JP2020017565A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2020017565A5 JP2020017565A5 JP2018137722A JP2018137722A JP2020017565A5 JP 2020017565 A5 JP2020017565 A5 JP 2020017565A5 JP 2018137722 A JP2018137722 A JP 2018137722A JP 2018137722 A JP2018137722 A JP 2018137722A JP 2020017565 A5 JP2020017565 A5 JP 2020017565A5
- Authority
- JP
- Japan
- Prior art keywords
- period
- amplitude
- pulse
- processing apparatus
- plasma processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000051 modifying Effects 0.000 claims 3
- 210000002381 Plasma Anatomy 0.000 claims 1
Claims (5)
前記第１高周波電力をパルス変調するための第１パルスと前記第２高周波電力をパルス変調するための第２パルスを生成するパルス生成ユニットをさらに備え、
前記第１パルスは、オフ期間と第１期間と第２期間とを有し、
前記第１期間の振幅値は、有限の値であり、
前記第２期間の振幅は、前記第１期間の振幅より大きく、
前記第２パルスは、前記第２期間の間、オン期間となることを特徴とするプラズマ処理装置。 A processing chamber in which a sample is plasma-processed, a first high-frequency power source for supplying a first high-frequency power for generating plasma, a sample stage on which a sample is placed, and a second high-frequency power source for supplying the sample stage. In a plasma processing apparatus including a second high frequency power supply,
A pulse generation unit for generating a first pulse for pulse- modulating the first high-frequency power and a second pulse for pulse- modulating the second high-frequency power;
The first pulse has an off period, a first period, and a second period,
The amplitude value of the first period is a finite value,
The amplitude of the second period is larger than the amplitude of the first period,
It said second pulse, during the second period, the plasma processing apparatus characterized by comprising an on period.
前記第１期間は、第１振幅の期間である第１振幅期間と第２振幅の期間である第２振幅期間とを有し、
前記第１振幅は、前記第２振幅より小さいことを特徴とするプラズマ処理装置。 The plasma processing apparatus according to claim 1,
The first period has a first amplitude period which is a period of a first amplitude and a second amplitude period which is a period of a second amplitude,
The plasma processing apparatus is characterized in that the first amplitude is smaller than the second amplitude.
前記第１期間は、第１振幅の期間である第１振幅期間と第２振幅の期間である第２振幅期間とを有し、
前記第１振幅は、前記第２振幅より大きいことを特徴とするプラズマ処理装置。 The plasma processing apparatus according to claim 1,
The first period has a first amplitude period which is a period of a first amplitude and a second amplitude period which is a period of a second amplitude,
The plasma processing apparatus is characterized in that the first amplitude is larger than the second amplitude.
前記第１パルスは、所定の期間をさらに有し、
前記所定の期間は、前記第１パルスのオフ期間より前の期間であり、
前記第１期間は、前記第１パルスのオフ期間より後の期間であり、
前記所定の期間の振幅値は、有限の値であり、
前記第２期間の振幅は、前記所定の期間の振幅より大きいことを特徴とするプラズマ処理装置。 The plasma processing apparatus according to claim 1,
The first pulse further has a predetermined period,
The predetermined period is a period before the off period of the first pulse,
The first period is a period after the off period of the first pulse,
The amplitude value of the predetermined period is a finite value,
The plasma processing apparatus is characterized in that the amplitude of the second period is larger than the amplitude of the predetermined period.
前記パルス変調された第１高周波電力をモニタする検波器をさらに備え、
前記検波器は、少なくとも２つの検波器であることを特徴とするプラズマ処理装置。 The plasma processing apparatus according to any one of claims 1 to 4,
Further comprising a detector for monitoring the pulse- modulated first high-frequency power,
The detector is a plasma processing apparatus, characterized in that at least two detectors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018137722A JP6976228B2 (en) | 2018-07-23 | 2018-07-23 | Plasma processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018137722A JP6976228B2 (en) | 2018-07-23 | 2018-07-23 | Plasma processing equipment |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020017565A JP2020017565A (en) | 2020-01-30 |
| JP2020017565A5 true JP2020017565A5 (en) | 2020-08-06 |
| JP6976228B2 JP6976228B2 (en) | 2021-12-08 |
Family
ID=69580797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018137722A Active JP6976228B2 (en) | 2018-07-23 | 2018-07-23 | Plasma processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6976228B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220027803A (en) | 2020-08-27 | 2022-03-08 | 주식회사 히타치하이테크 | plasma processing unit |
| JPWO2022259868A1 (en) * | 2021-06-08 | 2022-12-15 | ||
| KR20230169925A (en) | 2022-06-07 | 2023-12-18 | 주식회사 히타치하이테크 | plasma processing device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100549901B1 (en) * | 1997-08-22 | 2006-02-06 | 동경 엘렉트론 주식회사 | Method for controlling plasma processor |
| US9123509B2 (en) * | 2007-06-29 | 2015-09-01 | Varian Semiconductor Equipment Associates, Inc. | Techniques for plasma processing a substrate |
| WO2015056509A1 (en) * | 2013-10-17 | 2015-04-23 | 株式会社日立国際電気 | Method for controlling plasma-generating power source device |
-
2018
- 2018-07-23 JP JP2018137722A patent/JP6976228B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2020004710A5 (en) | ||
| JP2020017565A5 (en) | ||
| JP2016092342A5 (en) | ||
| JP2014107363A5 (en) | ||
| JP2014239091A5 (en) | Plasma processing equipment | |
| JP2019004027A5 (en) | ||
| JP2018107304A5 (en) | ||
| JP2020025083A5 (en) | ||
| JP2019220435A5 (en) | ||
| JP2020507678A5 (en) | ||
| WO2017079774A3 (en) | Stereolithography apparatus comprising a cartridge device | |
| JP2015185698A5 (en) | ||
| JP2013171840A5 (en) | ||
| JP2015181143A5 (en) | Plasma etching method | |
| JP2019057547A5 (en) | ||
| WO2020102312A8 (en) | Method and apparatus for oncomagnetic treatment | |
| MX2022008271A (en) | System and method of generating high voltage variable frequency eletromagnetic radiation. | |
| TW201613421A (en) | Plasma processing apparatus and plasma processing method | |
| TW201613212A (en) | Laser processing device and output method of pulsed laser beam | |
| JP2015211139A5 (en) | ||
| JP2016072260A5 (en) | ||
| JP2014099336A5 (en) | ||
| JP2020061534A5 (en) | ||
| JP2015050362A5 (en) | ||
| JP2020177959A5 (en) | Cleaning method and plasma processing equipment |