JP2020096161A5 - - Google Patents
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- Publication number
- JP2020096161A5 JP2020096161A5 JP2019146516A JP2019146516A JP2020096161A5 JP 2020096161 A5 JP2020096161 A5 JP 2020096161A5 JP 2019146516 A JP2019146516 A JP 2019146516A JP 2019146516 A JP2019146516 A JP 2019146516A JP 2020096161 A5 JP2020096161 A5 JP 2020096161A5
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- solution according
- nitride film
- silicon nitride
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims 3
- 239000003381 stabilizer Substances 0.000 claims 3
- 239000003513 alkali Substances 0.000 claims 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002156 mixing Methods 0.000 claims 1
- 150000007524 organic acids Chemical class 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 150000003377 silicon compounds Chemical class 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SG11202101593YA SG11202101593YA (en) | 2018-08-31 | 2019-08-30 | Etching liquid |
| TW108131445A TWI765175B (zh) | 2018-08-31 | 2019-08-30 | 蝕刻液 |
| PCT/JP2019/034193 WO2020045644A1 (ja) | 2018-08-31 | 2019-08-30 | エッチング液 |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018162917 | 2018-08-31 | ||
| JP2018162917 | 2018-08-31 | ||
| JP2018225074 | 2018-11-30 | ||
| JP2018225074 | 2018-11-30 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020096161A JP2020096161A (ja) | 2020-06-18 |
| JP2020096161A5 true JP2020096161A5 (enExample) | 2021-06-10 |
| JP7096800B2 JP7096800B2 (ja) | 2022-07-06 |
Family
ID=71085068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019146516A Active JP7096800B2 (ja) | 2018-08-31 | 2019-08-08 | エッチング液 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7096800B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102325905B1 (ko) * | 2021-03-22 | 2021-11-12 | 연세대학교 산학협력단 | 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3467411B2 (ja) * | 1998-08-07 | 2003-11-17 | 松下電器産業株式会社 | エッチング液，その製造方法及びエッチング方法 |
| JP4586628B2 (ja) * | 2005-05-19 | 2010-11-24 | 和光純薬工業株式会社 | 半導体基板表面処理剤及び処理方法 |
| JP2012033561A (ja) * | 2010-07-28 | 2012-02-16 | Sanyo Chem Ind Ltd | 窒化ケイ素用エッチング液 |
-
2019
- 2019-08-08 JP JP2019146516A patent/JP7096800B2/ja active Active
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