JP2020065025A - 半導体装置とその製造方法 - Google Patents
半導体装置とその製造方法 Download PDFInfo
- Publication number
- JP2020065025A JP2020065025A JP2018197644A JP2018197644A JP2020065025A JP 2020065025 A JP2020065025 A JP 2020065025A JP 2018197644 A JP2018197644 A JP 2018197644A JP 2018197644 A JP2018197644 A JP 2018197644A JP 2020065025 A JP2020065025 A JP 2020065025A
- Authority
- JP
- Japan
- Prior art keywords
- region
- concentration
- guard ring
- low
- regions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims description 19
- 239000012535 impurity Substances 0.000 claims abstract description 45
- 230000002093 peripheral effect Effects 0.000 claims abstract description 40
- 230000001681 protective effect Effects 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000015556 catabolic process Effects 0.000 claims abstract description 29
- 238000002513 implantation Methods 0.000 claims description 13
- 230000005684 electric field Effects 0.000 abstract description 30
- 238000009413 insulation Methods 0.000 abstract 6
- 210000000746 body region Anatomy 0.000 description 38
- 239000010410 layer Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 14
- 238000009826 distribution Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 4
- 238000005468 ion implantation Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0638—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for preventing surface leakage due to surface inversion layer, e.g. with channel stopper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02293—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process formation of epitaxial layers by a deposition process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/1095—Body region, i.e. base region, of DMOS transistors or IGBTs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
Description
12 :半導体基板
20 :素子領域
22 :ソース領域
24 :ボディ領域
24a :低濃度領域
24b :高濃度領域
30 :ゲート電極
34 :ソースコンタクト電極
36 :ボディコンタクト電極
38 :主電極
40 :周辺耐圧領域
42〜46 :ガードリング領域
42a〜46a :低濃度領域
42b〜46b :高濃度領域
48 :ドリフト領域
50 :ドレイン領域
52 :絶縁酸化膜
54 :表面絶縁膜
Claims (6)
- 半導体装置であって、半導体基板と、絶縁保護膜と、上部電極と、下部電極を有しており、
前記半導体基板が、素子領域と、前記素子領域の周囲に配置されている周辺耐圧領域を有しており、
前記上部電極が、前記素子領域の上部に配置されており、
前記絶縁保護膜が、前記周辺耐圧領域の上部に配置されており、
前記下部電極が、前記半導体基板の下部に配置されており、
前記素子領域が、前記上部電極と前記下部電極の間に電流を流すことが可能な素子を有しており、
前記周辺耐圧領域が、複数のp型のガードリング領域と、前記複数のガードリング領域を互いから分離しているn型のドリフト領域を有しており、
前記各ガードリング領域が、前記絶縁保護膜に接しているガードリング低濃度領域と、ガードリング高濃度領域を有しており、
前記ガードリング高濃度領域が、前記ガードリング低濃度領域のp型不純物濃度の10倍以上のp型不純物濃度を有し、前記ガードリング低濃度領域の下側に配置されており、前記ガードリング低濃度領域によって前記絶縁保護膜から分離されている、
半導体装置。 - 前記素子領域が、前記上部電極に接する素子p型領域を有し、
前記ドリフト領域が、前記素子領域内まで分布しており、前記素子領域内において前記素子p型領域に対して下側から接しており、
前記素子p型領域が、前記上部電極に接する素子低濃度領域と、前記素子低濃度領域と前記ドリフト領域の間に配置されているとともに前記素子低濃度領域のp型不純物濃度の10倍以上のp型不純物濃度を有する素子高濃度領域を有している、
請求項1の半導体装置。 - 前記素子低濃度領域の厚みが、前記ガードリング低濃度領域の厚みと略等しい、請求項2の半導体装置。
- 前記素子高濃度領域の厚みが、前記ガードリング高濃度領域の厚みと略等しい、請求項2または3の半導体装置。
- 請求項1〜4のいずれか一項の半導体装置の製造方法であって、
p型不純物注入またはエピタキシャル成長によって前記ガードリング高濃度領域を形成する工程と、
p型不純物注入またはエピタキシャル成長によって前記ガードリング低濃度領域を形成する工程、
を有する製造方法。 - 請求項2〜4のいずれか一項の半導体装置の製造方法であって、
p型不純物注入またはエピタキシャル成長によって前記ガードリング高濃度領域と前記素子高濃度領域を形成する工程と、
p型不純物注入またはエピタキシャル成長によって前記ガードリング低濃度領域と前記素子低濃度領域を形成する工程、
を有する製造方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018197644A JP7103154B2 (ja) | 2018-10-19 | 2018-10-19 | 半導体装置とその製造方法 |
CN201910981835.2A CN111162116A (zh) | 2018-10-19 | 2019-10-16 | 半导体装置及其制造方法 |
US16/654,181 US11195906B2 (en) | 2018-10-19 | 2019-10-16 | Semiconductor device to suppress electric field concentration on insulating protection film |
DE102019128039.7A DE102019128039A1 (de) | 2018-10-19 | 2019-10-17 | Halbleitervorrichtung und Verfahren zur Herstellung der selbigen |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018197644A JP7103154B2 (ja) | 2018-10-19 | 2018-10-19 | 半導体装置とその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020065025A true JP2020065025A (ja) | 2020-04-23 |
JP7103154B2 JP7103154B2 (ja) | 2022-07-20 |
Family
ID=70279683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018197644A Active JP7103154B2 (ja) | 2018-10-19 | 2018-10-19 | 半導体装置とその製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US11195906B2 (ja) |
JP (1) | JP7103154B2 (ja) |
CN (1) | CN111162116A (ja) |
