JP7382978B2 - 半導体製造装置用部材及びプラグ - Google Patents
半導体製造装置用部材及びプラグ Download PDFInfo
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- JP7382978B2 JP7382978B2 JP2021016385A JP2021016385A JP7382978B2 JP 7382978 B2 JP7382978 B2 JP 7382978B2 JP 2021016385 A JP2021016385 A JP 2021016385A JP 2021016385 A JP2021016385 A JP 2021016385A JP 7382978 B2 JP7382978 B2 JP 7382978B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 52
- 239000004065 semiconductor Substances 0.000 title claims description 47
- 239000000919 ceramic Substances 0.000 claims description 70
- 238000001816 cooling Methods 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000007789 gas Substances 0.000 description 155
- 238000003780 insertion Methods 0.000 description 50
- 230000037431 insertion Effects 0.000 description 50
- 239000000853 adhesive Substances 0.000 description 23
- 230000001070 adhesive effect Effects 0.000 description 23
- 239000011148 porous material Substances 0.000 description 20
- 239000000463 material Substances 0.000 description 12
- 230000015556 catabolic process Effects 0.000 description 11
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000003507 refrigerant Substances 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000003349 gelling agent Substances 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/458—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for supporting substrates in the reaction chamber
- C23C16/4582—Rigid and flat substrates, e.g. plates or discs
- C23C16/4583—Rigid and flat substrates, e.g. plates or discs the substrate being supported substantially horizontally
- C23C16/4586—Elements in the interior of the support, e.g. electrodes, heating or cooling devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
- C23C16/463—Cooling of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
- H01J37/32724—Temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Glass Compositions (AREA)
- Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
- Drying Of Semiconductors (AREA)
Description
上面にウエハ載置面を有し、電極を内蔵するセラミックプレートと、
前記セラミックプレートの下面側に設けられ、緻密質の本体部と、屈曲しながら前記本体部を厚み方向に貫通するガス流路部と、を有するプラグと、
前記セラミックプレートを厚み方向に貫通し、前記ガス流路部の上方に連通するガス放出孔と、
前記セラミックプレートの下面に接合され、前記ガス流路部の下方からガスを供給するガス供給通路を有する金属製の冷却プレートと、
を備え、
前記ガス流路部の全長のうちの少なくとも一部の区間が絶縁性かつ通気性の多孔質である、
ものである。
緻密質の本体部と、屈曲しながら前記本体部を厚み方向に貫通するガス流路部と、を有するプラグであって、
前記ガス流路部の全長のうちの少なくとも一部の区間が絶縁性かつ通気性の多孔質である、
ものである。
Claims (7)
- 上面にウエハ載置面を有し、電極を内蔵するセラミックプレートと、
前記セラミックプレートの下面側に設けられ、緻密質の本体部と、屈曲しながら前記本体部を厚み方向に貫通するガス流路部と、を有するプラグと、
前記セラミックプレートを厚み方向に貫通し、前記ガス流路部の上方に連通するガス放出孔と、
前記セラミックプレートの下面に接合され、前記ガス流路部の下方からガスを供給するガス供給通路を有する金属製の冷却プレートと、
を備え、
前記ガス流路部の全長のうちの少なくとも一部の区間が絶縁性かつ通気性の多孔質である、
半導体製造装置用部材。 - 前記ガス流路部の全長のうちの少なくとも一部の区間は、気孔率が10%以上50%以下の前記多孔質である、
請求項1に記載の半導体製造装置用部材。 - 前記ガス流路部の全長のうちの30%以上の区間は、前記多孔質である、
請求項1又は2に記載の半導体製造装置用部材。 - 前記ガス流路部は、螺旋状に形成されている、
請求項1~3のいずれか1項に記載の半導体製造装置用部材。 - 前記プラグは、上面に向かって徐々に径が狭まるテーパ部を有し、
前記電極は、前記セラミックプレートの内部のうち前記テーパ部と交差する面に設けられ、前記プラグを貫通させるための貫通穴を有している、
請求項1~4のいずれか1項に記載の半導体製造装置用部材。 - 前記プラグは、下側の径が狭まる段差を側面に有している、
請求項1~5のいずれか1項に記載の半導体製造装置用部材。 - 緻密質の本体部と、屈曲しながら前記本体部を厚み方向に貫通するガス流路部と、を有するプラグであって、
前記ガス流路部の全長のうちの少なくとも一部の区間が絶縁性かつ通気性の多孔質である、
プラグ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021016385A JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
TW110145429A TWI824350B (zh) | 2021-02-04 | 2021-12-06 | 半導體製造裝置用構件以及塞 |
US17/457,725 US20220246398A1 (en) | 2021-02-04 | 2021-12-06 | Semiconductor-manufacturing apparatus member and plug |
