JP2020021528A5 - - Google Patents
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- Publication number
- JP2020021528A5 JP2020021528A5 JP2018146518A JP2018146518A JP2020021528A5 JP 2020021528 A5 JP2020021528 A5 JP 2020021528A5 JP 2018146518 A JP2018146518 A JP 2018146518A JP 2018146518 A JP2018146518 A JP 2018146518A JP 2020021528 A5 JP2020021528 A5 JP 2020021528A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- monomer
- comparative example
- water
- acid group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 description 20
- 239000000178 monomer Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 10
- -1 hydrogen peroxide Chemical class 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 8
- 229920003169 water-soluble polymer Polymers 0.000 description 8
- 238000002474 experimental method Methods 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 125000002843 carboxylic acid group Chemical group 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000007870 radical polymerization initiator Substances 0.000 description 4
- 125000000542 sulfonic acid group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 125000003368 amide group Chemical group 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- DZSVIVLGBJKQAP-UHFFFAOYSA-N 1-(2-methyl-5-propan-2-ylcyclohex-2-en-1-yl)propan-1-one Chemical compound CCC(=O)C1CC(C(C)C)CC=C1C DZSVIVLGBJKQAP-UHFFFAOYSA-N 0.000 description 1
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SMBRHGJEDJVDOB-UHFFFAOYSA-N 2-methylpropanimidamide;dihydrochloride Chemical compound Cl.Cl.CC(C)C(N)=N SMBRHGJEDJVDOB-UHFFFAOYSA-N 0.000 description 1
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 description 1
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium peroxydisulfate Substances [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 1
- VAZSKTXWXKYQJF-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)OOS([O-])=O VAZSKTXWXKYQJF-UHFFFAOYSA-N 0.000 description 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexyloxide Natural products O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002432 hydroperoxides Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- JKUYRAMKJLMYLO-UHFFFAOYSA-N tert-butyl 3-oxobutanoate Chemical compound CC(=O)CC(=O)OC(C)(C)C JKUYRAMKJLMYLO-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018146518A JP7128685B2 (ja) | 2018-08-03 | 2018-08-03 | 磁気ディスク基板の研磨方法、および磁気ディスク基板用研磨剤組成物 |
TW108127248A TWI811415B (zh) | 2018-08-03 | 2019-07-31 | 磁碟基板之研磨方法及磁碟基板用研磨劑組成物 |
MYPI2019004368A MY195012A (en) | 2018-08-03 | 2019-07-31 | Method of polishing magnetic disk substrate, and polishing composition for magnetic disk substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018146518A JP7128685B2 (ja) | 2018-08-03 | 2018-08-03 | 磁気ディスク基板の研磨方法、および磁気ディスク基板用研磨剤組成物 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020021528A JP2020021528A (ja) | 2020-02-06 |
JP2020021528A5 true JP2020021528A5 (enrdf_load_stackoverflow) | 2021-08-19 |
JP7128685B2 JP7128685B2 (ja) | 2022-08-31 |
Family
ID=69589906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018146518A Active JP7128685B2 (ja) | 2018-08-03 | 2018-08-03 | 磁気ディスク基板の研磨方法、および磁気ディスク基板用研磨剤組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7128685B2 (enrdf_load_stackoverflow) |
MY (1) | MY195012A (enrdf_load_stackoverflow) |
TW (1) | TWI811415B (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7440326B2 (ja) * | 2020-04-01 | 2024-02-28 | 山口精研工業株式会社 | 研磨剤組成物 |
JP7492366B2 (ja) * | 2020-04-17 | 2024-05-29 | 山口精研工業株式会社 | 磁気ディスク基板用研磨剤組成物 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998021289A1 (fr) * | 1996-11-14 | 1998-05-22 | Kao Corporation | Composition abrasive utilisee dans la fabrication de la base d'un support d'enregistrement magnetique, et procede de fabrication de cette base a l'aide de cette composition |
JP5979871B2 (ja) | 2011-03-09 | 2016-08-31 | 花王株式会社 | 磁気ディスク基板の製造方法 |
JP2014032718A (ja) | 2012-08-01 | 2014-02-20 | Kao Corp | 磁気ディスク基板の製造方法 |
EP3425016B1 (en) * | 2016-02-29 | 2021-01-27 | Fujimi Incorporated | Polishing composition and polishing method using same |
-
2018
- 2018-08-03 JP JP2018146518A patent/JP7128685B2/ja active Active
-
2019
- 2019-07-31 TW TW108127248A patent/TWI811415B/zh not_active IP Right Cessation
- 2019-07-31 MY MYPI2019004368A patent/MY195012A/en unknown
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