EP3653574A4 - Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer - Google Patents

Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer Download PDF

Info

Publication number
EP3653574A4
EP3653574A4 EP18831162.5A EP18831162A EP3653574A4 EP 3653574 A4 EP3653574 A4 EP 3653574A4 EP 18831162 A EP18831162 A EP 18831162A EP 3653574 A4 EP3653574 A4 EP 3653574A4
Authority
EP
European Patent Office
Prior art keywords
thermally conductive
composition
device provided
modified inorganic
conductive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18831162.5A
Other languages
German (de)
French (fr)
Other versions
EP3653574B1 (en
EP3653574A1 (en
Inventor
Seiichi Hitomi
Keita Takahashi
Naoyuki Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of EP3653574A1 publication Critical patent/EP3653574A1/en
Publication of EP3653574A4 publication Critical patent/EP3653574A4/en
Application granted granted Critical
Publication of EP3653574B1 publication Critical patent/EP3653574B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C01B21/0648—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/072—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with aluminium
    • C01B21/0728—After-treatment, e.g. grinding, purification
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
    • C09C3/08—Treatment with low-molecular-weight non-polymer organic compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/84—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by UV- or VIS- data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Polymerisation Methods In General (AREA)
  • Epoxy Resins (AREA)
EP18831162.5A 2017-07-14 2018-07-13 Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer Active EP3653574B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017138356 2017-07-14
PCT/JP2018/026599 WO2019013343A1 (en) 2017-07-14 2018-07-13 Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer

Publications (3)

Publication Number Publication Date
EP3653574A1 EP3653574A1 (en) 2020-05-20
EP3653574A4 true EP3653574A4 (en) 2020-07-01
EP3653574B1 EP3653574B1 (en) 2021-01-06

Family

ID=65001644

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18831162.5A Active EP3653574B1 (en) 2017-07-14 2018-07-13 Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer

Country Status (6)

Country Link
US (1) US11945717B2 (en)
EP (1) EP3653574B1 (en)
JP (1) JP6876800B2 (en)
KR (1) KR102252723B1 (en)
CN (1) CN110799454B (en)
WO (1) WO2019013343A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4001340A4 (en) * 2019-07-17 2022-08-24 FUJIFILM Corporation Composition for forming thermally conductive material, thermally conductive material, and surface-modified inorganic substance
JP7324283B2 (en) * 2019-07-26 2023-08-09 富士フイルム株式会社 COMPOSITION FOR HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE MATERIAL, HEAT CONDUCTIVE SHEET, DEVICE WITH HEAT CONDUCTIVE LAYER
EP4024445A4 (en) * 2019-08-26 2023-01-11 FUJIFILM Corporation Composition for forming heat-conducting material, heat-conducting material, heat-conducting sheet, and device with heat-conducting layer
JP7339080B2 (en) * 2019-09-04 2023-09-05 三菱マテリアル電子化成株式会社 Zirconium nitride powder and method for producing the same
JP7500750B2 (en) 2020-09-29 2024-06-17 富士フイルム株式会社 Surface-modified boron nitride particles, method for producing surface-modified boron nitride particles, composition for forming thermally conductive material, thermally conductive material, thermally conductive sheet, device with thermally conductive layer
US11697156B2 (en) 2020-12-18 2023-07-11 Mitsubishi Materials Electronic Chemicals Co., Ltd. Zirconium nitride powder and method for producing same

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020036933A (en) * 2000-11-11 2002-05-17 정광춘 Coated aluminium nitride with organo-surface treating agent for thermally conductive paste and its manufacturing method
JP2009221039A (en) * 2008-03-14 2009-10-01 Shin Kobe Electric Mach Co Ltd Inorganic nitride particle and resin composition mixed with the same
WO2016084873A1 (en) * 2014-11-27 2016-06-02 富士フイルム株式会社 Surface-modified inorganic material, method for producing surface-modified inorganic material, method for modifying inorganic material surface using organic material, heat-dissipating material, heat-conducting material, and lubricant
US20170190885A1 (en) * 2015-12-30 2017-07-06 Saint-Gobain Ceramics & Plastics, Inc. Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof
WO2017131005A1 (en) * 2016-01-26 2017-08-03 富士フイルム株式会社 Surface-modified inorganic substance and production method therefor, resin composition, thermally-conductive material, and device

