JP2020149997A - 圧粉磁心の製造方法 - Google Patents
圧粉磁心の製造方法 Download PDFInfo
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- H01F1/15358—Making agglomerates therefrom, e.g. by pressing
- H01F1/15366—Making agglomerates therefrom, e.g. by pressing using a binder
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- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
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- H01F3/00—Cores, Yokes, or armatures
- H01F3/08—Cores, Yokes, or armatures made from powder
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- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
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- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
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- B22—CASTING; POWDER METALLURGY
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/002—Making metallic powder or suspensions thereof amorphous or microcrystalline
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Abstract
Description
アモルファス構造又はナノ結晶構造を有する軟磁性粉末は硬いため、軟磁性粉末を圧縮成形する際に、例えば2GPa程度の超高圧でプレス成形する必要がある。また、超高圧でのプレス成形によって、圧粉磁心に歪が残留するため、プレス成形後に歪取り焼鈍を行う必要があった。
アモルファス構造又はナノ結晶構造を有する軟磁性箔を粉砕することによって得られた軟磁性粉末を、ケースに充填する工程と、
前記ケースに充填された前記軟磁性粉末に、振動及び磁場の少なくともいずれか一方を付与し、前記軟磁性粉末を配向させる工程と、
前記ケースに硬化性樹脂を注入し、配向された前記軟磁性粉末に前記硬化性樹脂を含浸させた後、減圧脱気しながら前記硬化性樹脂を硬化させる工程と、を備えたものである。
<第1の実施形態に係る圧粉磁心の製造方法>
まず、図1、図2を参照して、第1の実施形態に係る圧粉磁心の製造方法について説明する。図1は、第1の実施形態に係る圧粉磁心の製造方法を示すフローチャートである。図2は、第1の実施形態に係る圧粉磁心の製造方法を示す模式的な断面図である。
なお、軟磁性粉末に振動及び磁場のいずれか一方を付与してもよいし、両方を付与してもよい。また、図2は、軟磁性粉末が理想的に配向した状態を模式的に示している。
まず、アモルファス軟磁性箔(日立金属製MetglasR 2605HB1M)に対し、360℃において熱処理(脆化処理)を行った。脆化処理を行った軟磁性箔を粉砕機(ホソカワミクロン社製フェザミル(登録商標))を用いて粉砕し、平均粒径500μmの軟磁性粉末を得た。当該軟磁性粉末に対し、大気雰囲気下、300℃において熱処理を行い、軟磁性粉末の表面に絶縁酸化膜を形成した。当該軟磁性粉末について、保磁力測定装置(東洋テクニカ社製VSM)を用いて保磁力を測定したところ、20A/m(0.25Oe)であった。
表面に絶縁酸化膜が形成された実施例で用いた軟磁性粉末の表面にシリコーン樹脂をコーティングした。この軟磁性粉末を1600MPa(1.6GPa)においてプレス成形した後、450℃において歪取り焼鈍を行って、圧粉磁心を作成した。
また、実施例に係る圧粉磁心では、振動を付与することによって軟磁性粉末を配向させたため、比較例よりも損失を低減させることができた。さらに、実施例に係る圧粉磁心では、熱硬化樹脂を使用することによって、比較例の10倍の強度を得ることができた。
Claims (6)
- アモルファス構造又はナノ結晶構造を有する軟磁性箔を粉砕することによって得られた軟磁性粉末を、ケースに充填する工程と、
前記ケースに充填された前記軟磁性粉末に、振動及び磁場の少なくともいずれか一方を付与し、前記軟磁性粉末を配向させる工程と、
前記ケースに硬化性樹脂を注入し、配向された前記軟磁性粉末に前記硬化性樹脂を含浸させた後、減圧脱気しながら前記硬化性樹脂を硬化させる工程と、を備えた、
圧粉磁心の製造方法。 - 前記ケースに充填する工程において、準備された前記軟磁性粉末の保磁力が800A/m以下である、
請求項1に記載の圧粉磁心の製造方法。 - 前記ケースが絶縁体からなり、かつ、製造される当該圧粉磁心が前記ケースを含む、
請求項1又は2に記載の圧粉磁心の製造方法。 - 前記ケースに充填する工程よりも前に、前記軟磁性粉末は、粉砕された後に熱処理されることによって、表面に絶縁膜が形成されている、
請求項1〜3のいずれか一項に記載の圧粉磁心の製造方法。 - 前記硬化性樹脂を硬化させる工程において、前記硬化性樹脂を含浸させた前記軟磁性粉末上にカーボンナノファイバシートを載置する、
請求項1〜4のいずれか一項に記載の圧粉磁心の製造方法。 - 製造される当該圧粉磁心が、前記カーボンナノファイバシートを含む、
請求項5に記載の圧粉磁心の製造方法。
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JP2019043615A JP7099373B2 (ja) | 2019-03-11 | 2019-03-11 | 圧粉磁心の製造方法 |