KR1020210178710A KR20220112664A (ko) | 2021-02-04 | 2021-12-14 | 반도체 제조 장치용 부재 및 플러그 |
CN202210096313.6A CN114864435A (zh) | 2021-02-04 | 2022-01-26 | 半导体制造装置用构件以及塞子 |
JP2023189249A JP2024009020A (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021016385A JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
Related Child Applications (1)
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JP2023189249A Division JP2024009020A (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Publications (2)
Publication Number | Publication Date |
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JP2022119338A JP2022119338A (ja) | 2022-08-17 |
JP7382978B2 true JP7382978B2 (ja) | 2023-11-17 |
Family
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JP2021016385A Active JP7382978B2 (ja) | 2021-02-04 | 2021-02-04 | 半導体製造装置用部材及びプラグ |
JP2023189249A Pending JP2024009020A (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
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JP2023189249A Pending JP2024009020A (ja) | 2021-02-04 | 2023-11-06 | 半導体製造装置用部材及びプラグ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220246398A1 (ja) |
JP (2) | JP7382978B2 (ja) |
KR (1) | KR20220112664A (ja) |
CN (1) | CN114864435A (ja) |
TW (1) | TWI824350B (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019519927A (ja) | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ガス孔に開口縮小プラグを有する大電力静電チャック |
JP2020057786A (ja) | 2018-09-28 | 2020-04-09 | 日本碍子株式会社 | 半導体製造装置用部材 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
US6108189A (en) * | 1996-04-26 | 2000-08-22 | Applied Materials, Inc. | Electrostatic chuck having improved gas conduits |
JP5633766B2 (ja) * | 2013-03-29 | 2014-12-03 | Toto株式会社 | 静電チャック |
US11227749B2 (en) | 2016-02-18 | 2022-01-18 | Lam Research Corporation | 3D printed plasma arrestor for an electrostatic chuck |
JP6634315B2 (ja) * | 2016-03-03 | 2020-01-22 | 日本特殊陶業株式会社 | 保持装置および保持装置の製造方法 |
JP6504532B1 (ja) * | 2018-03-14 | 2019-04-24 | Toto株式会社 | 静電チャック |
US11456161B2 (en) * | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
JP7002014B2 (ja) * | 2018-10-30 | 2022-01-20 | Toto株式会社 | 静電チャック |
JP7134104B2 (ja) * | 2019-01-09 | 2022-09-09 | 東京エレクトロン株式会社 | プラズマ処理装置およびプラズマ処理装置の載置台 |
US20200411355A1 (en) * | 2019-06-28 | 2020-12-31 | Applied Materials, Inc. | Apparatus for reduction or prevention of arcing in a substrate support |
-
2021
- 2021-02-04 JP JP2021016385A patent/JP7382978B2/ja active Active
- 2021-12-06 TW TW110145429A patent/TWI824350B/zh active
- 2021-12-06 US US17/457,725 patent/US20220246398A1/en active Pending
- 2021-12-14 KR KR1020210178710A patent/KR20220112664A/ko not_active Application Discontinuation
-
2022
- 2022-01-26 CN CN202210096313.6A patent/CN114864435A/zh active Pending
-
2023
- 2023-11-06 JP JP2023189249A patent/JP2024009020A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019519927A (ja) | 2016-06-07 | 2019-07-11 | アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated | ガス孔に開口縮小プラグを有する大電力静電チャック |
JP2020057786A (ja) | 2018-09-28 | 2020-04-09 | 日本碍子株式会社 | 半導体製造装置用部材 |
Also Published As
Publication number | Publication date |
---|---|
TWI824350B (zh) | 2023-12-01 |
KR20220112664A (ko) | 2022-08-11 |
TW202232628A (zh) | 2022-08-16 |
US20220246398A1 (en) | 2022-08-04 |
CN114864435A (zh) | 2022-08-05 |
JP2022119338A (ja) | 2022-08-17 |
JP2024009020A (ja) | 2024-01-19 |
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