JP2015095396A5 - - Google Patents

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Publication number
JP2015095396A5
JP2015095396A5 JP2013234871A JP2013234871A JP2015095396A5 JP 2015095396 A5 JP2015095396 A5 JP 2015095396A5 JP 2013234871 A JP2013234871 A JP 2013234871A JP 2013234871 A JP2013234871 A JP 2013234871A JP 2015095396 A5 JP2015095396 A5 JP 2015095396A5
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JP
Japan
Prior art keywords
substrate
voltage
electrode
substrate processing
applying
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JP2013234871A
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English (en)
Japanese (ja)
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JP2015095396A (ja
JP6401901B2 (ja
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Priority to JP2013234871A priority Critical patent/JP6401901B2/ja
Priority claimed from JP2013234871A external-priority patent/JP6401901B2/ja
Priority to KR1020140150004A priority patent/KR102332028B1/ko
Priority to US14/529,241 priority patent/US9530657B2/en
Priority to TW103139277A priority patent/TWI660421B/zh
Publication of JP2015095396A publication Critical patent/JP2015095396A/ja
Publication of JP2015095396A5 publication Critical patent/JP2015095396A5/ja
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Publication of JP6401901B2 publication Critical patent/JP6401901B2/ja
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JP2013234871A 2013-11-13 2013-11-13 基板処理方法及び基板処理装置 Active JP6401901B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013234871A JP6401901B2 (ja) 2013-11-13 2013-11-13 基板処理方法及び基板処理装置
KR1020140150004A KR102332028B1 (ko) 2013-11-13 2014-10-31 기판 처리 방법 및 기판 처리 장치
US14/529,241 US9530657B2 (en) 2013-11-13 2014-10-31 Method of processing substrate and substrate processing apparatus
TW103139277A TWI660421B (zh) 2013-11-13 2014-11-12 基板處理方法及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013234871A JP6401901B2 (ja) 2013-11-13 2013-11-13 基板処理方法及び基板処理装置

Publications (3)

Publication Number Publication Date
JP2015095396A JP2015095396A (ja) 2015-05-18
JP2015095396A5 true JP2015095396A5 (enExample) 2016-10-13
JP6401901B2 JP6401901B2 (ja) 2018-10-10

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JP2013234871A Active JP6401901B2 (ja) 2013-11-13 2013-11-13 基板処理方法及び基板処理装置

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US (1) US9530657B2 (enExample)
JP (1) JP6401901B2 (enExample)
KR (1) KR102332028B1 (enExample)
TW (1) TWI660421B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101842124B1 (ko) 2016-05-27 2018-03-27 세메스 주식회사 지지 유닛, 기판 처리 장치 및 기판 처리 방법
JP6789099B2 (ja) * 2016-12-26 2020-11-25 東京エレクトロン株式会社 計測方法、除電方法及びプラズマ処理装置
JP6739326B2 (ja) * 2016-12-27 2020-08-12 三菱電機株式会社 評価装置及び評価方法
US10950483B2 (en) * 2017-11-28 2021-03-16 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for fixed focus ring processing
KR20200130743A (ko) * 2018-04-04 2020-11-19 램 리써치 코포레이션 시일 표면을 갖는 정전 척
JP7020311B2 (ja) * 2018-06-14 2022-02-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP7169920B2 (ja) * 2019-03-26 2022-11-11 東京エレクトロン株式会社 静電吸着装置及び除電方法
KR102299888B1 (ko) * 2019-10-11 2021-09-08 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
TWI775083B (zh) * 2020-05-26 2022-08-21 毅力科技有限公司 真空壓膜系統及真空壓膜方法
JP7515327B2 (ja) 2020-07-13 2024-07-12 東京エレクトロン株式会社 基板離脱方法及びプラズマ処理装置
JP7578360B2 (ja) * 2020-12-22 2024-11-06 東京エレクトロン株式会社 除電方法及びプラズマ処理システム
US20250308967A1 (en) * 2024-03-26 2025-10-02 Applied Materials, Inc. Chucking sensor using floating esc power supplies

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW334609B (en) * 1996-09-19 1998-06-21 Hitachi Ltd Electrostatic chuck, method and device for processing sanyle use the same
JP4035225B2 (ja) * 1998-03-20 2008-01-16 株式会社日立製作所 プラズマ処理方法
JP4493863B2 (ja) * 2001-01-25 2010-06-30 東京エレクトロン株式会社 プラズマ処理装置およびそのクリーニング方法および静電チャックの除電方法
JP2003264224A (ja) * 2002-03-11 2003-09-19 Matsushita Electric Ind Co Ltd 真空処理装置
JP2006135081A (ja) * 2004-11-05 2006-05-25 Matsushita Electric Ind Co Ltd 基板処理方法及び基板処理装置
JP2006269556A (ja) * 2005-03-22 2006-10-05 Elpida Memory Inc プラズマ処理装置、及び半導体装置の製造方法
US7608544B2 (en) * 2006-05-25 2009-10-27 Tokyo Electron Limited Etching method and storage medium
JP4847909B2 (ja) * 2007-03-29 2011-12-28 東京エレクトロン株式会社 プラズマ処理方法及び装置
TW201005825A (en) * 2008-05-30 2010-02-01 Panasonic Corp Plasma processing apparatus and method
KR101125430B1 (ko) * 2009-09-04 2012-03-28 주식회사 디엠에스 피처리물의 디척킹과 함께 반응 챔버 내부 및 정전 척의 드라이 클리닝을 실행하는 플라즈마 반응기의 피처리물 디척킹 장치 및 방법
JP5973840B2 (ja) 2011-12-20 2016-08-23 東京エレクトロン株式会社 離脱制御方法及びプラズマ処理装置
JP5497091B2 (ja) * 2012-03-26 2014-05-21 東京エレクトロン株式会社 基板処理方法

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