DE (1) | DE102019128039A1 (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203967A (ja) * | 2000-10-23 | 2002-07-19 | Matsushita Electric Ind Co Ltd | 半導体素子 |
JP2008159927A (ja) * | 2006-12-25 | 2008-07-10 | Toyota Motor Corp | Iii族窒化物半導体装置とその製造方法 |
JP2008210848A (ja) * | 2007-02-23 | 2008-09-11 | Denso Corp | 炭化珪素半導体装置の製造方法 |
JP2009295641A (ja) * | 2008-06-02 | 2009-12-17 | Sanken Electric Co Ltd | 電界効果半導体装置及びその製造方法 |
JP2014138182A (ja) * | 2013-01-18 | 2014-07-28 | Hitachi Power Semiconductor Device Ltd | ダイオード、電力変換装置 |
JP2016111129A (ja) * | 2014-12-04 | 2016-06-20 | ローム株式会社 | 半導体装置 |
JP2018117017A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社デンソー | 炭化珪素半導体装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3908572B2 (ja) * | 2002-03-18 | 2007-04-25 | 株式会社東芝 | 半導体素子 |
JP2013168549A (ja) | 2012-02-16 | 2013-08-29 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
JP5812029B2 (ja) * | 2012-06-13 | 2015-11-11 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
CN104838500B (zh) * | 2012-12-04 | 2017-08-15 | 株式会社电装 | 半导体装置及其制造方法 |
JP2016201448A (ja) * | 2015-04-09 | 2016-12-01 | トヨタ自動車株式会社 | ダイオード及びダイオードの製造方法 |
JP6299789B2 (ja) * | 2016-03-09 | 2018-03-28 | トヨタ自動車株式会社 | スイッチング素子 |
JP2018067690A (ja) * | 2016-10-21 | 2018-04-26 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
-
2018
- 2018-10-19 JP JP2018197644A patent/JP7103154B2/ja active Active
-
2019
- 2019-10-16 CN CN201910981835.2A patent/CN111162116A/zh active Pending
- 2019-10-16 US US16/654,181 patent/US11195906B2/en active Active
- 2019-10-17 DE DE102019128039.7A patent/DE102019128039A1/de active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002203967A (ja) * | 2000-10-23 | 2002-07-19 | Matsushita Electric Ind Co Ltd | 半導体素子 |
JP2008159927A (ja) * | 2006-12-25 | 2008-07-10 | Toyota Motor Corp | Iii族窒化物半導体装置とその製造方法 |
JP2008210848A (ja) * | 2007-02-23 | 2008-09-11 | Denso Corp | 炭化珪素半導体装置の製造方法 |
JP2009295641A (ja) * | 2008-06-02 | 2009-12-17 | Sanken Electric Co Ltd | 電界効果半導体装置及びその製造方法 |
JP2014138182A (ja) * | 2013-01-18 | 2014-07-28 | Hitachi Power Semiconductor Device Ltd | ダイオード、電力変換装置 |
JP2016111129A (ja) * | 2014-12-04 | 2016-06-20 | ローム株式会社 | 半導体装置 |
JP2018117017A (ja) * | 2017-01-17 | 2018-07-26 | 株式会社デンソー | 炭化珪素半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP7103154B2 (ja) | 2022-07-20 |
US11195906B2 (en) | 2021-12-07 |
US20200127086A1 (en) | 2020-04-23 |
DE102019128039A1 (de) | 2020-04-23 |
CN111162116A (zh) | 2020-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6266166B2 (ja) | 炭化珪素半導体装置およびその製造方法 | |
US9825166B2 (en) | Silicon carbide semiconductor device and method for producing same | |
US9825164B2 (en) | Silicon carbide semiconductor device and manufacturing method for same | |
US10276654B2 (en) | Semiconductor device with parallel PN structures | |
JP5795452B1 (ja) | 炭化ケイ素半導体装置、炭化ケイ素半導体装置の製造方法及び炭化ケイ素半導体装置の設計方法 | |
WO2017098547A1 (ja) | 炭化珪素半導体装置 | |
KR20190039869A (ko) | 질화물 반도체 장치 및 질화물 반도체 장치의 제조 방법 | |
WO2017159034A1 (ja) | 半導体装置 | |
JP7090073B2 (ja) | 半導体装置 | |
JP2017191817A (ja) | スイッチング素子の製造方法 | |
JP2019176104A (ja) | スイッチング素子 | |
JP2022100379A (ja) | 半導体装置とその製造方法 | |
JP2010135526A (ja) | 半導体装置 | |
JP7103154B2 (ja) | 半導体装置とその製造方法 | |
JP5833274B1 (ja) | 炭化ケイ素半導体装置、炭化ケイ素半導体装置の製造方法及び炭化ケイ素半導体装置の設計方法 | |
JP2014204067A (ja) | 半導体装置およびその製造方法 | |
JP2020096080A (ja) | 半導体装置の製造方法 | |
JP6606819B2 (ja) | 半導体装置 | |
JP4128117B2 (ja) | 半導体装置 | |
WO2024084778A1 (ja) | 半導体装置とその製造方法 | |
JP2019040960A (ja) | 窒化物半導体装置 | |
US20230307493A1 (en) | Semiconductor device | |
JP2009043795A (ja) | 半導体装置 | |
JP2016162783A (ja) | 半導体装置 | |
JP2020087956A (ja) | スイッチング素子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20200401 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210415 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220216 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220329 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20220512 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20220607 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20220620 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 7103154 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |