JP2020092196A - 基板支持器、基板処理装置、基板処理システム、及び基板支持器における接着剤の浸食を検出する方法 - Google Patents
基板支持器、基板処理装置、基板処理システム、及び基板支持器における接着剤の浸食を検出する方法 Download PDFInfo
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Abstract
Description
Claims (15)
- 基台と、
前記基台上に設けられた静電チャックと、
前記基台の上面と前記静電チャックの下面との間に設けられた接着剤と、
を備え、
前記基台、前記接着剤、及び前記静電チャックは、前記静電チャックと該静電チャック上に載置される基板との間に伝熱ガスを供給するための供給路を提供しており、
前記基台の前記上面は、一つ以上の溝を画成しており、
前記一つ以上の溝は、前記基台の前記上面内で、該上面の中心から前記供給路よりも離れており、
前記接着剤は、前記一つ以上の溝の上端開口を覆うように設けられており、
前記一つ以上の溝には、前記供給路又は該供給路とは別の流路を介して前記伝熱ガス又は別のガスを供給可能であり、
前記一つ以上の溝の中の圧力を測定するように設けられた圧力センサを更に備える、
基板支持器。 - 前記一つ以上の溝の各々と前記接着剤との間には、前記溝の前記上端開口を覆うように保護テープが設けられており、
前記接着剤は、前記保護テープを覆っている、
請求項1に記載の基板支持器。 - 前記一つ以上の溝は、複数の溝であり、前記基台の前記上面の中心に対して放射方向に延在している、請求項1又は2に記載の基板支持器。
- 前記一つ以上の溝は、環形状を有しており、前記基台の前記上面の中心の周りで周方向に延在している、請求項1又は2に記載の基板支持器。
- 前記基台の上面は、前記供給路の一部である第1の溝及び前記一つ以上の溝である一つ以上の第2の溝を画成している、請求項1〜4の何れか一項に記載の基板支持器。
- 前記一つ以上の第2の溝は、前記第1の溝に連通している、請求項5に記載の基板支持器。
- 前記一つ以上の溝は、前記供給路から分離されている、請求項1〜4の何れか一項に記載の基板処理装置。
- チャンバと、
前記チャンバの中で基板を支持するように構成された、請求項1に記載の基板支持器と、
を備える基板処理装置。 - プラズマ処理装置である、請求項8に記載の基板処理装置。
- ガスソースと、
前記一つ以上の溝とガスソースとの間に接続されたバルブと、
前記バルブを制御するように構成された制御部と、
を更に備え、
前記制御部は、
前記ガスソースからのガスが前記一つ以上の溝に充填されている状態で、前記バルブを閉じるように、該バルブを制御し、
前記バルブが閉じられている状態で、前記一つ以上の溝の中の圧力の測定値を前記圧力センサから取得する、
ように構成されている、請求項8又は9に記載の基板処理装置。 - 前記制御部は、
前記ガスソースからのガスが前記一つ以上の溝に充填されている前記状態で、前記一つ以上の溝の中の圧力の第1の測定値を取得し、
前記バルブが閉じられている前記状態で前記圧力センサから取得される前記測定値である第2の測定値を前記第1の測定値と比較する、
ように更に構成されている、請求項10に記載の基板処理装置。 - 請求項11に記載の基板処理装置と、
その中での基板の位置を取得するように構成されたオリエンタと、
前記チャンバと前記オリエンタとの間で基板を搬送するように構成された搬送装置と、
を備え、
前記基台の上面は、前記供給路の一部である第1の溝及び前記一つ以上の溝である一つ以上の第2の溝を画成しており、前記一つ以上の第2の溝は、前記第1の溝に連通しており、
前記制御部は、
前記第1の測定値と前記第2の測定値との間の比較の結果、前記第1の溝又は前記一つ以上の第2の溝から前記ガスが漏れていると判断される場合に、前記静電チャック上に載置されている基板を、前記オリエンタに搬送するよう前記搬送装置を制御し、
前記オリエンタによって取得される該オリエンタ内での前記基板の位置に基づいて、前記基板の前記静電チャック上での配置位置のエラーが生じていたか否かを判定する、
ように更に構成されている、
基板処理システム。 - 請求項1に記載の基板支持器における接着剤の浸食を検出する方法であって、
ガスソースからのガスが前記基板支持器の前記一つ以上の溝に充填されている状態で、バルブを閉じる工程であり、該バルブは、前記一つ以上の溝とガスソースとの間に接続されている、該工程と、
前記バルブが閉じられている状態で、前記一つ以上の溝の中の圧力の測定値を前記圧力センサから取得する工程と、
を含む方法。 - 前記ガスソースからのガスが前記一つ以上の溝に充填されている前記状態で、前記一つ以上の溝の中の圧力の第1の測定値を取得する工程と、
前記バルブが閉じられている前記状態で前記圧力センサから取得される前記測定値である第2の測定値を前記第1の測定値と比較する工程と、
を更に含む、請求項13に記載の方法。 - 前記基台の上面は、前記供給路の一部である第1の溝及び前記一つ以上の溝である一つ以上の第2の溝を画成しており、前記一つ以上の第2の溝は、前記第1の溝に連通しており、該方法は、
前記第1の測定値と前記第2の測定値との間の比較の結果、前記第1の溝又は前記一つ以上の第2の溝から前記ガスが漏れていると判断される場合に、前記静電チャック上に載置されている基板をオリエンタに搬送する工程と、
前記オリエンタによって取得される該オリエンタ内での前記基板の位置に基づいて、前記基板の前記静電チャック上での配置位置のエラーが生じていたか否かを判定する工程と、
を更に含む、請求項14に記載の方法。
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JP2018229267A JP7203585B2 (ja) | 2018-12-06 | 2018-12-06 | 基板支持器、基板処理装置、基板処理システム、及び基板支持器における接着剤の浸食を検出する方法 |
US16/699,268 US11037767B2 (en) | 2018-12-06 | 2019-11-29 | Substrate support, substrate processing apparatus, substrate processing system, and method of detecting erosion of adhesive in substrate support |
TW108143634A TW202027210A (zh) | 2018-12-06 | 2019-11-29 | 基板支持器、基板處理裝置、基板處理系統、及基板支持器之接著劑的侵蝕之檢測方法 |
CN201911197829.4A CN111293068A (zh) | 2018-12-06 | 2019-11-29 | 基板支撑器、基板处理装置、基板处理系统及检测基板支撑器中的粘合剂的侵蚀的方法 |
KR1020190159184A KR20200069239A (ko) | 2018-12-06 | 2019-12-03 | 기판 지지기, 기판 처리 장치, 기판 처리 시스템, 및 기판 지지기에 있어서의 접착제의 침식을 검출하는 방법 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2022055736A1 (en) * | 2020-09-08 | 2022-03-17 | Applied Materials, Inc. | Semiconductor processing chambers for deposition and etch |
US11615966B2 (en) | 2020-07-19 | 2023-03-28 | Applied Materials, Inc. | Flowable film formation and treatments |
US11699571B2 (en) | 2020-09-08 | 2023-07-11 | Applied Materials, Inc. | Semiconductor processing chambers for deposition and etch |
Citations (5)
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US11037767B2 (en) | 2021-06-15 |
JP7203585B2 (ja) | 2023-01-13 |
TW202027210A (zh) | 2020-07-16 |
US20200185204A1 (en) | 2020-06-11 |
KR20200069239A (ko) | 2020-06-16 |
CN111293068A (zh) | 2020-06-16 |
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