JP2020017565A5 - - Google Patents

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Publication number
JP2020017565A5
JP2020017565A5 JP2018137722A JP2018137722A JP2020017565A5 JP 2020017565 A5 JP2020017565 A5 JP 2020017565A5 JP 2018137722 A JP2018137722 A JP 2018137722A JP 2018137722 A JP2018137722 A JP 2018137722A JP 2020017565 A5 JP2020017565 A5 JP 2020017565A5
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JP
Japan
Prior art keywords
period
amplitude
pulse
processing apparatus
plasma processing
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JP2018137722A
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English (en)
Japanese (ja)
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JP6976228B2 (ja
JP2020017565A (ja
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Priority claimed from JP2018137722A external-priority patent/JP6976228B2/ja
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Publication of JP2020017565A5 publication Critical patent/JP2020017565A5/ja
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JP2018137722A 2018-07-23 2018-07-23 プラズマ処理装置 Active JP6976228B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018137722A JP6976228B2 (ja) 2018-07-23 2018-07-23 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018137722A JP6976228B2 (ja) 2018-07-23 2018-07-23 プラズマ処理装置

Publications (3)

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JP2020017565A JP2020017565A (ja) 2020-01-30
JP2020017565A5 true JP2020017565A5 (enExample) 2020-08-06
JP6976228B2 JP6976228B2 (ja) 2021-12-08

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JP2018137722A Active JP6976228B2 (ja) 2018-07-23 2018-07-23 プラズマ処理装置

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JP (1) JP6976228B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7508790B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508791B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508788B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508794B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508789B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508793B2 (ja) * 2020-02-05 2024-07-02 株式会社三洋物産 遊技機
JP7508795B2 (ja) * 2020-02-06 2024-07-02 株式会社三洋物産 遊技機
KR20220027803A (ko) 2020-08-27 2022-03-08 주식회사 히타치하이테크 플라스마 처리 장치
KR20230133757A (ko) * 2021-02-05 2023-09-19 램 리써치 코포레이션 균일성을 달성하기 위한 듀티 사이클 제어
TW202308469A (zh) * 2021-06-08 2023-02-16 日商東京威力科創股份有限公司 電漿處理裝置及電漿處理方法
KR102812573B1 (ko) 2022-06-07 2025-05-26 주식회사 히타치하이테크 플라스마 처리 장치
KR20240168908A (ko) 2023-05-19 2024-12-02 주식회사 히타치하이테크 플라스마 처리 장치 및 플라스마 처리 방법

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100549901B1 (ko) * 1997-08-22 2006-02-06 동경 엘렉트론 주식회사 플라즈마 처리 장치의 제어 방법
US9123509B2 (en) * 2007-06-29 2015-09-01 Varian Semiconductor Equipment Associates, Inc. Techniques for plasma processing a substrate
JP6086631B2 (ja) * 2013-10-17 2017-03-01 株式会社日立国際電気 プラズマ生成用電源装置およびその制御方法

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