 | 电气化学工业株式会社 | Led照明箱体用的散热性树脂组合物及该led照明用散热性箱体 |
| DE102010050900A1 (de) * | 2010-11-10 | 2012-05-10 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| DE102011114413A1 (de) * | 2011-09-26 | 2013-03-28 | Esk Ceramics Gmbh & Co. Kg | Hydrodynamisches Axiallager |
| US20140080954A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Methods for making thermally conductve compositions containing boron nitride |
| US20140080951A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
-
2013
- 2013-06-19 EP EP13172868.5A patent/EP2816082B1/de not_active Not-in-force
-
2014
- 2014-06-18 WO PCT/EP2014/062800 patent/WO2014202652A1/en active Application Filing
- 2014-06-18 JP JP2016520460A patent/JP2016522299A/ja active Pending
- 2014-06-18 KR KR1020167001013A patent/KR20160022868A/ko not_active Application Discontinuation
- 2014-06-18 US US14/895,102 patent/US20160122502A1/en not_active Abandoned
- 2014-06-18 CN CN201480035112.9A patent/CN105308111A/zh active Pending
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