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0198668A (en) * 1987-10-13 1989-04-17 Hitachi Chem Co Ltd Resin composition
JP2802719B2 (en) 1994-04-08 1998-09-24 富士写真フイルム株式会社 Optically anisotropic sheet and liquid crystal display device using the same
JP2696480B2 (en) 1994-05-11 1998-01-14 富士写真フイルム株式会社 Novel triphenylene derivative and optically anisotropic material containing it
DE19532408A1 (en) 1995-09-01 1997-03-06 Basf Ag Polymerizable liquid crystalline compounds
JPH11323162A (en) 1998-03-19 1999-11-26 Hitachi Ltd Insulation composition
US7109288B2 (en) 2001-05-18 2006-09-19 Hitachi, Ltd. Cured thermosetting resin product
JP4344591B2 (en) 2003-11-25 2009-10-14 富士フイルム株式会社 Retardation plate, triphenylene compound, and liquid crystal display device
JP4738034B2 (en) 2004-08-12 2011-08-03 富士フイルム株式会社 Liquid crystalline compounds, compositions and thin films
JP5209181B2 (en) 2005-03-15 2013-06-12 富士フイルム株式会社 Compound, composition, retardation plate, elliptically polarizing plate, and liquid crystal display device
JP4866638B2 (en) 2005-03-24 2012-02-01 富士フイルム株式会社 Retardation plate
JP2008013759A (en) 2006-06-07 2008-01-24 Sumitomo Chemical Co Ltd Epoxy resin composition and epoxy resin cured product
JP5380058B2 (en) 2008-11-28 2014-01-08 富士フイルム株式会社 Imprint material and imprint method
JP5620129B2 (en) 2009-03-19 2014-11-05 富士フイルム株式会社 Optical film, retardation plate, elliptically polarizing plate, liquid crystal display device, and compound
JP5479175B2 (en) 2009-12-07 2014-04-23 富士フイルム株式会社 Method for producing alizarin derivative compound, novel alizarin derivative compound, surface modification method, photoelectric conversion film, photoelectric conversion element, and electrophotographic photoreceptor
JP5392178B2 (en) 2010-05-13 2014-01-22 日立化成株式会社 High thermal conductive composite particles and heat dissipation material using the same
JP2012067225A (en) 2010-09-24 2012-04-05 Hitachi Chemical Co Ltd Method of producing cured material of resin sheet, cured material of resin sheet, metal foil with resin, metal substrate, led substrate and power module
WO2012098735A1 (en) * 2011-01-19 2012-07-26 日立化成工業株式会社 Liquid crystal resin composition, heat dissipation material precursor, and heat dissipation material
WO2013081061A1 (en) 2011-11-29 2013-06-06 三菱化学株式会社 Aggregated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said composition
JP6102082B2 (en) 2012-04-26 2017-03-29 日立化成株式会社 Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, resin sheet, prepreg, laminate, metal substrate, and printed wiring board
CN105308125B (en) * 2013-06-14 2017-12-19 三菱电机株式会社 Compositions of thermosetting resin, the manufacture method of heat conductive sheet and power module
JP2015052710A (en) 2013-09-06 2015-03-19 富士フイルム株式会社 Polarizing plate and manufacturing method of the same
US9745499B2 (en) * 2013-09-06 2017-08-29 Korea Advanced Institute Of Science And Technology Hexagonal boron nitride nanosheet/ceramic nanocomposite powder and producing method of the same, and hexagonal boron nitride nanosheet/ceramic nanocomposite materials and producing method of the same
JP2016135729A (en) 2014-02-05 2016-07-28 三菱化学株式会社 Boron nitride aggregated particle, and method for producing the same, composition containing the same, and molding containing the same
JP6632807B2 (en) * 2014-03-31 2020-01-22 大阪瓦斯株式会社 Dispersant for boron nitride
TWI658091B (en) * 2014-05-09 2019-05-01 日商捷恩智股份有限公司 Heat dissipation member, electronic device
JP6602062B2 (en) * 2015-06-17 2019-11-06 東京応化工業株式会社 Curable composition, method for producing cured product, and hard coat material

