JP2020064998A - 実装基板およびその製造方法 - Google Patents

実装基板およびその製造方法 Download PDF

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Publication number
JP2020064998A
JP2020064998A JP2018196536A JP2018196536A JP2020064998A JP 2020064998 A JP2020064998 A JP 2020064998A JP 2018196536 A JP2018196536 A JP 2018196536A JP 2018196536 A JP2018196536 A JP 2018196536A JP 2020064998 A JP2020064998 A JP 2020064998A
Authority
JP
Japan
Prior art keywords
land
printed wiring
wiring board
mounting
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018196536A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020064998A5 (enExample
Inventor
大 内藤
Dai Naito
大 内藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2018196536A priority Critical patent/JP2020064998A/ja
Priority to US16/601,046 priority patent/US10834819B2/en
Publication of JP2020064998A publication Critical patent/JP2020064998A/ja
Publication of JP2020064998A5 publication Critical patent/JP2020064998A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/099—Coating over pads, e.g. solder resist partly over pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
JP2018196536A 2018-10-18 2018-10-18 実装基板およびその製造方法 Pending JP2020064998A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018196536A JP2020064998A (ja) 2018-10-18 2018-10-18 実装基板およびその製造方法
US16/601,046 US10834819B2 (en) 2018-10-18 2019-10-14 Printed circuit board and its manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018196536A JP2020064998A (ja) 2018-10-18 2018-10-18 実装基板およびその製造方法

Publications (2)

Publication Number Publication Date
JP2020064998A true JP2020064998A (ja) 2020-04-23
JP2020064998A5 JP2020064998A5 (enExample) 2021-09-30

Family

ID=70280164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018196536A Pending JP2020064998A (ja) 2018-10-18 2018-10-18 実装基板およびその製造方法

Country Status (2)

Country Link
US (1) US10834819B2 (enExample)
JP (1) JP2020064998A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023101235A (ja) * 2022-01-07 2023-07-20 キヤノン株式会社 電子モジュール、装置及び電子モジュールの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018014385A (ja) * 2016-07-20 2018-01-25 キヤノン株式会社 基板及び画像形成装置
JP2018029180A (ja) * 2012-06-22 2018-02-22 株式会社ニコン 撮像ユニット、撮像装置、基板、および電子機器
JP2018137301A (ja) * 2017-02-21 2018-08-30 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、および電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6316736B1 (en) * 1998-06-08 2001-11-13 Visteon Global Technologies, Inc. Anti-bridging solder ball collection zones
JP4108643B2 (ja) * 2004-05-12 2008-06-25 日本電気株式会社 配線基板及びそれを用いた半導体パッケージ
JP4105148B2 (ja) * 2004-12-10 2008-06-25 株式会社ケーヒン プリント基板
JP2016062768A (ja) 2014-09-18 2016-04-25 積水化学工業株式会社 接続構造体の製造方法及び接続構造体
US10090358B2 (en) * 2015-08-11 2018-10-02 Apple Inc. Camera module in a unibody circuit carrier with component embedding
JP6909953B2 (ja) * 2015-12-25 2021-07-28 パナソニックＩｐマネジメント株式会社 ペースト状熱硬化性樹脂組成物、半導体部品、半導体実装品、半導体部品の製造方法、半導体実装品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018029180A (ja) * 2012-06-22 2018-02-22 株式会社ニコン 撮像ユニット、撮像装置、基板、および電子機器
JP2018014385A (ja) * 2016-07-20 2018-01-25 キヤノン株式会社 基板及び画像形成装置
JP2018137301A (ja) * 2017-02-21 2018-08-30 キヤノン株式会社 プリント回路板の製造方法、プリント回路板、および電子機器

Also Published As

Publication number Publication date
US10834819B2 (en) 2020-11-10
US20200128668A1 (en) 2020-04-23

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