JP2020114943A - 薄膜製造装置、及び薄膜製造方法 - Google Patents
薄膜製造装置、及び薄膜製造方法 Download PDFInfo
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- JP2020114943A JP2020114943A JP2020049991A JP2020049991A JP2020114943A JP 2020114943 A JP2020114943 A JP 2020114943A JP 2020049991 A JP2020049991 A JP 2020049991A JP 2020049991 A JP2020049991 A JP 2020049991A JP 2020114943 A JP2020114943 A JP 2020114943A
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- thin film
- substrate
- mist
- electrode
- film manufacturing
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- 230000005684 electric field Effects 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
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- 150000004696 coordination complex Chemical class 0.000 claims description 3
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 2
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- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 12
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/407—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
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Abstract
Description
第1の実施形態における薄膜製造装置1を用いて、ミストCVD法により基板FSに対して成膜を試みた。その際、電極24A及び電極24Bに電圧を印加しなかった。その他の条件は、実施例1と同様である。
実施例2と同様に、第2の実施形態における薄膜製造装置1を用いて、ミストデポジション法により基板FSに対して成膜を行った。その際、電極24A及び電極24Bには電圧を印加しなかった。その他の条件は、実施例2と同様である。
Claims (27)
- 薄膜の形成材料を含む溶液のミストを基板に供給し、前記基板上に薄膜を形成する薄膜製造装置であって、
前記溶液をミスト化する超音波振動子と、
前記基板の一方の面側に配置された第1の電極と第2の電極とを有し、前記第1の電極と前記第2の電極との間にプラズマを発生させるプラズマ発生部と、
前記ミストを、前記第1の電極と前記第2の電極との間を通過させて前記基板に供給するミスト供給部と、を備える薄膜製造装置。 - 請求項1に記載の薄膜製造装置であって、
前記第1の電極及び前記第2の電極はワイヤー状である薄膜製造装置。 - 薄膜の形成材料を含む溶液のミストを基板に供給し、前記基板上に薄膜を形成する薄膜製造装置であって、
前記基板の一方の面側に配置された第1の電極と第2の電極とを有し、前記第1の電極と前記第2の電極との間にプラズマを発生させるプラズマ発生部と、
前記ミストを、前記第1の電極と前記第2の電極との間を通過させて前記基板に供給するミスト供給部と、
前記ミストが通過するスリット部とを備え、
前記スリット部は、前記ミスト供給部のミスト噴出ユニットと前記基板との間に配置されている薄膜製造装置。 - 請求項3に記載の薄膜製造装置であって、
前記スリット部が前記ミスト噴出ユニットの先端部に配置されている薄膜製造装置。 - 請求項3または4に記載の薄膜製造装置であって、
前記第1の電極および前記第2の電極がワイヤー状である薄膜製造装置。 - 請求項3から5のいずれか一項に記載の薄膜製造装置であって、
前記溶液をミスト化する超音波振動子を備える薄膜製造装置。 - 請求項1から6のいずれか一項に記載の薄膜製造装置であって、
前記第1の電極及び前記第2の電極が略平行に配置されている薄膜製造装置。 - 請求項1から7のいずれか一項に記載の薄膜製造装置であって、
前記第1の電極又は前記第2の電極のうち前記基板と近い方の電極と前記基板までの距離は、前記第1の電極と前記第2の電極間の距離よりも長い薄膜製造装置。 - 請求項1から8のいずれか一項に記載の薄膜製造装置であって、
前記第1の電極及び前記第2の電極の少なくとも一方は、誘電体で覆われている薄膜製造装置。 - 請求項1から9のいずれか一項に記載の薄膜製造装置であって、
