JP6995902B2 - 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム - Google Patents

基板処理装置及び半導体装置の製造方法並びに基板処理プログラム Download PDF

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Publication number
JP6995902B2
JP6995902B2 JP2020030713A JP2020030713A JP6995902B2 JP 6995902 B2 JP6995902 B2 JP 6995902B2 JP 2020030713 A JP2020030713 A JP 2020030713A JP 2020030713 A JP2020030713 A JP 2020030713A JP 6995902 B2 JP6995902 B2 JP 6995902B2
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Prior art keywords
substrate
heating
processing
chamber
processing chamber
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JP2020030713A
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English (en)
Japanese (ja)
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JP2020161808A5 (enExample
JP2020161808A (ja
Inventor
智哉 松井
秀人 立野
誠 平野
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Kokusai Electric Corp
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Kokusai Electric Corp
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Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Priority to KR1020200032614A priority Critical patent/KR102375496B1/ko
Priority to US16/821,272 priority patent/US11538716B2/en
Priority to TW109109105A priority patent/TWI770478B/zh
Publication of JP2020161808A publication Critical patent/JP2020161808A/ja
Publication of JP2020161808A5 publication Critical patent/JP2020161808A5/ja
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Publication of JP6995902B2 publication Critical patent/JP6995902B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Formation Of Insulating Films (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Photovoltaic Devices (AREA)
JP2020030713A 2019-03-22 2020-02-26 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム Active JP6995902B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020200032614A KR102375496B1 (ko) 2019-03-22 2020-03-17 기판 처리 장치 및 반도체 장치의 제조 방법, 그리고 기판 처리 프로그램
US16/821,272 US11538716B2 (en) 2019-03-22 2020-03-17 Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
TW109109105A TWI770478B (zh) 2019-03-22 2020-03-19 基板處理裝置、半導體裝置之製造方法、記錄媒體及基板處理程式

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019055549 2019-03-22
JP2019055549 2019-03-22

Publications (3)

Publication Number Publication Date
JP2020161808A JP2020161808A (ja) 2020-10-01
JP2020161808A5 JP2020161808A5 (enExample) 2020-11-12
JP6995902B2 true JP6995902B2 (ja) 2022-01-17

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JP2020030713A Active JP6995902B2 (ja) 2019-03-22 2020-02-26 基板処理装置及び半導体装置の製造方法並びに基板処理プログラム

Country Status (3)

Country Link
JP (1) JP6995902B2 (enExample)
CN (1) CN111725094B (enExample)
TW (1) TWI770478B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115706037B (zh) * 2021-08-10 2025-12-12 北京北方华创微电子装备有限公司 半导体工艺设备及其晶圆对齐装置
KR20240043805A (ko) * 2021-09-22 2024-04-03 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 반도체 장치의 제조 방법, 기판 처리 방법 및 프로그램
CN117913005B (zh) * 2024-01-19 2025-05-02 浙江泓芯新材料股份有限公司 一种石英舟热处理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250781A (ja) 2000-03-06 2001-09-14 Hitachi Kokusai Electric Inc 半導体製造装置
JP2003100736A (ja) 2001-09-26 2003-04-04 Hitachi Kokusai Electric Inc 基板処理装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05218176A (ja) * 1992-02-07 1993-08-27 Tokyo Electron Tohoku Kk 熱処理方法及び被処理体の移載方法
JP3440685B2 (ja) * 1996-04-11 2003-08-25 ソニー株式会社 ウエハ処理装置および処理方法
JP2013197232A (ja) * 2012-03-19 2013-09-30 Hitachi Kokusai Electric Inc 基板処理装置、基板処理方法、半導体装置の製造方法及び半導体装置の製造方法を実行させるためのプログラムを記録した記録媒体。
JP5792390B2 (ja) * 2012-07-30 2015-10-14 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
JP2014232816A (ja) * 2013-05-29 2014-12-11 株式会社日立国際電気 基板処理装置、半導体装置の製造方法および基板処理方法
KR101685095B1 (ko) * 2015-04-16 2016-12-09 주식회사 유진테크 기판 버퍼링 장치, 기판처리설비, 및 기판처리방법
JP6446563B2 (ja) * 2015-09-30 2018-12-26 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置およびプログラム
JP6568127B2 (ja) * 2017-03-02 2019-08-28 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、プログラム及び記録媒体

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001250781A (ja) 2000-03-06 2001-09-14 Hitachi Kokusai Electric Inc 半導体製造装置
JP2003100736A (ja) 2001-09-26 2003-04-04 Hitachi Kokusai Electric Inc 基板処理装置

Also Published As

Publication number Publication date
CN111725094B (zh) 2024-04-09
CN111725094A (zh) 2020-09-29
TWI770478B (zh) 2022-07-11
JP2020161808A (ja) 2020-10-01
TW202041706A (zh) 2020-11-16

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