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020036933A (en) * 2000-11-11 2002-05-17 정광춘 Coated aluminium nitride with organo-surface treating agent for thermally conductive paste and its manufacturing method
JP2009221039A (en) * 2008-03-14 2009-10-01 Shin Kobe Electric Mach Co Ltd Inorganic nitride particle and resin composition mixed with the same
WO2016084873A1 (en) * 2014-11-27 2016-06-02 富士フイルム株式会社 Surface-modified inorganic material, method for producing surface-modified inorganic material, method for modifying inorganic material surface using organic material, heat-dissipating material, heat-conducting material, and lubricant
US20170190885A1 (en) * 2015-12-30 2017-07-06 Saint-Gobain Ceramics & Plastics, Inc. Modified nitride particles, oligomer functionalized nitride particles, polymer based composites and methods of forming thereof
WO2017131005A1 (en) * 2016-01-26 2017-08-03 富士フイルム株式会社 Surface-modified inorganic substance and production method therefor, resin composition, thermally-conductive material, and device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019013343A1 *

Also Published As

Publication number Publication date
KR102252723B1 (en) 2021-05-17
JPWO2019013343A1 (en) 2020-04-16
KR20200014813A (en) 2020-02-11
US20200140275A1 (en) 2020-05-07
WO2019013343A1 (en) 2019-01-17
US11945717B2 (en) 2024-04-02
JP6876800B2 (en) 2021-05-26
CN110799454A (en) 2020-02-14
CN110799454B (en) 2022-12-30
EP3653574B1 (en) 2021-01-06
EP3653574A1 (en) 2020-05-20

Similar Documents

Publication Publication Date Title
EP3653573A4 (en) Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer
EP3653574A4 (en) Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer
EP3587399A4 (en) Compound, light-emitting material and light-emitting element
EP3653575A4 (en) Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer
EP3653572A4 (en) Surface-modified inorganic nitride, composition, thermally conductive material, device provided with thermally conductive layer
EP3489305A4 (en) Thermally conductive polysiloxane composition
EP3585707A4 (en) Thermally insulating packaging
EP3303252A4 (en) Thermally insulating material
EP3551721A4 (en) Organic electroluminescent material and organic electroluminescent device comprising the same
EP3119767A4 (en) Electron buffering material and organic electroluminescent device comprising the same
EP3403279A4 (en) Multiple-chip package with multiple thermal interface materials
EP3112439A4 (en) Luminescent material, organic luminescent element, and compound
EP3176220A4 (en) Thermally conductive silicone composition, and thermally conductive silicone moudled article
EP3489306A4 (en) Thermally conductive polyorganosiloxane composition
EP3561023A4 (en) Luminescent material, compound, and organic luminescent element
EP3575365A4 (en) Thermally conductive polyorganosiloxane composition
EP3336424A4 (en) Building material with integrated light-emitting device
EP3755515A4 (en) Thermally conductive polymer composition
EP3502200A4 (en) Composition for forming water-repellent film, water-repellent film, and water-repellent-film-attached substrate and article
EP3432316A4 (en) Insulating resin material, metal-layer-attached insulating resin material using same, and wiring substrate
EP3458457A4 (en) Organic electroluminescent compound, organic electroluminescent material and organic electroluminescent device comprising the same
EP3632987A4 (en) Thermally conductive polysiloxane composition
EP3653660A4 (en) Thermally conductive material, device provided with thermally conductive layer, thermally conductive material formation composition, disc-shaped liquid crystal compound
EP3511321A4 (en) Organic light-emitting element, and light-emitting material and compound for use therein
EP3534424A4 (en) Organic electroluminescence element and material for organic electroluminescence

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20200107

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

A4 Supplementary search report drawn up and despatched

Effective date: 20200602

RIC1 Information provided on ipc code assigned before grant

Ipc: C09C 3/08 20060101ALI20200526BHEP

Ipc: C01B 21/064 20060101AFI20200526BHEP

Ipc: C09K 5/14 20060101ALI20200526BHEP

Ipc: C09C 1/00 20060101ALI20200526BHEP

Ipc: C01B 21/072 20060101ALI20200526BHEP

Ipc: C08F 2/44 20060101ALI20200526BHEP

Ipc: C08G 59/50 20060101ALI20200526BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
INTG Intention to grant announced

Effective date: 20200904

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1352160

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210115

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602018011696

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

RAP4 Party data changed (patent owner data changed or rights of a patent transferred)

Owner name: FUJIFILM CORPORATION

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210106

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1352160

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210106

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210406

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210407

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210406

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210506

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210506

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602018011696

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

26N No opposition filed

Effective date: 20211007

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20210731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210506

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210713

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210713

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210731

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20220713

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220713

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230515

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210206

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20180713

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210106

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240529

Year of fee payment: 7