US16/785,069 US20200294702A1 (en) | 2019-03-11 | 2020-02-07 | Method for manufacturing powder magnetic core |
CN202010162668.1A CN111681866B (zh) | 2019-03-11 | 2020-03-10 | 压粉磁芯的制造方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4098433A2 (en) | 2021-05-14 | 2022-12-07 | Yoshiki Hirai | Preformed chip manufacturing apparatus, preformed chip, dust core manufacturing apparatus, dust core, preformed chip manufacturing method, and dust core manufacturing method |
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CN114203434A (zh) * | 2021-12-22 | 2022-03-18 | 浙江先丰电子科技有限公司 | 一种耗损小的制备压粉磁芯的方法及设备 |
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JP2003534656A (ja) * | 2000-05-19 | 2003-11-18 | バクームシュメルツェ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニ コマンディートゲゼルシャフト | 誘導部品とその製造方法 |
JP2014005492A (ja) * | 2012-06-22 | 2014-01-16 | Daido Steel Co Ltd | Fe基合金組成物 |
US20140132366A1 (en) * | 2012-11-13 | 2014-05-15 | Samsung Electro-Mechanics Co., Ltd. | Filter chip element and method of preparing the same |
JP2016003366A (ja) * | 2014-06-17 | 2016-01-12 | Necトーキン株式会社 | 軟磁性合金粉末並びにそれを用いた圧粉磁芯及びその製造方法 |
JP2017022148A (ja) * | 2015-07-07 | 2017-01-26 | 株式会社タムラ製作所 | 軟磁性複合材料を使用したリアクトル、リアクトルの製造方法 |
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WO2004054336A1 (ja) * | 2002-12-09 | 2004-06-24 | Noda Screen Co., Ltd. | プリント配線基板の製造方法 |
JP5364147B2 (ja) * | 2011-01-17 | 2013-12-11 | シナノケンシ株式会社 | 磁石及び磁石の製造方法 |
CN105097167B (zh) * | 2015-07-23 | 2017-05-24 | 南京航空航天大学 | 一种圆环取向非晶磁粉芯的制备方法 |
JP6885092B2 (ja) * | 2017-02-15 | 2021-06-09 | スミダコーポレーション株式会社 | コイル部品の製造方法 |
KR101936094B1 (ko) * | 2017-08-28 | 2019-01-10 | 한국세라믹기술원 | 파워 인덕터의 제조방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JP2003534656A (ja) * | 2000-05-19 | 2003-11-18 | バクームシュメルツェ ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニ コマンディートゲゼルシャフト | 誘導部品とその製造方法 |
JP2014005492A (ja) * | 2012-06-22 | 2014-01-16 | Daido Steel Co Ltd | Fe基合金組成物 |
US20140132366A1 (en) * | 2012-11-13 | 2014-05-15 | Samsung Electro-Mechanics Co., Ltd. | Filter chip element and method of preparing the same |
JP2016003366A (ja) * | 2014-06-17 | 2016-01-12 | Necトーキン株式会社 | 軟磁性合金粉末並びにそれを用いた圧粉磁芯及びその製造方法 |
JP2017022148A (ja) * | 2015-07-07 | 2017-01-26 | 株式会社タムラ製作所 | 軟磁性複合材料を使用したリアクトル、リアクトルの製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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EP4098433A2 (en) | 2021-05-14 | 2022-12-07 | Yoshiki Hirai | Preformed chip manufacturing apparatus, preformed chip, dust core manufacturing apparatus, dust core, preformed chip manufacturing method, and dust core manufacturing method |
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CN111681866B (zh) | 2022-04-08 |
US20200294702A1 (en) | 2020-09-17 |
CN111681866A (zh) | 2020-09-18 |
JP7099373B2 (ja) | 2022-07-12 |
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