樹脂を含み、可撓性を有する前記基板を前記プラズマ発生部へ搬送する搬送部を備える薄膜製造装置。 - 請求項10に記載の薄膜製造装置であって、
前記搬送部は、外周側に前記プラズマ発生部を有する略円弧形状である薄膜製造装置。 - 請求項1から11のいずれか一項に記載の薄膜製造装置であって、
前記基板は、水平面に対して傾斜している薄膜製造装置。 - 請求項1から12のいずれか一項に記載の薄膜製造装置であって、
前記プラズマ発生部に電圧を印加する電源部を備え、
前記電源部は、1kHz以上6kHz未満の周波数で電圧を印加する薄膜製造装置。 - 請求項13に記載の薄膜製造装置であって、
前記電源部は、19kV以上の電圧を印加する薄膜製造装置。 - 請求項13又は14に記載の薄膜製造装置であって、
前記電源部は、電圧を印加することにより前記プラズマ発生部に3.8×106V/m以上の電界を生じさせる薄膜製造装置。 - 請求項1から15のいずれか一項に記載の薄膜製造装置であって、
前記溶液は、亜鉛、インジウム、錫、ガリウム、チタン、アルミニウム、鉄、コバルト、ニッケル、銅、シリコン、ハフニウム、タンタル、タングステンのいずれか1つ以上の金属塩または金属錯体を含む薄膜製造装置。 - 請求項1から15のいずれか一項に記載の薄膜製造装置であって、
前記溶液は、インジウム、亜鉛、錫、及びチタンのいずれか1つ以上を含む金属酸化物微粒子の分散液である薄膜製造装置。 - 超音波振動子によってミスト化された薄膜の形成材料を含む溶液のミストを基板に供給し、前記基板上に薄膜を形成する薄膜製造方法であって、
前記基板の一方の面側に配置された第1の電極と第2の電極との間にプラズマを発生させる工程と、
前記ミストを、前記第1の電極と前記第2の電極との間を通過させて前記基板に供給する工程とを備える薄膜製造方法。 - 請求項18に記載の薄膜製造方法であって、
前記第1の電極及び第2の電極がワイヤー状である薄膜製造方法。 - 薄膜の形成材料を含む溶液のミストを基板に供給し、前記基板上に薄膜を形成する薄膜製造方法であって、
前記基板の一方の面側に配置された第1の電極と第2の電極との間にプラズマを発生させる工程と、
前記ミストを、前記第1の電極と前記第2の電極との間を通過させて前記基板に供給させる工程と、
前記ミストを、前記工程で前記基板に供給させるミスト噴出ユニットと前記基板との間に設置されたスリット部に通過させる工程とを備える、
薄膜製造方法。 - 請求項20に記載の薄膜製造方法であって、
前記スリット部が前記ミスト噴出ユニットの先端部に配置されている薄膜製造方法。 - 請求項20または21に記載の薄膜製造方法であって、
前記第1の電極および前記第2の電極がワイヤー状である薄膜製造方法。 - 請求項20から22のいずれか一項に記載の薄膜製造方法であって、
前記溶液をミスト化する超音波振動子を備える薄膜製造方法。 - 請求項18から23のいずれか一項に記載の薄膜製造方法であって、
前記第1の電極と前記第2の電極が略平行に配置されている薄膜製造方法。 - 請求項18から24のいずれか一項に記載の薄膜製造方法であって、
前記プラズマを発生させる工程は、前記第1の電極と前記第2の電極との間に、1kHz以上6kHz未満の周波数で電圧を印加する薄膜製造方法。 - 請求項25に記載の薄膜製造方法であって、
前記プラズマを発生させる工程は、19kV以上の電圧を印加する薄膜製造方法。 - 請求項25又は26に記載の薄膜製造方法であって、
前記プラズマを発生させる工程は、電圧を印加することにより前記第1の電極と前記第2の電極との間に3.8×106V/m以上の電界を生じさせる薄膜製造方法。
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CN114798292A (zh) * | 2022-06-10 | 2022-07-29 | 杭州泛索能超声科技有限公司 | 一种适用于全方位手机壳喷涂的超声波精密喷涂设备 |
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JP2008135286A (ja) * | 2006-11-28 | 2008-06-12 | Osaka Univ | プラズマ表面処理装置 |
WO2013176222A1 (ja) * | 2012-05-24 | 2013-11-28 | 株式会社ニコン | 基板処理装置、及びデバイス製造方法 |
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JPWO2016133131A1 (ja) | 2017-11-24 |
CN111876751A (zh) | 2020-11-03 |
WO2016133131A1 (ja) | 2016-08-25 |
CN107250429B (zh) | 2020-08-14 |
CN107250429A (zh) | 2017-10-13 |
US20180066361A1 (en) | 2018-03-08 |
TW201638380A (zh) | 2016-11-01 |
TWI762439B (zh) | 2022-05-01 |
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