JP2020161808A5 - - Google Patents

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Publication number
JP2020161808A5
JP2020161808A5 JP2020030713A JP2020030713A JP2020161808A5 JP 2020161808 A5 JP2020161808 A5 JP 2020161808A5 JP 2020030713 A JP2020030713 A JP 2020030713A JP 2020030713 A JP2020030713 A JP 2020030713A JP 2020161808 A5 JP2020161808 A5 JP 2020161808A5
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JP
Japan
Prior art keywords
substrate
heating
processing apparatus
space
substrate support
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JP2020030713A
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English (en)
Japanese (ja)
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JP6995902B2 (ja
JP2020161808A (ja
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Priority to KR1020200032614A priority Critical patent/KR102375496B1/ko
Priority to US16/821,272 priority patent/US11538716B2/en
Priority to TW109109105A priority patent/TWI770478B/zh
Publication of JP2020161808A publication Critical patent/JP2020161808A/ja
Publication of JP2020161808A5 publication Critical patent/JP2020161808A5/ja
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Publication of JP6995902B2 publication Critical patent/JP6995902B2/ja
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JP2020030713A 2019-03-22 2020-02-26 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム Active JP6995902B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200032614A KR102375496B1 (ko) 2019-03-22 2020-03-17 기판 처리 장치 및 반도체 장치의 제조 방법, 그리고 기판 처리 프로그램
US16/821,272 US11538716B2 (en) 2019-03-22 2020-03-17 Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
TW109109105A TWI770478B (zh) 2019-03-22 2020-03-19 基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019055549 2019-03-22
JP2019055549 2019-03-22

Publications (3)

Publication Number Publication Date
JP2020161808A JP2020161808A (ja) 2020-10-01
JP2020161808A5 true JP2020161808A5 (enExample) 2020-11-12
JP6995902B2 JP6995902B2 (ja) 2022-01-17

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ID=72564078

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020030713A Active JP6995902B2 (ja) 2019-03-22 2020-02-26 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム

Country Status (3)

Country Link
JP (1) JP6995902B2 (enExample)
CN (1) CN111725094B (enExample)
TW (1) TWI770478B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706037B (zh) * 2021-08-10 2025-12-12 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆对齐装置
KR20240043805A (ko) * 2021-09-22 2024-04-03 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램
CN117913005B (zh) * 2024-01-19 2025-05-02 浙江泓芯新材料股份有限公司 一种石英舟热处理装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218176A (ja) * 1992-02-07 1993-08-27 Tokyo Electron Tohoku Kk 熱処理方法及び被処理体の移載方法
JP3440685B2 (ja) * 1996-04-11 2003-08-25 ソニー株式会社 ウエハ処理装置および処理方法
JP2001250781A (ja) 2000-03-06 2001-09-14 Hitachi Kokusai Electric Inc 半導体製造装置
JP2003100736A (ja) 2001-09-26 2003-04-04 Hitachi Kokusai Electric Inc 基板処理装置
JP2013197232A (ja) * 2012-03-19 2013-09-30 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法、半導体装置の製造方法及び半導体装置の製造方法を実行させるためのプログラムを記録した記録媒体。
JP5792390B2 (ja) * 2012-07-30 2015-10-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
JP2014232816A (ja) * 2013-05-29 2014-12-11 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および基板処理方法
KR101685095B1 (ko) * 2015-04-16 2016-12-09 주식회사 유진테크 기판 버퍼링 장치, 기판처리설비, 및 기판처리방법
JP6446563B2 (ja) * 2015-09-30 2018-12-26 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
JP6568127B2 (ja) * 2017-03-02 2019-08-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、プログラム及び記録媒体

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