JP2020057786A - 半導体製造装置用部材 - Google Patents
半導体製造装置用部材 Download PDFInfo
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Abstract
Description
上面にウエハ載置面を有し、電極を内蔵するセラミックプレートと、
前記セラミックプレートの下面側に配設され、リング状の接合部で前記セラミックプレートとセラミック接合されたセラミック製の緻密質プラグと、
前記接合部以外の部分で前記セラミックプレートの下面に接合された金属製の冷却プレートと、
前記セラミックプレートを厚み方向に貫通するガス放出孔と、前記緻密質プラグの上面側と下面側とを屈曲しながら貫通し、前記ガス放出孔と連通するガス内部流路と、を有し、前記接合部の内周よりも内側を通る、ガス流路と、
を備えた半導体製造装置用部材。
Claims (7)
- 上面にウエハ載置面を有し、電極を内蔵するセラミックプレートと、
前記セラミックプレートの下面側に配設され、リング状の接合部で前記セラミックプレートとセラミック接合されたセラミック製の緻密質プラグと、
前記接合部以外の部分で前記セラミックプレートの下面に接合された金属製の冷却プレートと、
前記セラミックプレートを厚み方向に貫通するガス放出孔と、前記緻密質プラグの上面側と下面側とを屈曲しながら貫通し、前記ガス放出孔と連通するガス内部流路と、を有し、前記接合部の内周よりも内側を通る、ガス流路と、
を備えた半導体製造装置用部材。 - 前記接合部は、セラミック焼結体である、請求項1に記載の半導体製造装置用部材。
- 前記緻密質プラグの上面には、前記ガス放出孔及び前記ガス内部流路に連通し前記ガス内部流路よりも開口の大きい凹部が設けられている、
請求項1又は2に記載の半導体製造装置用部材。 - 前記ガス放出孔は、複数のガス細孔で構成され、
前記凹部は、前記複数のガス細孔と連通している、
請求項3に記載の半導体製造装置用部材。 - 前記ガス内部流路は、螺旋状またはジグザグ状の通路である、
請求項1〜4のいずれか1項に記載の半導体製造装置用部材。 - 前記緻密質プラグは、前記ガス内部流路を有する柱状のプラグ本体と、前記プラグ本体から下方に突出した筒状のスカート部とを有する、
請求項1〜5のいずれか1項に記載の半導体製造装置用部材。 - 前記冷却プレートは、上面に開口する筒状穴を有し、
前記緻密質プラグの少なくとも一部は、前記筒状穴内に配設されている、
請求項1〜6のいずれか1項に記載の半導体製造装置用部材。
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JP2022106181A (ja) * | 2021-01-06 | 2022-07-19 | 日本碍子株式会社 | 半導体製造装置用部材及びその製法 |
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WO2024004147A1 (ja) * | 2022-06-30 | 2024-01-04 | 日本碍子株式会社 | 半導体製造装置用部材 |
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JP7514815B2 (ja) * | 2021-12-22 | 2024-07-11 | 日本碍子株式会社 | 半導体製造装置用部材 |
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TW202025371A (zh) | 2020-07-01 |
CN110970327A (zh) | 2020-04-07 |
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