JP7096800B2 - エッチング液 - Google Patents

エッチング液 Download PDF

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Publication number
JP7096800B2
JP7096800B2 JP2019146516A JP2019146516A JP7096800B2 JP 7096800 B2 JP7096800 B2 JP 7096800B2 JP 2019146516 A JP2019146516 A JP 2019146516A JP 2019146516 A JP2019146516 A JP 2019146516A JP 7096800 B2 JP7096800 B2 JP 7096800B2
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Japan
Prior art keywords
etching
mass
solution
silica
etching solution
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JP2019146516A
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Japanese (ja)
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JP2020096161A (ja
JP2020096161A5 (enExample
Inventor
陽介 木村
寛司 佐藤
翼 大山
翔太 岡崎
博昭 北山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
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Kao Corp
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Priority to PCT/JP2019/034193 priority Critical patent/WO2020045644A1/ja
Priority to SG11202101593YA priority patent/SG11202101593YA/en
Priority to TW108131445A priority patent/TWI765175B/zh
Publication of JP2020096161A publication Critical patent/JP2020096161A/ja
Publication of JP2020096161A5 publication Critical patent/JP2020096161A5/ja
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Publication of JP7096800B2 publication Critical patent/JP7096800B2/ja
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JP2019146516A 2018-08-31 2019-08-08 エッチング液 Active JP7096800B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/034193 WO2020045644A1 (ja) 2018-08-31 2019-08-30 エッチング液
SG11202101593YA SG11202101593YA (en) 2018-08-31 2019-08-30 Etching liquid
TW108131445A TWI765175B (zh) 2018-08-31 2019-08-30 蝕刻液

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2018162917 2018-08-31
JP2018162917 2018-08-31
JP2018225074 2018-11-30
JP2018225074 2018-11-30

Publications (3)

Publication Number Publication Date
JP2020096161A JP2020096161A (ja) 2020-06-18
JP2020096161A5 JP2020096161A5 (enExample) 2021-06-10
JP7096800B2 true JP7096800B2 (ja) 2022-07-06

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ID=71085068

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JP2019146516A Active JP7096800B2 (ja) 2018-08-31 2019-08-08 エッチング液

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JP (1) JP7096800B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102325905B1 (ko) * 2021-03-22 2021-11-12 연세대학교 산학협력단 실리콘 질화막 식각 조성물 및 이를 이용한 식각방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058500A (ja) 1998-08-07 2000-02-25 Matsushita Electron Corp エッチング液，その製造方法及びエッチング方法
JP2006324452A (ja) 2005-05-19 2006-11-30 Wako Pure Chem Ind Ltd 半導体基板表面処理剤及び処理方法
JP2012033561A (ja) 2010-07-28 2012-02-16 Sanyo Chem Ind Ltd 窒化ケイ素用エッチング液

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000058500A (ja) 1998-08-07 2000-02-25 Matsushita Electron Corp エッチング液，その製造方法及びエッチング方法
JP2006324452A (ja) 2005-05-19 2006-11-30 Wako Pure Chem Ind Ltd 半導体基板表面処理剤及び処理方法
JP2012033561A (ja) 2010-07-28 2012-02-16 Sanyo Chem Ind Ltd 窒化ケイ素用エッチング液

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Publication number Publication date
JP2020096161A (ja) 2020-06-18

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